公开(公告)号：US4674236A

公开(公告)日：1987-06-23

申请号：US838584

申请日：1986-03-11

申请人： Hideo Kawakami ,  Shinichi Tazawa ,  Masami Endo ,  Masaharu Kinoshita

发明人： Hideo Kawakami ,  Shinichi Tazawa ,  Masami Endo ,  Masaharu Kinoshita

IPC分类号： B24B37/08 ,  B24B37/16 ,  B24B1/00

CPC分类号： B24B37/08 ,  B24B37/16 ,  B24B57/02

摘要： A polishing machine has an upper polishing plate and a lower polishing plate provided below the upper polishing plate. The upper polishing plate has slurry passages. Plugs for supplying slurry are detachably quick coupled to the slurry passages. A piece of polishing pad is bonded to the lower surface of the upper polishing plate. After a spent polishing pad has been removed and a fresh polishing pad has been attached to the lower surface of the upper polishing plate, a hole-cutter is downwardly inserted in each slurry passage until it pierces the fresh polishing pad, thus cutting a hole in the polishing pad.

摘要翻译： 抛光机具有设置在上抛光板下方的上抛光板和下抛光板。 上抛光板具有浆料通道。 用于供应浆料的塞子可拆卸地快速地联接到浆料通道。 一块抛光垫结合到上抛光板的下表面。 在抛光抛光垫已经被去除并且新的抛光垫已经附着到上抛光板的下表面之后，孔切割器向下插入每个浆料通道中，直到它刺穿新鲜的抛光垫，从而在 抛光垫。