公开(公告)号：US07024090B2

公开(公告)日：2006-04-04

申请号：US10492281

申请日：2002-09-26

Applicant: Arden Jeantilus ,  David W. Sherrer

Inventor： Arden Jeantilus ,  David W. Sherrer

IPC: G02B6/00

CPC classification number: G02B6/3656 ,  G02B6/3644 ,  G02B6/3664 ,  G02B6/3672 ,  G02B6/3692

Abstract: A fiber optic array (90) is provided having fibers (24) positioned at a selected angle relative to the output face of the array. The array includes first (20) and second (30) substrates each of which has a plurality of fiber passageways extending therethrough. The substrates are positioned relative to one another such that each passageway (22) of the first substrate is registered to a respective passageway (32) of the second substrate. An optical fiber is disposed in each pair of registered passageways. The passageways are dimensioned to permit the optical fiber disposed therein to be positioned at a range of angles relative to the output face of the array. The first and second substrates are moved relative to one another to select an angle from the range of angles at which the fibers are oriented relative to the output face of the array. A method for fabricating such a fiber optic array is also provided.

Abstract translation: 提供光纤阵列（90），其具有相对于阵列的输出面定位成选定角度的光纤（24）。 阵列包括第一（20）和第二（30）个基板，每个基板具有穿过其延伸的多个光纤通道。 衬底相对于彼此定位，使得第一衬底的每个通道（22）与第二衬底的相应通道（32）配准。 光纤布置在每对注册通道中。 通道的尺寸被设计成允许布置在其中的光纤相对于阵列的输出面定位在一定范围内。 第一和第二基板相对于彼此移动以从纤维相对于阵列的输出面定向的角度范围中选择一个角度。 还提供了一种制造这种光纤阵列的方法。

公开(公告)号：US07012489B2

公开(公告)日：2006-03-14

申请号：US10793574

申请日：2004-03-04

Applicant: David W. Sherrer ,  John J. Fisher

Inventor： David W. Sherrer ,  John J. Fisher

IPC: H01P3/06

CPC classification number: H01P3/06 ,  H01P1/08 ,  H01P3/00 ,  H01P5/103 ,  H01P5/183 ,  H01P11/002 ,  H01P11/003 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0272 ,  H05K3/4644 ,  H05K3/4685 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49123

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract translation: 提供同轴波导微结构。 微结构包括设置在衬底上方的衬底和同轴波导。 同轴波导包括：中心导体; 包括一个或多个壁的外导体，与中心导体间隔开并设置在中心导体周围; 一个或多个电介质支撑构件，用于支撑与中心导体接触并封闭在外部导体内的中心导体; 以及中心导体和外部导体之间的芯体积，其中芯体积处​​于真空状态或气体状态。 还提供了通过顺序构建工艺形成同轴波导微结构的方法和包括同轴波导微结构的密封封装。

公开(公告)号：US06883977B2

公开(公告)日：2005-04-26

申请号：US10013084

申请日：2001-12-10

Applicant: Mindaugas F. Dautartas ,  David W. Sherrer ,  Neal Ricks ,  Dan A. Steinberg

Inventor： Mindaugas F. Dautartas ,  David W. Sherrer ,  Neal Ricks ,  Dan A. Steinberg

IPC: G02B6/42 ,  H05K3/34 ,  G02B6/36

CPC classification number: G02B6/4201 ,  G02B6/423 ,  G02B6/4232 ,  H05K3/3436

Abstract: An optical device package includes a substrate; an optical fiber, a frame, and optionally a lid and an optical semiconductor component. The upper surface of the frame includes conductive visa extending vertically to solder balls on its upper surface. Conductive traces along the surface of the substrate provide electrical communication between the optical semiconductor component and the frame. The optical device package is adapted for flip-chip type mounting to a circuit board or other mounting surface.

