公开(公告)号：US20160023399A1

公开(公告)日：2016-01-28

申请号：US14724898

申请日：2015-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghoon Lee ,  Dongouk Kim ,  Joonyong Park ,  Jihyun Bae ,  Bongsu Shin ,  Jaeseung Chung ,  Sukgyu Hahm ,  Jong G. Ok ,  Ilsun Yoon

IPC: B29C59/16

CPC classification number: B29C59/16 ,  B29C59/165 ,  B29C67/00 ,  B29C2045/0075 ,  G03F7/0002

Abstract: A method of forming a pattern by using an imprint process includes: forming an adhesion promoting layer only in a pattern formation region on a substrate; coating a resin to cover the substrate and the adhesion promoting layer; transferring a pattern of a stamp mold to the resin covering the substrate and the adhesion promoting layer, by pressing the stamp mold onto the resin; irradiating ultraviolet light onto the resin covering the substrate and the adhesion promoting layer, to cure the resin and form a pattern of the cured resin to correspond to the pattern of the stamp mold, on the substrate; and detaching the stamp mold from the substrate, to leave a portion of the cured resin pattern only on the adhesion promoting layer on the substrate and to remove a remaining portion of the cured resin pattern from the substrate.

Abstract translation: 通过使用压印工艺形成图案的方法包括：仅在基板上的图案形成区域中形成粘附促进层; 涂覆树脂以覆盖基材和粘合促进层; 通过将印模模压到树脂上，将印模的图案转印到覆盖基材和粘合促进层的树脂上; 在覆盖基材和粘合促进层的树脂上照射紫外光，固化树脂并在基材上形成对应于印模的图案的固化树脂的图案; 并将印模从基板上分离出来，将一部分固化的树脂图案仅留在基板上的粘合促进层上，并从基板上除去固化的树脂图案的剩余部分。