公开(公告)号：US10394275B2

公开(公告)日：2019-08-27

申请号：US15254095

申请日：2016-09-01

Applicant: LENOVO (SINGAPORE) PTE. LTD.

Inventor： Fumitake Mizoguchi ,  Takehito Yamauchi ,  Tatsuya Ushioda ,  Keita Ishikawa

IPC: B32B3/24 ,  G06F1/16 ,  B32B3/26

Abstract: A member for chassis capable of achieving high strength is disclosed. The member for chassis is used for a chassis making up a lid of an electronic device in which the lid and the body are coupled with each other openably/closably via a hinge. The member for chassis has a configuration in which a frame formed of thermoplastic resin is joined with at least a part of an outside end face of a laminated plate including an intermediate layer disposed between a pair of fiber-reinforced resin plates, wherein the thermoplastic resin extends to a surface of the laminated plate and a nut serving as a female thread part is provided in the thermoplastic resin extending to the surface of the laminated plate.

公开(公告)号：US20140254071A1

公开(公告)日：2014-09-11

申请号：US13786679

申请日：2013-03-06

Applicant: LENOVO (SINGAPORE) PTE LTD.

Inventor： Akinori Uchino ,  Tetsuya Ohtani ,  Masahiro Kitamura ,  Tatsuya Ushioda

IPC: H05K5/02 ,  B23P19/00

CPC classification number: H05K5/0008 ,  G06F1/181 ,  Y10T29/49826

Abstract: Devices and methods are provided for connecting device cover components. In general, the devices and methods can allow first and second covers of an electronic device to be connected together at a plurality of attachment points without any gap space between the first and second covers at the attachment points. In an exemplary embodiment, an electronic device can include a housing that has first and second covers attached to one another at a plurality of attachment points. The first cover can be formed from a first material, and the second cover can be formed from a second, different material. The first material can be a softer material than the second material, which can allow the second cover to penetrate into and deform the first cover during manufacturing of the housing such that no gap space is present between the first and second covers at each of the attachment points.

Abstract translation: 提供了用于连接设备盖组件的设备和方法。 通常，装置和方法可允许电子装置的第一和第二盖在多个连接点处连接在一起，而在连接点处第一和第二盖之间没有间隙。 在示例性实施例中，电子设备可以包括具有在多个附接点处彼此附接的第一和第二盖的壳体。 第一盖可以由第一材料形成，并且第二盖可以由第二不同的材料形成。 第一材料可以是比第二材料更软的材料，这可以允许第二盖在制造壳体期间穿透第一盖并使其变形，使得在每个附件处的第一和第二盖之间不存在间隙空间 积分