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    MAGNESIUM ALLOY SHEET MATERIAL
    61.
    发明申请
    MAGNESIUM ALLOY SHEET MATERIAL 有权
    镁合金材料

    公开(公告)号：US20110003139A1

    公开(公告)日：2011-01-06

    申请号：US12864419

    申请日：2009-01-14

    Applicant: Masatada Numano ,  Nozomu Kawabe ,  Yukihiro Oishi ,  Nobuyuki Mori ,  Nobuyuki Okuda ,  Ryuichi Inoue

    Inventor： Masatada Numano ,  Nozomu Kawabe ,  Yukihiro Oishi ,  Nobuyuki Mori ,  Nobuyuki Okuda ,  Ryuichi Inoue

    IPC: B32B15/02 ,  B32B5/16

    CPC classification number: C22F1/06 ,  B22D11/007 ,  B22D19/04 ,  B22D21/007 ,  C22C23/02 ,  C22C32/0063 ,  Y10T428/25

    Abstract: The invention offers a magnesium alloy sheet material having excellent plastic processibility and rigidity and a magnesium alloy formed body having excellent rigidity. The sheet material has magnesium alloy that forms the matrix containing hard particles. The region from the surface of the sheet material to a position away from the surface by 40% of the thickness of the sheet material is defined as the surface region, and the remaining region as the center region. Hard particles existing in the center region have a maximum diameter of more than 20 μm and less than 50 μm, and hard particles existing in the surface region have a maximum diameter of 20 μm or less. Because the hard particles existing at the surface side are fine particles, they are less likely to become the starting point of cracking or another defect at the time of plastic processing. Because the hard particles existing in the center region are coarse, they can increase the rigidity of the sheet material.

    Abstract translation: 本发明提供具有优异的塑性加工性和刚性的镁合金板材和具有优异刚性的镁合金成形体。 片材具有形成含有硬质粒子的基体的镁合金。 从片材的表面到离开表面的位置的片材的厚度的40％的区域被定义为表面区域，其余区域被定义为中心区域。 存在于中心区域的硬质粒子的最大直径大于20μm且小于50μm，存在于表面区域的硬质粒子的最大直径为20μm以下。 由于存在于表面侧的硬质粒子是微细的粒子，因此在塑性加工时不太可能成为开裂的起点或其他缺陷。 由于存在于中心区域的硬质粒子较粗糙，因此能够提高片材的刚性。

    Member for Semiconductor Device and Production Method Thereof
    63.
    发明申请
    Member for Semiconductor Device and Production Method Thereof 失效
    半导体器件及其制作方法

    公开(公告)号：US20080122052A1

    公开(公告)日：2008-05-29

    申请号：US11795251

    申请日：2006-01-11

    Applicant: Akira Fukui

    Inventor： Akira Fukui

    IPC: H01L23/14 ,  C22C1/05 ,  B22F3/14 ,  B22F7/04

    CPC classification number: H01L23/15 ,  B22F7/04 ,  B22F2998/10 ,  B22F2999/00 ,  C22C1/1084 ,  C22C29/065 ,  C22C32/0063 ,  H01L21/563 ,  H01L23/3731 ,  H01L23/3735 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15311 ,  H01L2924/16152 ,  C22C1/051 ,  B22F3/02 ,  B22F3/14 ,  B22F3/18 ,  B22F1/0085 ,  H01L2924/00

    Abstract: A member for a semiconductor device of low price, capable of forming a high quality plating layer on a surface, having heat conductivity at high temperature (100° C.) of more than or equal to 180 W/m·K and toughness that will not cause breaking due to screwing, and will not cause solder breaking due to heat stress when it is bonded to other member with solder, and a production method thereof are provided. A member for a semiconductor device (1) having a coefficient of thermal expansion ranging from 6.5×10−6/K to 15×10−6/K inclusive, and heat conductivity at 100° C. of more than or equal to 180 W/m·K, has: a base material (11) formed of an aluminum-silicon carbide composite material starting from powder material in which particulate silicon carbide is dispersed in aluminum or aluminum alloy, and the content of the silicon carbide is from 30% by mass to 85% by mass inclusive; and a superficial layer (12) containing aluminum or aluminum alloy starting from a melt material bonded on top and bottom faces of the base material (11).

