公开(公告)号：US20050094223A1

公开(公告)日：2005-05-05

申请号：US10982683

申请日：2004-11-04

Applicant: Hai-Tao Ma

Inventor： Hai-Tao Ma

IPC: H04N1/024 ,  H04N1/04

CPC classification number: H04N1/024 ,  H04N2201/02414 ,  H04N2201/02429 ,  H04N2201/02447 ,  H04N2201/02449

Abstract: A scanning apparatus having an adjusting means is provided to allow the optical scanning module against the platen. The adjusting means is assembled with the carriage that carries the optical scanning module. The adjusting means at least comprises a roller and a rotated portion, wherein the roller tightly contacts the rotated portion. When the carriage is moving (during a scanning operation), the roller is rotating and friction (between the roller and the rotating assembly) causes the rotated portion to turn until contacting with the bottom surface of the optical scanning module, thereby allowing the optical scanning module against the platen.

Abstract translation: 具有调整装置的扫描装置被设置成允许光学扫描模块抵靠压板。 调整装置与携带光学扫描模块的托架组装在一起。 调节装置至少包括辊和旋转部分，其中辊紧密地接触旋转部分。 当滑架移动时（在扫描操作期间），滚轮正在旋转并且摩擦（在滚子和旋转组件之间）导致旋转部分转动直到与光学扫描模块的底面接触，从而允许光学扫描 模块抵靠压板。

公开(公告)号：US06265705B1

公开(公告)日：2001-07-24

申请号：US09290216

申请日：1999-04-13

Applicant: Richard Lynn Gardner, Jr.

Inventor： Richard Lynn Gardner, Jr.

IPC: H01J4014

CPC classification number: H04N1/03 ,  H04N2201/02414 ,  H04N2201/02429 ,  H04N2201/02431 ,  H04N2201/02447 ,  H04N2201/02449

Abstract: Disclosed herein is an improved imaging system of the type having a photosensor package and at least one optical component, e.g, a lens, mounted within an optical assembly housing. The photosensor package may be mounted to a substrate, such as a printed circuit board, in a conventional manner. The substrate, however, may be formed having a shorter length than the photosensor package. This shorter length causes the ends of the photosensor package to extend beyond the substrate and, thus, be exposed. The exposed ends of the photosensor package, in turn, allow the photosensor package to be directly referenced to reference surfaces formed on the optical assembly housing.

Abstract translation: 本文公开了一种改进的成像系统，其具有安装在光学组件外壳内的光电传感器封装和至少一个光学部件，例如透镜。 光传感器封装可以以常规方式安装到基板，例如印刷电路板。 然而，衬底可以形成为具有比光电传感器封装短的长度。 这个较短的长度使得光电传感器封装的端部延伸超过衬底并因此被暴露。 光电传感器封装件的暴露的端部又使得光电传感器封装件直接参考到形成在光学组件壳体上的参考表面。