公开(公告)号：US10082328B2

公开(公告)日：2018-09-25

申请号：US14958328

申请日：2015-12-03

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong Jung ,  Deokhyun Youn

IPC: F25D23/06

CPC classification number: F25D23/061 ,  F25D23/062 ,  F25D23/065 ,  F25D23/067 ,  F25D2201/10 ,  F25D2201/14

Abstract: There is disclosed a refrigerator including an inner case that defines an exterior appearance of a storage space, with a communication hole formed therein, an outer case spaced apart a predetermined distance from the inner case, with a communication formed at a position corresponding to the communication hole of the inner case, a vacuum space provided between the inner case and the outer case, with being maintained vacuum, to insulate the inner case from the outer case, and a connection pipe passing through the vacuum space, to connect the communication hole of the inner case and the communication hole of the outer case with each other.

公开(公告)号：US12298063B2

公开(公告)日：2025-05-13

申请号：US18034868

申请日：2021-11-01

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong Jung ,  Deokhyun Youn ,  Duchan Ki

IPC: F16L59/065 ,  F25D23/02 ,  F25D23/06

Abstract: A vacuum adiabatic body according to an embodiment may include a first plate, a second plate, and a seal that seals a gap between the first plate and the second plate. Optionally, the vacuum adiabatic body according to an embodiment may include a support that maintains a vacuum space. Optionally, the vacuum adiabatic body according to an embodiment may include a heat transfer resistor that reduces an amount of heat transfer between the first plate and the second plate. Optionally, the vacuum adiabatic body may include a component coupling portion connected to at least one of the first or second plate so that a component is coupled thereto. Optionally, the vacuum adiabatic body may further include a side plate extending in a height direction of the vacuum space. Optionally, the first plate may be provided to be thinner than the second plate. Accordingly, the vacuum adiabatic body may be improved in productivity.

公开(公告)号：US12298061B2

公开(公告)日：2025-05-13

申请号：US18467091

申请日：2023-09-14

Applicant: LG Electronics Inc.

Inventor： Wonyeong Jung ,  Deokhyun Youn

IPC: F25D23/06

Abstract: A refrigerator including an inner case, an outer case, and a vacuum space provided between the inner case and the outer case to insulate the inner case from the outer case. The inner case defines an exterior appearance of a storage space, with a communication hole formed therein. The outer case is spaced apart a predetermined distance from the inner case, and a communication is formed at a position corresponding to the communication hole of the inner case. A connection pipe passes through the vacuum space to connect the communication hole of the inner case and the communication hole of the outer case with each other.

公开(公告)号：US12287142B2

公开(公告)日：2025-04-29

申请号：US18034934

申请日：2021-11-01

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong Jung ,  Deokhyun Youn ,  Sungsub Lee

IPC: F16L59/065 ,  B29C45/17 ,  F25D23/06 ,  B29K81/00 ,  B29K309/08 ,  B29L22/00

Abstract: A method for manufacturing a vacuum adiabatic body according to an embodiment may include a vacuum adiabatic body component preparation process of manufacturing components applied to a vacuum adiabatic body. Optionally, the method may include a vacuum adiabatic body component assembly process of assembling the components. Optionally, the method may include a vacuum adiabatic body component sealing process of sealing an outer wall of a vacuum space to block the vacuum space from the external space. Optionally, the method may include a vacuum exhaust process for a vacuum adiabatic body, in which internal air of a vacuum space is discharged. Optionally, the method may include a device assembling process of providing a device using the vacuum adiabatic body.

公开(公告)号：US12259178B2

公开(公告)日：2025-03-25

申请号：US18034971

申请日：2021-11-01

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong Jung ,  Deokhyun Youn ,  Jaehyun Bae

IPC: F25D23/06 ,  F25D23/02 ,  F16L59/065

Abstract: A vacuum adiabatic body according to an embodiment may include a first plate, a second plate, and a seal that seals a gap between the first plate and the second plate. Optionally, the vacuum adiabatic body according to an embodiment may include a support that maintains a vacuum space. Optionally, the vacuum adiabatic body according to an embodiment may include a heat transfer resistor that reduces an amount of heat transfer between the first plate and the second plate. Optionally, the vacuum adiabatic body may include a component coupling portion connected to at least one of the first or second plate so that a component is coupled thereto. Optionally, the vacuum adiabatic body may further include a side plate extending in a height direction of the vacuum space. Accordingly, the vacuum adiabatic body capable of achieving the industrial purpose may be provided.

