公开(公告)号：US3847757A

公开(公告)日：1974-11-12

申请号：US36654573

申请日：1973-06-04

Applicant: NAT STEEL CORP

Inventor： SMITH R

IPC: B01J49/00 ,  C25D21/22 ,  C23F13/00 ,  C01G37/00 ,  C23B5/16

CPC classification number: C25D21/22 ,  B01J49/08

Abstract: Chromium values are recovered from wash water following a chemical treatment step in electrotinplating lines in a process comprising treating in a cation exchange zone, treating in an anion exchange zone, regenerating the anion exchange zone, treating effluent from said regeneration in a cation exchange zone and passing effluent from the cation exchange zone to a storage zone, passing effluent from said regeneration to the storage zone without intermediate cation exchange treatment.

Abstract translation: 在电镀锡线中的化学处理步骤之后，在阳离子交换区中进行处理，在阴离子交换区中处理，再生阴离子交换区，在阳离子交换区中处理来自所述再生的流出物，以及 将流出物从阳离子交换区传递到储存区，将来自所述再生的流出物传递到储存区而不进行中间阳离子交换处理。

公开(公告)号：US3761381A

公开(公告)日：1973-09-25

申请号：US3761381D

申请日：1972-08-16

Applicant: YAGISHITA A

Inventor： YAGISHITA A

IPC: C01G37/00 ,  C02F1/04 ,  C02F9/00 ,  C25D21/20 ,  C25D21/22 ,  B01K3/00 ,  C02B1/42

CPC classification number: C25D21/22 ,  C01G37/003 ,  C02F1/048 ,  C02F2101/22 ,  C25D21/20 ,  Y10S204/13 ,  Y10S588/90

Abstract: IN A UNIT FOR RECLAIMING PLATING WASTES CONTAINING CHROMIC ACID AND THE LIKE, THE RINSE LIQUID, FROM ONE OF A PLURALITY OF WASH TUBS INTO WHICH PLATED ARTICLES ARE DIPPED SUCCESSIVELY TO RINSE OFF THE PLATING SOLUTION, IS CIRCULATED THROUGH AN ION EXCHANGE COLUMN, WHERE IT PASSES THROUGH A RESIN LAYER THAT REMOVES CHROMIC ACID AND OTHER IMPURITIES BEFORE THE LIQUID IS RETURNED TO THE WASH TUB. PERIODICALLY, OR WHEN THE RESIN BECOMES SATURATED WITH CHROMIC ACID, IT IS REGENERATED BY PUMPING A SOLUTION OF CAUSTIC SODA THROUGH THE EXCHANGE COLUMN, THUS PRODUCING A SODIUM CHROMATE SOLUTION TO WHICH BARIUM HYDROXIDE IS ADDED TO PRODUCE BARIUM CHROMATE, WHICH IS FILTERED OUT OF THE CASUTIC SODA SOLUTION BEFORE THE LATTER IS AGAIN USED FOR REGENERATION PURPOSES.

公开(公告)号：US3640331A

公开(公告)日：1972-02-08

申请号：US3640331D

申请日：1970-08-24

Applicant: AISABURO YAGISHITA

Inventor： YAGISHITA AISABURO

IPC: C01G37/14 ,  C02F1/04 ,  C02F9/00 ,  C25D21/18 ,  C25D21/20 ,  C25D21/22 ,  B01D1/00 ,  B01K3/00 ,  E03B ,  F16K49/00 ,  F16L53/00 ,  F17D

CPC classification number: C25D21/22 ,  C01G37/14 ,  C02F1/048 ,  C02F2101/22 ,  C02F2103/16 ,  C25D21/18 ,  C25D21/20 ,  Y10S203/17 ,  Y10S204/13 ,  Y10S210/913 ,  Y10S588/90 ,  Y10T137/6579 ,  Y10T137/87362

Abstract: In the reclaiming of plating wastes containing chromic acid and the like, the rinse liquid from the first of a plurality of washtubs into which plated articles are dipped successively to rinse off the plating solution, is sucked into a tower, heated by steam to concentrate it to plating strength, and then is returned to the plating tank. The plating solution is also pumped from the plating tank into the tower where it is heated and recirculated back to the plating tank to maintain the solution in the tank at an elevated temperature. Means is also provided to pump the rinse liquid directly from the first washtub to the plating tank, if the rinse liquid in said first tub does not require concentration to raise it to plating strength.