Abstract translation: 光学器件封装包括衬底; 光纤，框架，以及可选的盖子和光学半导体部件。 框架的上表面包括在其上表面上与焊球垂直延伸的导电签证。 沿着衬底表面的导电迹线提供光学半导体部件和框架之间的电连通。 光学器件封装适于倒装芯片类型安装到电路板或其他安装表面。

公开(公告)号：US06847764B2

公开(公告)日：2005-01-25

申请号：US09835863

申请日：2001-04-16

Applicant: Dan A. Steinberg ,  David W. Sherrer

Inventor： Dan A. Steinberg ,  David W. Sherrer

IPC: G02B6/30 ,  G02B6/36 ,  G02B6/38 ,  G02B6/42 ,  G02B6/26

CPC classification number: G02B6/30 ,  G02B6/3882 ,  G02B6/3885 ,  G02B6/4231

Abstract: An optical interconnect includes a waveguide holder having a first side and a second side. The first side has a first depression and the second side has a second depression. The waveguide holder has an opening in which a plurality of waveguides are disposed.

Abstract translation: 光学互连包括具有第一侧和第二侧的波导保持器。 第一侧具有第一凹陷，第二侧具有第二凹陷。 波导保持器具有设置多个波导的开口。

公开(公告)号：US06842552B1

公开(公告)日：2005-01-11

申请号：US10356663

申请日：2003-01-31

Applicant: Dan A. Steinberg ,  John J. Fisher ,  David W. Sherrer ,  Mindaugas F. Dautartas ,  William T. Stacy

Inventor： Dan A. Steinberg ,  John J. Fisher ,  David W. Sherrer ,  Mindaugas F. Dautartas ,  William T. Stacy

IPC: G02B6/35 ,  G02B6/38 ,  G02B6/26 ,  G02B6/42

CPC classification number: G02B6/3506 ,  G02B6/3508 ,  G02B6/3546 ,  G02B6/3582 ,  G02B6/3834 ,  G02B6/3839 ,  G02B6/3841 ,  G02B6/3882

Abstract: The present invention provides an optical switch. The switch includes a substrate and a first waveguide holding member. The switch also includes a second waveguide holding member disposed over the substrate and movable relative to the first waveguide holding member to provide a switching function. A movement guiding member is provided for guiding the movement of the second waveguide holding member. A registration element is disposed at the movement guiding member for positioning the second waveguide holding member at a selected location relative to the first waveguide holding member. The selected location is one that provides alignment between a selected waveguide of the first waveguide holding member and a selected waveguide of the second waveguide holding member.

Abstract translation: 本发明提供一种光开关。 开关包括基板和第一波导保持构件。 开关还包括设置在基板上并且可相对于第一波导保持构件移动以提供开关功能的第二波导保持构件。 移动引导构件用于引导第二波导保持构件的运动。 一个配准元件设置在运动引导构件上，用于将第二波导保持构件相对于第一波导保持构件定位在选定位置。 所选择的位置是提供第一波导保持构件的选定波导与第二波导保持构件的选定波导之间的对准的位置。

公开(公告)号：US06819858B2

公开(公告)日：2004-11-16

申请号：US10037971

申请日：2001-10-24

Applicant: Dan A. Steinberg ,  David W. Sherrer ,  Mindaugas F. Daurtartas ,  Robert G. Schinazi

Inventor： Dan A. Steinberg ,  David W. Sherrer ,  Mindaugas F. Daurtartas ,  Robert G. Schinazi

IPC: G02B636

CPC classification number: G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/3865 ,  G02B6/3885 ,  G02B6/3887

Abstract: A molded mount of non-crystalline polymer material is configured to have a channel for retaining a silicon chip having a plurality of juxtaposed V-groove formed in a top surface between right and left side portions, thereof, a recessed area being provided in the channel behind the chip for accommodating fiber buffer coating, and a notch being formed in a top portion of the mount between the channel and one side portion thereof, for retaining strengthening fibers of an optical fiber cable, with the V-groove being configured to receive individual optical fibers therein respectively. Two such molded mounts with silicon chips are securely sandwiched together with V-groove of the chips opposing one another to retain optical fibers therebetween.

