公开(公告)号：US07436059B1

公开(公告)日：2008-10-14

申请号：US11601527

申请日：2006-11-17

申请人： Chien Ouyang

发明人： Chien Ouyang

IPC分类号： H01L23/34

CPC分类号： H01L23/38 ,  F25B2321/021 ,  H01L23/34 ,  H01L35/30 ,  H01L2924/0002 ,  H01L2924/00

摘要： In various embodiments, a TEC device array may be coupled to a chip and a heat sink to cool the chip. The TEC device array may include multiple TEC devices separately controlled to provide different cooling rates at different points in the TEC device array coupled to the chip. In some embodiments, temperature data for areas on the chip or for separate electronic components may be determined using one or more thermal sensors and then sent to a controller. The controller may then determine an appropriate response for the TEC devices in the TEC device array near the area of the thermal sensor(s). The controller may thus control the cooling rates (which may be different) of several TEC devices in the TEC device array.

摘要翻译： 在各种实施例中，TEC器件阵列可以耦合到芯片和散热器以冷却芯片。 TEC设备阵列可以包括分别控制的多个TEC设备，以在耦合到芯片的TEC设备阵列中的不同点提供不同的冷却速率。 在一些实施例中，可以使用一个或多个热传感器来确定芯片上的区域或单独的电子部件的温度数据，然后发送到控制器。 然后，控制器可以确定在热传感器的区域附近的TEC设备阵列中的TEC设备的适当响应。 因此，控制器可以控制TEC设备阵列中的几个TEC设备的冷却速率（可能不同）。

公开(公告)号：US07362575B2

公开(公告)日：2008-04-22

申请号：US11487771

申请日：2006-07-17

申请人： Chien Ouyang

发明人： Chien Ouyang

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/3732 ,  H01L2224/73253 ,  H01L2924/16152

摘要： An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid; at least one configurable diamond pin; at least one heat pipe; and a heat sink structure. At least one diamond pin is configured to displace junction temperature on a hot spot location of the microprocessor. The heat sink structure and at least one heat pipe are configured atop the second thermal interface material layer. In a method of cooling a microprocessor including a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid, the method includes disposing at least one configurable diamond pin at a hot spot location of the microprocessor; and configuring a heat sink structure and at least one heat pipe atop the second thermal interface material layer.

公开(公告)号：US20080036076A1

公开(公告)日：2008-02-14

申请号：US11502696

申请日：2006-08-11

申请人： Chien Ouyang

发明人： Chien Ouyang

IPC分类号： H01L23/34

CPC分类号： H01L23/34 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for cooling a semiconductor including passive cooling including transferring heat via passive cooling components; active cooling including transferring heat via active cooling components; and controlling the active cooling based on temperature of the semiconductor. A cooling system for a semiconductor including: a passive component in thermal contact with the semiconductor; an active cooling component in thermal contact with the semiconductor; and a controller controlling the active cooling component.

摘要翻译： 一种用于冷却包括被动冷却的半导体的方法，包括经由被动冷却部件传递热量; 主动冷却包括通过主动冷却组件传递热量; 并且基于半导体的温度来控制主动冷却。 一种用于半导体的冷却系统，包括：与半导体热接触的无源部件; 与半导体热接触的主动冷却部件; 以及控制主动冷却部件的控制器。

公开(公告)号：US20080013281A1

公开(公告)日：2008-01-17

申请号：US11487771

申请日：2006-07-17

申请人： Chien Ouyang

发明人： Chien Ouyang

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/3732 ,  H01L2224/73253 ,  H01L2924/16152

摘要： An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid; at least one configurable diamond pin; at least one heat pipe; and a heat sink structure. At least one diamond pin is configured to displace junction temperature on a hot spot location of the microprocessor. The heat sink structure and at least one heat pipe are configured atop the second thermal interface material layer. In a method of cooling a microprocessor including a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid, the method includes disposing at least one configurable diamond pin at a hot spot location of the microprocessor; and configuring a heat sink structure and at least one heat pipe atop the second thermal interface material layer.

