公开(公告)号：US20080155992A1

公开(公告)日：2008-07-03

申请号：US11618056

申请日：2006-12-29

Applicant: Marc Scott Hodes ,  Christopher D.W. Jones ,  Shankar Krishnan ,  Oana Malis

Inventor： Marc Scott Hodes ,  Christopher D.W. Jones ,  Shankar Krishnan ,  Oana Malis

IPC: F25B21/02

CPC classification number: F25B21/02 ,  F25B2500/01 ,  H01L23/38 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus includes a thermoelectric cooler having a first set of one or more metal electrodes, a second set of one or more metal electrodes, and one or more doped semiconductor members. Each member physically joins a corresponding one electrode of the first set to a corresponding one electrode of the second set. Each member has a cross-sectional area that increases along a path from the one metal electrode of the first set to the one metal electrode of the second set.

Abstract translation: 一种装置包括具有第一组一个或多个金属电极的热电冷却器，一个或多个金属电极的第二组和一个或多个掺杂的半导体部件。 每个构件将第一组的对应的一个电极物理地连接到第二组的对应的一个电极。 每个构件具有沿着从第一组的一个金属电极到第二组的一个金属电极的路径增加的横截面面积。