    Abstract translation: 低成本的半导体器件的构件，能够在表面形成高品质的镀层，在高温（100℃）下具有导热系数大于或等于180W / m·K的韧性，并且不会导致 由于旋转而导致的断裂，并且当与焊料结合到其它部件时不会由于热应力而导致焊料断裂，并且提供其制造方法。 一种半导体器件（1）的元件，其热膨胀系数为6.5×10 -6 / K至15×10 -6 / K，其热传导率为100 大于或等于180W / mK，具有：由碳化硅颗粒分散在铝或铝合金中的粉末材料形成的由碳化硅 - 碳化硅复合材料形成的基材（11），并且 碳化硅的含量为30质量％〜85质量％以下; 和从基体材料（11）的顶面和底面上的熔融材料开始的含有铝或铝合金的表面层（12）。

    Metal matrix composite material with high thermal conductivity and low coefficient of thermal expansion
    64.
    发明授权
    Metal matrix composite material with high thermal conductivity and low coefficient of thermal expansion 失效
    金属基复合材料具有高导热性和低热膨胀系数

    公开(公告)号：US07364692B1

    公开(公告)日：2008-04-29

    申请号：US11126517

    申请日：2005-05-09

    Applicant: Jonathan E. Spowart ,  Benji Maruyama ,  Daniel B. Miracle

    Inventor： Jonathan E. Spowart ,  Benji Maruyama ,  Daniel B. Miracle

    IPC: B22F3/12

    CPC classification number: B22F1/025 ,  B22F3/17 ,  B22F2009/043 ,  B22F2998/00 ,  C22C29/065 ,  C22C32/0063 ,  C25D3/02 ,  C23C20/02 ,  C23C16/00

    Abstract: Metal-matrix composites with combinations of physical and mechanical properties desirable for specific applications can be obtained by varying and controlling selected parameters in the material formation processes, particularly by increasing the microstructural homogeneity of the composite, while maintaining a constant mixture ratio or volume fraction. In one embodiment of the invention, a CuSiC composite having increased thermal conductivity is obtained by closely controlling the size of the SiC particles. In another embodiment of the invention, AlSiC composites which exhibit increased ultimate tensile and yield strengths are made by closely controlling the size of SiC and Al particles.

    Abstract translation: 通过改变和控制材料形成过程中选定的参数，特别是通过增加复合材料的显微结构均匀性，同时保持恒定的混合比或体积分数，可以获得具有特定应用所需的物理和机械性能组合的金属基复合材料。 在本发明的一个实施方案中，通过密切控制SiC颗粒的尺寸获得具有增加的导热性的CuSiC复合材料。 在本发明的另一个实施方案中，通过紧密地控制SiC和Al颗粒的尺寸来制备表现出增加的极限拉伸强度和屈服强度的AlSiC复合材料。

    Radiator member for electronic appliances and processes for producing the same
    65.
    发明授权
    Radiator member for electronic appliances and processes for producing the same 失效
    用于电子设备的散热器构件及其制造方法

    公开(公告)号：US07364632B2

    公开(公告)日：2008-04-29

    申请号：US10472802

    申请日：2002-03-14

    Applicant: Katsufumi Tanaka ,  Tomohei Sugiyama ,  Kyoichi Kinoshita ,  Eiji Kono ,  Naohisa Nishino

    Inventor： Katsufumi Tanaka ,  Tomohei Sugiyama ,  Kyoichi Kinoshita ,  Eiji Kono ,  Naohisa Nishino

    IPC: C22C21/00 ,  C22C29/02

    CPC classification number: C22C29/065 ,  B22F2999/00 ,  C22C1/1036 ,  C22C32/0063 ,  C22C2001/1073 ,  H01L23/3733 ,  H01L2924/0002 ,  Y10T428/12736 ,  B22F1/0014 ,  H01L2924/00

