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公开(公告)号：US12238399B2
公开(公告)日：2025-02-25
申请号：US17717306
申请日：2022-04-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Wanjae Ju
Abstract: According to various embodiments, an electronic device may include: a housing, a plurality of cameras disposed on a surface of the housing, a light source disposed adjacent to at least one of the plurality of cameras on the surface of the housing, and a camera cover disposed on the housing, wherein the camera cover is disposed to cover at least a portion of the plurality of cameras and/or the light source. The camera cover may include a first light emitting area corresponding to the light source and configured to emit a part of light emitted from the light source to the outside, a first incident area corresponding to a first camera among the plurality of cameras and configured to allow and/or guide external light to be incident on the first camera, and at least one second light emitting area positioned closer to the first incident area than the first light emitting area, wherein the at least one second light emitting area is configured to emit another part of the light emitted from the light source to the outside.
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公开(公告)号：US12238364B2
公开(公告)日：2025-02-25
申请号：US18148279
申请日：2022-12-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yeongjune Choi , Jaein Kim
IPC: H04N21/431 , H04N21/845 , H04N21/8549
Abstract: An electronic device may include: a display; at least one processor operatively connected with the display; and a memory configured to store a plurality of contents and operatively connected with the at least one processor, and the memory may store instructions that, when being executed, cause the at least one processor to: acquire a plurality of contents related to a first category from the memory; classify the plurality of contents into one or more groups, based on context information of the plurality of contents; identify at least one first content corresponding to a designated type from the one or more groups; generate a highlight content by using the at least one first content; generate a teed including the highlighted content and the plurality of contents, based on the one or more groups; and arrange the highlight content on an upper end of the feed to output on the display.
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公开(公告)号：US12238181B2
公开(公告)日：2025-02-25
申请号：US18477394
申请日：2023-09-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Mahmoud Watfa , Lalith Kumar
IPC: H04L67/146 , H04L67/142 , H04W8/20
Abstract: The disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. Disclosed is a method of operating a user equipment (UE) operable to communicate with a telecommunication network, comprising the steps of: the UE sending to the telecommunication network a control plane service request (CPSR) message with cellular Internet of Things (CIoT) user data, associated with a protocol data unit (PDU) session; the UE receiving from the telecommunication network a SERVICE ACCEPT message, indicating that the PDU session is inactive in the network; and the UE verifying if the PDU session has an identity the same as an identity of the PDU session included in the CPSR message with CIoT user data and, if so then the UE determines that the CIoT user data was not successfully sent to the telecommunication network or to a final recipient.
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公开(公告)号：US12238041B2
公开(公告)日：2025-02-25
申请号：US18518229
申请日：2023-11-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yi Wang , Yingyang Li , Shichang Zhang
IPC: H04L5/00 , H04W72/20 , H04W74/0808
Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. Embodiments of the present invention provide a method for transmitting a signal, comprising: selecting a starting position of the signal from a set of candidate starting positions for transmitting the signal; determining a symbol mapping of the signal based on a selected starting position or a set of candidate starting positions of the signal; and transmitting the signal is based on the symbol mapping. The embodiment of the invention also provides a corresponding apparatus.
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公开(公告)号：US12237567B2
公开(公告)日：2025-02-25
申请号：US18067119
申请日：2022-12-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hojin Jung , Hyunsuk Kim , Kyungmoon Seol , Seongyong An , Hyoungtak Cho , Youngmin Ji , Jaebong Chun , Hochul Hwang
Abstract: According to various embodiments of the disclosure, an electronic device may include: a first housing, a second housing, a printed circuit board (PCB), and a wireless communication circuit, wherein the first housing may include a first surface and a second surface perpendicular to the first surface at a first edge, and a first conductive area, and the first conductive area may include a first portion of a first slit extending from a point on the first surface to the first edge, a third surface of the second housing may include a second conductive area, and the second conductive area may include a second slit, wherein, in a first state, at least a portion of the first portion of the first slit may overlap the second slit when viewed in a second direction perpendicular to the first surface of the first housing, and wherein the wireless communication circuit may be configured to transmit and/or receive a signal of a first frequency band based on an electrical path including the first portion.
