公开(公告)号：US20150064832A1

公开(公告)日：2015-03-05

申请号：US14531820

申请日：2014-11-03

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Meng-Hsun Wan ,  Yi-Shin Chu ,  Szu-Ying Chen ,  Pao-Tung Chen ,  Jen-Cheng Liu ,  Dun-Nian Yaung

IPC: H01L27/146 ,  H01L31/0352 ,  H01L31/18

CPC classification number: H01L27/14632 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/14689 ,  H01L27/1469 ,  H01L31/022466 ,  H01L31/035218 ,  H01L31/03762 ,  H01L31/18 ,  H04N5/378

Abstract: A device includes an image sensor chip having formed therein an elevated photodiode, and a device chip underlying and bonded to the image sensor chip. The device chip has a read out circuit electrically connected to the elevated photodiode.