摘要翻译： 用于冷却微处理器的装置包括第一热界面材料层; 封装第一热界面材料层和微处理器的盖子; 施加到所述盖的顶部的第二热界面材料层; 至少一个可配置的金刚石销; 至少一个热管; 和散热器结构。 至少一个金刚石销被配置成移动微处理器的热点位置处的结温。 散热器结构和至少一个热管构造在第二热界面材料层顶上。 一种冷却包括第一热界面材料层的微处理器的方法; 封装第一热界面材料层和微处理器的盖子; 施加到所述盖的顶部的第二热界面材料层，所述方法包括在所述微处理器的热点位置处布置至少一个可配置的金刚石针; 以及在所述第二热界面材料层的顶部配置散热结构和至少一个热管。

公开(公告)号：US07295435B2

公开(公告)日：2007-11-13

申请号：US11225356

申请日：2005-09-13

申请人： Chien Ouyang

发明人： Chien Ouyang

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink uses a ferrofluid-based pump assembly for controlling the direction of nanofluid flow within the heat sink. The nanofluid is thermally conductive and absorbs heat from a heat source, which is then directed away from the heat source by the ferrofluid-based pump assembly. The ferrofluid-based pump assembly uses a motor to rotate at least one magnet so as to rotate ferrofluid contained in the ferrofluid-based pump assembly. The direction of nanofluid flow within the heat sink is dependent on the movement of ferrofluid in the ferrofluid-based pump assembly.

摘要翻译： 散热器使用基于铁磁流体的泵组件来控制散热器内的纳流体流动的方向。 纳米流体是导热的并且吸收来自热源的热量，然后热源通过基于铁磁流体的泵组件被引导离开热源。 基于铁磁流体的泵组件使用电动机来旋转至少一个磁体，以便旋转容纳在基于铁磁流体的泵组件中的铁磁流体。 散热片内的纳流体流动方向取决于铁磁流体泵组件中铁磁流体的运动。

公开(公告)号：US20070139889A1

公开(公告)日：2007-06-21

申请号：US11313388

申请日：2005-12-21

申请人： Chien Ouyang

发明人： Chien Ouyang

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink operatively connected to an integrated circuit is configured to generate a magnetic field. Fluid flow toward and away from a hot spot of the integrated circuit is dependent on the magnetic field and an induced electrical current. A temperature sensor is used to take temperature measurements of the hot spot. A value of the induced electrical current is adjusted dependent on one or more temperature measurements taken by the temperature sensor.

摘要翻译： 可操作地连接到集成电路的散热器被配置为产生磁场。 朝向和远离集成电路的热点的流体流动取决于磁场和感应电流。 温度传感器用于对热点进行温度测量。 感应电流的值根据温度传感器所采取的一个或多个温度测量值进行调整。

公开(公告)号：US20070139881A1

公开(公告)日：2007-06-21

申请号：US11346014

申请日：2006-02-02

申请人： Chien Ouyang

发明人： Chien Ouyang

IPC分类号： H05K7/20

CPC分类号： F28F13/16 ,  F28D15/00 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink has a heat spreader structure containing magneto-hydrodynamic fluid. Also, the heat spreader includes a central metallic cylinder and a metal ring screen surrounding the central metallic cylinder. Electrical and magnetic fields induce the magneto-hydrodynamic fluid to undergo a swirling motion. The swirling motion acts as an MHD pump and provides efficient heat dissipation from a heat source contacting the heat spreader. A heat sink spreader has a central metallic cylinder surrounded by a metallic ring screen, and a magneto-hydrodynamic fluid. A method of cooling the heat sink spreader includes electrically charging the central metallic cylinder and oppositely electrically charging the metallic ring screen to create an electric potential between the central metallic cylinder and the metallic ring screen; creating a magnetic field inside the heat sink spreader; and swirling the magneto-hydrodynamic fluid to cool a heat source, wherein the swirling motion is induced by the electric potential and the magnetic fields.

摘要翻译： 散热器具有包含磁流体动力流体的散热器结构。 此外，散热器包括中央金属圆筒和围绕中心金属圆筒的金属环形屏。 电磁场引起磁流体动力学流体发生旋转运动。 旋转运动作为MHD泵，并从与散热器接触的热源提供有效的散热。 散热器撒布机具有由金属环形屏幕和磁流体动力流体包围的中心金属圆筒。 冷却散热器的方法包括对中央金属圆筒进行充电，并相反地对金属环形屏幕进行充电，以在中心金属圆筒和金属环形屏之间产生电位; 在散热器吊具内部产生磁场; 并旋转磁流体动力流体以冷却热源，其中旋转运动由电势和磁场引起。