Abstract translation: 非结晶聚合物材料的成型安装件被配置为具有用于保持形成在其左右侧部分之间的上表面中的多个并置的V形槽的硅芯片的通道，设置在通道中的凹陷区域 在用于容纳纤维缓冲涂层的芯片后面，以及在通道和其一个侧部之间的安装件的顶部形成有用于保持光纤电缆的强化纤维的凹口，其中V形槽被配置为接收单独的 光纤。 两个这样的具有硅芯片的模制安装座与彼此相对的芯片的V形槽牢固地夹在一起，以在其间保持光纤。

公开(公告)号：US06811853B1

公开(公告)日：2004-11-02

申请号：US09519165

申请日：2000-03-06

Applicant: David W. Sherrer ,  Gregory A. TenEyck

Inventor： David W. Sherrer ,  Gregory A. TenEyck

IPC: B32B324

CPC classification number: B81C1/00396 ,  B81B2201/047 ,  B81B2203/033 ,  B81B2207/07 ,  G02B6/4202 ,  Y10T29/49895 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24479 ,  Y10T428/2457 ,  Y10T428/24917 ,  Y10T428/31678

Abstract: A method for patterning different types of surface features on a semiconductor substrate (e.g. metal pads, etched pits and grooves) where the features are accurately located by a single mask. First, a dielectric layer is formed on the substrate. Next, an etch-resistant metal layer is formed on the dielectric and patterned according to a mask. Then, a patterned resist mask (e.g. PMMA) is formed on the patterned metal so that areas of the dielectric are exposed. The resist mask has edges that lie on top of the patterned metal layer. Therefore, the exposed dielectric areas are bounded by patterned metal. Then, the dielectric layer is etched using a directional dry etch to expose the underlying semiconductor substrate. Then, the semiconductor substrate is etched. The dielectric layer functions as a mask in the substrate etching step. Since the metal pattern determines the areas of the substrate that are etched, all the features are located according to the original mask that defined the metal pattern. Subsequent masking steps can expose other areas of the substrate to different etching or deposition processes.

Abstract translation: 在通过单个掩模精确地定位特征的半导体衬底（例如金属焊盘，蚀刻凹坑和凹槽）上图案化不同类型的表面特征的方法。 首先，在基板上形成电介质层。 接下来，在电介质上形成耐蚀刻金属层，并根据掩模进行图案化。 然后，在图案化金属上形成图案化的抗蚀剂掩模（例如PMMA），使得电介质的区域露出。 抗蚀剂掩模具有位于图案化金属层顶部的边缘。 因此，暴露的电介质区域由图案化的金属界定。 然后，使用定向干蚀刻来蚀刻电介质层以暴露下面的半导体衬底。 然后，蚀刻半导体衬底。 电介质层在衬底蚀刻步骤中用作掩模。 由于金属图案确定被蚀刻的基底的区域，所有的特征根据限定金属图案的原始掩模而定位。 随后的掩模步骤可以将衬底的其它区域暴露于不同的蚀刻或沉积工艺。

公开(公告)号：US06786649B2

公开(公告)日：2004-09-07

申请号：US09851376

申请日：2001-05-09

Applicant: David W. Sherrer

Inventor： David W. Sherrer

IPC: G02B636

CPC classification number: G02B6/3838 ,  G02B6/3839

Abstract: A waveguide carrier is located within a carrier tube, and an optical waveguide extends lengthwise in a longitudinal direction within the waveguide carrier. The waveguide carrier is made up of a first carrier body having a first principal surface and a second carrier body having a second principal surface which confronts the first principal surface. The first principal surface has a first groove which extends lengthwise in the longitudinal direction, and the second principal surface has a second groove which extends lengthwise in the longitudinal direction. The first and second grooves are aligned with one another to define an elongate cavity which extends lengthwise in the longitudinal direction, and the optical waveguide is contained within the elongate cavity. The first and second carrier bodies may be fabricated by etching of one or more surfaces of a silicon wafer.