    Abstract: The present invention is a process for producing a radiator member for electronic appliances, and is characterized in that, in a process for producing a radiator member for electronic appliances, the radiator member comprising a composite material in which SiC particles are dispersed in a matrix metal whose major component is Al, it comprises a filling step of filling an SiC powder into a mold, a pre-heating step of pre-heating the mold after the filling step to a pre-heating temperature which falls in a range of from a melting point or more of said matrix metal to less than a reaction initiation temperature at which a molten metal of the matrix metal and SiC particles in the SiC powder start to react, and a pouring step of pouring the molten matrix metal whose molten-metal temperature falls in a range of from the melting point or more of the matrix metal to less than the reaction initiation temperature, into the mold after the pre-heating step, and impregnating the SiC powder with the molten metal by pressurizing.When the molten-metal temperature and the pre-heating temperature are from the melting point or more of the matrix metal to less than the reaction initiator temperature, it is possible to inhibit the generation of low thermal conductive materials while securing the impregnation of the molten metal into the SiC powder.

    Abstract translation: 本发明是一种电子电器用散热构件的制造方法，其特征在于，在电子电器用散热构件的制造方法中，散热构件包括SiC颗粒分散在基体金属中的复合材料 其主要成分是Al，其包括将SiC粉末填充到模具中的填充步骤，在填充步骤之后将模具预加热到预热温度的预热步骤，该预热温度落在熔化范围内 所述基体金属的一个或多个点小于SiC粉末中的基体金属和SiC颗粒的熔融金属开始反应的反应引发温度，以及将熔融金属温度下降的熔融基质金属倒出的倾倒步骤 在从基体金属的熔点以上到小于反应开始温度的范围内，在预热工序后进入模具，并将SiC粉末浸渍在 通过加压熔融金属。 当熔融金属温度和预热温度从基体金属的熔点或更高温度到小于反应引发剂温度时，可以在确保浸渍熔融金属的温度的同时，抑制低导热材料的产生 金属进入SiC粉末。

    Forming complex-shaped aluminum components
    68.
    发明授权
    Forming complex-shaped aluminum components 失效
    形成复杂形状的铝组件

    公开(公告)号：US06761852B2

    公开(公告)日：2004-07-13

    申请号：US10095272

    申请日：2002-03-11

    Applicant: Chee-Tian Yeo ,  Lye-King Tan

    Inventor： Chee-Tian Yeo ,  Lye-King Tan

    IPC: B22F322

    CPC classification number: C22C1/058 ,  B22F3/1003 ,  B22F3/1035 ,  B22F2998/00 ,  B22F2998/10 ,  B22F2999/00 ,  C22C32/0063 ,  C22C32/0089 ,  B22F1/0014 ,  B22F3/1025 ,  B22F3/225 ,  B22F3/1021

    Abstract: Although MIM (metal injection molding) has received widespread application, aluminum has not been widely used for MIM in the prior art because of the tough oxide layer that grows on aluminum particles, thus preventing metal—metal bonding between the particles. The present invention solves this problem by adding a small amount of material that forms a eutectic mixture with aluminum oxide, and therefore aids sintering, to reduce the oxide, thereby allowing intimate contact between aluminum surfaces. The process includes the ability to mold and then sinter the feedstock into the form of compacted items of intricate shapes, small sizes (if needed), and densities of about 95% of bulk.

    Abstract translation: 虽然MIM（金属注射成型）已经得到广泛应用，但是由于在铝颗粒上生长的韧性氧化物层，因此铝在现有技术中尚未广泛用于MIM，从而防止颗粒之间的金属 - 金属结合。 本发明通过添加少量与氧化铝形成共晶混合物的材料来解决该问题，因此有助于烧结以减少氧化物，从而允许铝表面之间的紧密接触。 该方法包括将原料模塑并随后烧结成复杂形状，小尺寸（如果需要）和压实体积约95％的压实物品的形式的能力。

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