Abstract translation: 在回收含有铬酸等的电镀废弃物时，从连续浸渍电镀制品的多个洗衣盆中的第一个冲洗液冲洗掉电镀液，将其吸入塔中，通过蒸汽加热浓缩 电镀强度，然后返回镀槽。 电镀溶液也从镀槽泵入塔中，在塔中加热并再循环回镀槽，以将溶液保持在高温下。 如果第一桶中的冲洗液不需要浓缩以将其提高到电镀强度，则还提供了将冲洗液直接从第一洗涤桶泵送到镀槽的装置。

公开(公告)号：US10662545B2

公开(公告)日：2020-05-26

申请号：US15799903

申请日：2017-10-31

Applicant: Novellus Systems, Inc.

Inventor： Steven T. Mayer ,  Bryan L. Buckalew ,  Haiying Fu ,  Thomas Ponnuswamy ,  Hilton Diaz Camilo ,  Robert Rash ,  David W. Porter

IPC: C25D21/22 ,  C25D21/12 ,  C25D5/08 ,  C25D7/12 ,  C25D17/00

Abstract: Methods and apparatus for electroplating material onto a substrate are provided. In many cases the material is metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a porous ionically resistive plate positioned near the substrate, the plate having a plurality of interconnecting 3D channels and creating a cross flow manifold defined on the bottom by the plate, on the top by the substrate, and on the sides by a cross flow confinement ring. During plating, fluid enters the cross flow manifold both upward through channels in the plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet. These combined flow paths result in improved plating uniformity.

公开(公告)号：US20190292680A1

公开(公告)日：2019-09-26

申请号：US16438988

申请日：2019-06-12

Applicant: Henkel AG & Co. KGaA

Inventor： William G. Kozak ,  Eric C. Kuhns, Jr. ,  Klaus Lepa

IPC: C25D21/22 ,  C25D11/08 ,  C25D11/02 ,  B01D15/36 ,  B01D15/20 ,  B01J39/05 ,  B01J39/18 ,  B01J47/02 ,  B01J49/06 ,  B01J49/53

Abstract: A process and a system for cleaning excess aluminum from coating baths, e.g. anodization bath solutions, so that they can be reused in an effective manner is provided. The process comprises first passing a portion of the anodization bath solution having excess aluminum through a strong acid cation exchange column in a Na+ form, allowing the effluent to age thereby precipitating cryolite from the effluent; removing the precipitated cryolite from the effluent and then passing the effluent through a strong acid cation exchange column in the NH4+ form, in a preferred embodiment back through the first column, to restore NH4+ to the anodization bath solution and then adding the effluent back in to the anodization bath solution.

公开(公告)号：US09523155B2

公开(公告)日：2016-12-20

申请号：US14103395

申请日：2013-12-11

Applicant: Novellus Systems, Inc.

Inventor： Steven T. Mayer ,  Bryan L. Buckalew ,  Haiying Fu ,  Thomas Ponnuswamy ,  Hilton Diaz Camilo ,  Robert Rash ,  David W. Porter

IPC: C25D17/00 ,  C25D21/22 ,  G01N27/333 ,  C25D5/08 ,  C25D7/12 ,  C25D21/12

CPC classification number: C25D21/12 ,  C25D5/08 ,  C25D7/12 ,  C25D17/001 ,  C25D17/002

Abstract: The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold defined on the bottom by the channeled plate, on the top by the substrate, and on the sides by a cross flow confinement ring. During plating, fluid enters the cross flow manifold both upward through the channels in the channeled plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet. These combined flow paths result in improved plating uniformity.

Abstract translation: 本文的实施例涉及将一种或多种材料电镀到衬底上的方法和装置。 在许多情况下，材料是金属，并且衬底是半导体晶片，尽管实施例不限于此。 通常，这里的实施例利用位于基板附近的通道板，通过通道板在底部形成交叉流动歧管，顶部由衬底限定，并在侧面由横流限制环形成。 在电镀期间，流体通过通道板的通道向上穿过十字流量歧管，并横向穿过位于交叉流限制环一侧的横流侧入口。 流动路径在交叉流动歧管中组合并且在与横流入口相对的横向流出口处出口。 这些组合的流动路径导致改善的电镀均匀性。

公开(公告)号：US20130306483A1

公开(公告)日：2013-11-21

申请号：US13893940

申请日：2013-05-14

Applicant: EBARA CORPORATION

Inventor： Yuji ARAKI ,  Masashi SHIMOYAMA

IPC: C25D21/22 ,  C25D3/60

CPC classification number: C25D21/22 ,  C25D3/30 ,  C25D3/60 ,  C25D17/001 ,  C25D17/008 ,  C25D21/12 ,  C25D21/14