公开(公告)号：US20070139880A1

公开(公告)日：2007-06-21

申请号：US11345762

申请日：2006-02-02

申请人： Chien Ouyang

发明人： Chien Ouyang

IPC分类号： H05K7/20

CPC分类号： F28F13/16 ,  F28D15/00 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling apparatus includes a heat pipe base covering a heat source; a heat sink with a plurality of heat sink fins; a plurality of heat pipes connecting the heat pipe base and the heat sink; and a magneto-hydrodynamic (MHD) pump assembly connected to the heat sink. In a method for cooling a heat source with heat pipes, magneto-hydrodynamic (MHD) fluid pipes, and a heat sink, the method includes transmitting heat from evaporating ends of the heat pipes connected to a heat source to condensing ends of the heat pipes connected to the heat sink; and circulating MHD fluid inside the MHD fluid pipes embedded in the heat sink to dissipate heat. In a method for cooling a heat sink connected to a plurality of heat pipes and containing a plurality of MHD fluid pipes, the method includes generating a plurality of magnetic fields using an array of magnets; creating an electric potential from a top surface to a bottom surface of each MHD fluid pipe using a plurality of metal films; and inducing electrically-conductive MHD fluid to circulate in the plurality of MHD fluid pipes by the plurality of magnetic fields and the electric potential.

摘要翻译： 冷却装置包括覆盖热源的热管基座; 具有多个散热鳍片的散热器; 连接热管基座和散热器的多个热管; 以及连接到散热器的磁流体动力（MHD）泵组件。 在使用热管，磁流体动力学（MHD）流体管和散热器来冷却热源的方法中，该方法包括将与热源连接的热管的蒸发端的热量传递到热管的冷凝端 连接到散热器; 并在嵌入散热器内的MHD流体管内循环MHD流体以散热。 在一种用于冷却连接到多个热管并且包含多个MHD流体管的散热器的方法中，所述方法包括使用磁体阵列产生多个磁场; 使用多个金属膜从每个MHD流体管的顶表面到底表面产生电势; 并且通过所述多个磁场和所述电势使所述多个MHD流体管中的导电MHD流体循环。

公开(公告)号：US20070089866A1

公开(公告)日：2007-04-26

申请号：US11255743

申请日：2005-10-21

申请人： Chien Ouyang

发明人： Chien Ouyang

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  F28D15/00 ,  F28D2021/0029 ,  F28F13/16 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink uses thermally conductive ferrofluid to cool an integrated circuit. A direction of flow of the ferrofluid in the heat sink is controlled by a motorized pump assembly. The motorized pump assembly uses a motor to rotate a metal plate to which at least one magnet is connected. The direction of flow of the ferrofluid is dependent on a magnetic field induced between the at least one magnet and at least one magnetic particle in the ferrofluid passing through the motorized pump assembly.

摘要翻译： 散热片使用导热铁磁流体来冷却集成电路。 散热片上的铁磁流体的流动方向由电动泵组件控制。 电动泵组件使用电动机来旋转至少一个磁体连接到的金属板。 铁磁流体的流动方向取决于通过电动泵组件的铁磁流体中的至少一个磁体与至少一个磁性颗粒之间引起的磁场。

公开(公告)号：US20070053152A1

公开(公告)日：2007-03-08

申请号：US11219964

申请日：2005-09-06

申请人： Chien Ouyang

发明人： Chien Ouyang

IPC分类号： G06F1/20

CPC分类号： G06F1/20 ,  G06F2200/201 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink uses a pump assembly to generate a magnetic field. A direction of electrically and thermally conductive liquid flowing through the pump assembly is dependent on an orientation of the magnetic field and/or the direction of electrical current induced across flowing fluid in the magnetic field. In such a manner, cool liquid may be directed toward a heat source and warmer liquid may be directed to flow away from the heat source, where heat transfer occurs between the liquid and the heat sink. Additional pump assemblies that generate separate magnetic fields may be used to increase fluid flow volume, thereby increasing heat transfer away from the heat source.

摘要翻译： 散热器使用泵组件来产生磁场。 流经泵组件的导电和导热液体的方向取决于磁场的取向和/或在磁场中流过流体的电流方向。 以这种方式，冷却液体可以指向热源，并且较暖的液体可以被引导以远离热源流动，其中在液体和散热器之间发生热传递。 可以使用产生单独磁场的附加泵组件来增加流体流量，从而增加远离热源的热传递。