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公开(公告)号：US12237439B2
公开(公告)日：2025-02-25
申请号：US17238163
申请日：2021-04-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Euijoon Yoon , Jongmyeong Kim , Jehong Oh , Seungmin Lee , Jungel Ryu
IPC: H01L33/18 , H01L25/075 , H01L33/24 , H01L33/32 , H01L33/62
Abstract: A display device with improved light-emitting efficiency is disclosed. The display device includes a plurality of pixels, a light emitting device provided in each of the pixels, the light emitting device having first and second surfaces which are opposite to each other, first and second electrodes electrically and respectively connected to the first and second surfaces of the light emitting device, and a metal oxide pattern interposed between the second surface of the light emitting device and the second electrode. The metal oxide pattern includes first and second regions. The first region encloses the second region, and the second region has a contact hole exposing at least a portion of the second surface. The second electrode is coupled to the second surface through the contact hole, and the first and second regions have crystalline phases different from each other.
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公开(公告)号：US12237383B2
公开(公告)日：2025-02-25
申请号：US17404078
申请日：2021-08-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dohee Kim , Gyeom Kim , Jinbum Kim , Jaemun Kim , Seunghun Lee
IPC: H01L29/417 , H01L27/088 , H01L29/78
Abstract: An integrated circuit (IC) device includes a fin-type active region extending in a first lateral direction on a substrate, a gate line extending in a second lateral direction on the fin-type active region, an insulating spacer covering a sidewall of the gate line, a source/drain region at a position adjacent to the gate line, a metal silicide film covering a top surface of the source/drain region, and a source/drain contact apart from the gate line with the insulating spacer therebetween in the first lateral direction. The source/drain contact includes a bottom contact segment being in contact with a top surface of the metal silicide film and an upper contact segment integrally connected to the bottom contact segment. A width of the bottom contact segment is greater than a width of at least a portion of the upper contact segment in the first lateral direction.
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公开(公告)号：US12237357B2
公开(公告)日：2025-02-25
申请号：US17154421
申请日：2021-01-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ji-Won Lee , Jeong-Jin Cho , Moo-Sup Lim , Sung-Young Seo , Hae-Won Lee
IPC: H01L27/146 , H04N25/77
Abstract: This disclosure relates to image sensors and electronic apparatuses including the same. An image sensor including: a pixel area including shared pixels, wherein each of the shared pixels includes at least two photodiodes that form a group and share a floating diffusion (FD) area; and a transistor (TR) area adjacent to the pixel area, wherein the TR area includes transistor sets corresponding to the shared pixels, wherein, when a first shared pixel and a second shared pixel are arranged adjacent to each other in a first direction, a first TR set corresponding to the first shared pixel and a second TR set corresponding to the second shared pixel share a source region of a first selection TR.
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公开(公告)号：US12237309B2
公开(公告)日：2025-02-25
申请号：US18605573
申请日：2024-03-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Myung Kee Chung , Hyun Soo Chung , Tae Won Yoo
IPC: H01L25/00 , H01L25/065
Abstract: A semiconductor package including a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, and a third semiconductor chip disposed on the second semiconductor chip. A first pad is disposed on a top surface of the second semiconductor chip, and includes a first portion and a second portion protruding in a vertical direction from the first portion. A width of the first portion in a first horizontal direction is greater than a width of the second portion in the first horizontal direction. A second pad is disposed on a bottom surface of the third semiconductor chip facing the top surface of the second semiconductor chip, and a solder ball is disposed as surrounding a sidewall of the second portion of the first pad between the first pad and the second pad.
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公开(公告)号：US12237256B2
公开(公告)日：2025-02-25
申请号：US18183062
申请日：2023-03-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyoung Lim Suk , Keung Beum Kim , Dongkyu Kim , Minjung Kim , Seokhyun Lee
IPC: H01L23/48 , H01L21/48 , H01L23/498 , H01L23/538 , H01L25/10 , H01L23/00 , H01L25/065 , H01L25/18
Abstract: A semiconductor package includes a redistribution substrate and a semiconductor chip thereon. The redistribution substrate includes a ground under-bump pattern, signal under-bump patterns laterally spaced apart from the ground under-bump pattern, first signal line patterns disposed on the signal under-bump patterns and coupled to corresponding signal under-bump patterns, and a first ground pattern coupled to the ground under-bump pattern and laterally spaced apart from the first signal line pattern. Each of the signal and ground under-bump patterns includes a first part and a second part formed on the first part and that is wider than the first part. The second part of the ground under-bump pattern is wider than the second part of the signal under-bump pattern. The ground under-bump pattern vertically overlaps the first signal line patterns. The first ground pattern does not vertically overlap the signal under-bump patterns.