公开(公告)号：US12253300B2

公开(公告)日：2025-03-18

申请号：US18034864

申请日：2021-11-01

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong Jung ,  Deokhyun Youn ,  Duchan Ki

IPC: F16L59/065 ,  F16L59/08 ,  F25D23/02 ,  F25D23/06

Abstract: A vacuum adiabatic body according to an embodiment may include a first plate, a second plate, and a seal that seals a gap between the first plate and the second plate. Optionally, the vacuum adiabatic body according to an embodiment may include a support that maintains a vacuum space. Optionally, the vacuum adiabatic body according to an embodiment may include a heat transfer resistor that reduces an amount of heat transfer between the first plate and the second plate. Optionally, the vacuum adiabatic body may include a component coupling portion connected to at least one of the first or second plate so that a component is coupled thereto. Accordingly, the vacuum adiabatic body may be improved in productivity.

公开(公告)号：US12253296B2

公开(公告)日：2025-03-18

申请号：US18415345

申请日：2024-01-17

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong Jung ,  Daewoong Kim ,  Hyeunsik Nam ,  Deokhyun Youn

IPC: F16L59/065 ,  F25D23/00 ,  F25D23/06 ,  F25D23/02 ,  F25D23/08

Abstract: A vacuum adiabatic body includes a heat exchange pipeline and a sealing assembly. The heat exchange pipeline includes at least two pipelines which pass through a first plate and a second plate to allow a refrigerant to move between inner and outer spaces. The sealing assembly allows the heat exchange pipeline to pass through the first plate and the second plate without contacting a vacuum space provided between the first and second plates.

公开(公告)号：US12247778B2

公开(公告)日：2025-03-11

申请号：US18034963

申请日：2021-11-01

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong Jung ,  Deokhyun Youn ,  Bongjin Kim ,  Jaehyun Bae

IPC: F16L59/065 ,  F25D23/06

Abstract: A vacuum adiabatic body of the present embodiment may include a first plate, a second plate, a seal configured to seal the first plate and the second plate to provide a vacuum space, and a support configured to maintain the vacuum space. Alternatively, the support may include a first support having a first support plate formed in a grid shape, and a plurality of spacer coupling portions configured to protrude from the first support plate. Alternatively, the support may include a second support having a second support plate formed in a grid shape, and a plurality of spacers protruding from the second support plate and coupled to each of the plurality of spacer coupling parts to form a plurality of bars together with the plurality of spacer coupling parts. Alternatively, the support may include a radiation resistance sheet supported by a portion of the plurality of bars and spaced apart from at least one of the first support plate and the second support plate. Alternatively, each of the support plates may include a plurality of through-holes. Alternatively, a plurality of distribution structures generated after injection molding the first and second supports and spaced apart from each other may be provided in some of the plurality of through-holes of each support plate.

公开(公告)号：US20250035369A1

公开(公告)日：2025-01-30

申请号：US18911421

申请日：2024-10-10

Applicant: LG ELECTRONICS INC.

Inventor： Wonyeong JUNG ,  Deokhyun Youn ,  Daewoong Kim

IPC: F25D23/06

Abstract: Provided is a vacuum adiabatic body. The vacuum adiabatic body includes a cover assembly configured to cover the conductive resistance sheet. The cover assembly includes an inner cover configured to protect an inside, an outer cover configured to protect an outside, and a front cover configured to a front side, and at least one of the inner cover or the outer cover extends toward the other end of at least one of the first plate or the second plate. According to the embodiments, an edge and a side surface of the vacuum adiabatic body may be protected together.

公开(公告)号：US12169094B2

公开(公告)日：2024-12-17

申请号：US17622497

申请日：2020-07-08

Applicant: LG ELECTRONICS INC.

Inventor： Bongjin Kim ,  Deokhyun Youn ,  Jangseok Lee

IPC: F25D23/06 ,  F25D23/08

Abstract: Provided is a vacuum adiabatic body. The vacuum adiabatic body includes a first plate configured to define at least a portion of a wall for a first space, a second plate configured to define at least a portion of a wall for a second space having a temperature different from that of the first space, a seal configured to seal the first plate and the second plate so as to provide a third space that has a temperature between a temperature of the first space and a temperature of the second space and is in a vacuum state, and a support configured to maintain the third space. Therefore, the vacuum adiabatic module that is thermally insulated with the vacuum, independently applied at various places, and conveniently used may be realized.