Abstract translation: 波导载体位于载体管内，光波导在波导载体内沿纵向纵向延伸。 波导载体由具有第一主表面的第一载体和具有与第一主表面相对的第二主表面的第二载体构成。 第一主表面具有沿纵向方向纵向延伸的第一凹槽，并且第二主表面具有在纵向方向上纵向延伸的第二凹槽。 第一和第二槽彼此对准以限定在纵向方向上纵向延伸的细长空腔，并且光波导包含在细长空腔内。 可以通过蚀刻硅晶片的一个或多个表面来制造第一和第二载体主体。

公开(公告)号：US06595700B2

公开(公告)日：2003-07-22

申请号：US09824205

申请日：2001-04-03

Applicant: Dan A. Steinberg ,  David W. Sherrer

Inventor： Dan A. Steinberg ,  David W. Sherrer

IPC: G02B642

CPC classification number: G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4214 ,  G02B6/4216 ,  G02B6/4228 ,  G02B6/423 ,  G02B6/4231 ,  G02B6/4239 ,  G02B6/4249

Abstract: Optoelectronic packages comprising insulation layers, such as SiO2, are made by aligning one or more optical, surface emitting or detecting devices with one or more optical fiber arrays. The insulation layers electrically insulates the surface device from a base substrate. Additionally, the layer acts as an etch stop helping to ensure that etched pits, used to retain surface devices, are etched at a depth which provides for an acceptable device-to-optical fiber spacing.

Abstract translation: 通过将一个或多个光学，表面发射或检测装置与一个或多个光纤阵列对准，制成包括诸如SiO 2的绝缘层的光电封装。 绝缘层将表面器件与基底基板电绝缘。 此外，该层用作蚀刻停止件，有助于确保用于保持表面器件的蚀刻凹坑在提供可接受的器件到光纤间隔的深度处被蚀刻。

公开(公告)号：US06215946B1

公开(公告)日：2001-04-10

申请号：US09526922

申请日：2000-03-16

Applicant: David W. Sherrer

Inventor： David W. Sherrer

IPC: G02B600

CPC classification number: G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/3812 ,  G02B6/3839 ,  G02B6/3861

Abstract: A V-groove chip for fiber arrays having a wick stop trench. The wick stop trench intersects the V-grooves and is deeper than the V-grooves. The wick stop trench prevents adhesive from moving via capillary action along the entire length of a V-groove. This is very useful for manufacturing V-groove fiber arrays because often it is desirable to adhesive the fiber to the V-groove chip in multiple gluing steps. For example, two gluing steps are beneficial if rotational alignment of the fiber (e.g., for polarization maintaining fiber arrays) is desired. Also, if longitudinal alignment of the fiber is desired, two gluing steps are beneficial. Two gluing steps allows the front and rear portions of the optical fiber to be secured independently, thereby improving precision in fiber placement.

Abstract translation: 用于具有芯阻止沟槽的光纤阵列的V形槽芯片。 吸芯停止沟槽与V形槽相交，并且比V形槽更深。 芯吸槽防止粘合剂沿着V形槽的整个长度通过毛细管作用移动。 这对于制造V沟槽光纤阵列非常有用，因为通常需要在多个胶合步骤中将光纤粘合到V沟槽芯片。 例如，如果需要光纤的旋转对准（例如，用于偏振维持光纤阵列），则两个胶合步骤是有益的。 此外，如果需要光纤的纵向对准，则两个胶合步骤是有益的。 两个胶合步骤允许独立地固定光纤的前部和后部，从而提高光纤放置的精度。