Abstract: A plating apparatus plates a substrate with Sn alloy to form an Sn alloy film on a surface of the substrate. The apparatus includes: a plating bath for retaining a plating solution therein, the substrate being immersed in the plating solution in a position opposite to an insoluble anode; a plating solution dialysis line for extracting the plating solution from the plating bath and returning the plating solution to the plating bath; a dialysis cell provided in the plating solution dialysis line and configured to remove a free acid from the plating solution by dialysis using an anion exchange membrane; a free acid concentration analyzer; and a controller for controlling a flow rate of the plating solution flowing through the plating solution dialysis line based on the concentration of the free acid measured by the free acid concentration analyzer.

Abstract translation: 电镀装置用Sn合金对基板进行平板化，在基板的表面形成Sn合金膜。 该装置包括：用于在其中保持电镀液的电镀液，将基板浸入电镀液中与不溶性阳极相反的位置; 电镀液透析线，用于从电镀液中提取电镀溶液并将电镀液返回镀浴; 设置在所述电镀液透析线中的透析池，其构造为通过使用阴离子交换膜透析从所述电镀液中除去游离酸; 游离酸浓度分析仪; 以及控制器，其基于由游离酸浓度分析仪测定的游离酸的浓度来控制流过电镀液透析线的电镀液的流量。

公开(公告)号：US08202431B2

公开(公告)日：2012-06-19

申请号：US11563335

申请日：2006-11-27

Applicant: Christoph Werner ,  Axel Fuhrmann ,  Andreas Möbius

Inventor： Christoph Werner ,  Axel Fuhrmann ,  Andreas Möbius

IPC: C25D21/22

CPC classification number: B01J47/026 ,  B01D15/00 ,  B01J20/26 ,  B01J20/261 ,  B01J2220/603 ,  C23C18/1617 ,  C25D21/22

Abstract: A method and apparatus involving at least two distinct adsorbent media for adsorptive removal of impurities from a metal deposition composition such as an electroless or electrolytic deposition composition.

Abstract translation: 涉及至少两种不同吸附剂介质的方法和装置，用于从诸如无电解或电解沉积组合物的金属沉积组合物中吸附去除杂质。

公开(公告)号：US20110210006A1

公开(公告)日：2011-09-01

申请号：US13123934

申请日：2009-11-17

Applicant: Serdar Turan Karagöl

Inventor： Serdar Turan Karagöl

IPC: C25D21/22 ,  C25D17/00 ,  C25D3/56

CPC classification number: C25D21/22 ,  C25D3/565

Abstract: The invention concerns a process which is used to plate functional layers of acidic or alkaline zinc or zinc alloy baths which contain nitrogenous organic additives, a soluble zinc salt and if necessary other metal salts selected from Fe, Ni, Co and Sn salts, where the bath composition for the regeneration is conveyed through an appropriate device having an ion exchanger resin to remove cyanide ions.

Abstract translation: 本发明涉及一种用于平板酸性或碱性锌或锌合​​金浴的功能层的方法，其中含有含氮有机添加剂，可溶性锌盐以及必要的其它选自Fe，Ni，Co和Sn盐的金属盐，其中 用于再生的浴组合物通过具有离子交换树脂的适当装置输送以除去氰离子。

公开(公告)号：US20050217995A1

公开(公告)日：2005-10-06

申请号：US11135687

申请日：2005-05-24

Applicant: Fred Reinhard

Inventor： Fred Reinhard

IPC: B01D61/48 ,  B01D61/52 ,  B01J47/08 ,  C02F1/00 ,  C02F1/28 ,  C02F1/42 ,  C02F1/44 ,  C02F1/469 ,  C23G1/36 ,  C25D21/22

CPC classification number: C02F1/4695 ,  B01D61/48 ,  B01D61/52 ,  B01J47/08 ,  C02F1/001 ,  C02F2101/20 ,  C02F2101/22 ,  C02F2201/46115 ,  C02F2201/4618 ,  Y10S210/912

Abstract: In one embodiment, a system comprises a filter and at least one electrodeionization (EDI) unit for chemical recovery. The filter is adapted to receive a fluid and to remove a selected chemical element or contaminant from the fluid. The EDI unit is coupled to the filter and adapted to recover a chemical element from the fluid and to separate the recovered chemical element from the fluid.