BACKLIGHT MODULE AND DISPLAY DEVICE
    31.
    发明公开

    公开(公告)号:US20240012285A1

    公开(公告)日:2024-01-11

    申请号:US17311420

    申请日:2021-05-19

    CPC classification number: G02F1/133605 G02F1/133612 G02F1/133606

    Abstract: A backlight module and a display device are provided. The backlight module includes a light-emitting substrate and a reflective film layer disposed on a light-exiting surface of the light-emitting substrate. The light-emitting substrate includes a base substrate and light-emitting elements and light-scattering members disposed on one same surface of the base substrate. The reflective film layer includes a plurality of light-exiting holes for light passing through. A part of the light emitted by the light-emitting elements is reflected to the light-scattering members by the reflective film layer and is scattered by the light-scattering members. Therefore, light intensity of regions between the light-emitting elements is enhanced.

    BACKLIGHT MODULE AND DISPLAY DEVICE

    公开(公告)号:US20230023817A1

    公开(公告)日:2023-01-26

    申请号:US17600312

    申请日:2021-08-18

    Abstract: The present application discloses a backlight module and a display device. The backlight module includes a substrate and a light guide layer, the substrate has a plurality of light sources; the light guide layer is a patterned structure, and the patterned structure can change a light transmittance of the light guide layer from directly above the light sources to gaps between the light sources. The display device includes the backlight module.

    SURFACE LIGHT SOURCE CHIP AND LIGHT EMITTING DIODE THEREOF

    公开(公告)号:US20210336086A1

    公开(公告)日:2021-10-28

    申请号:US16485434

    申请日:2019-04-23

    Inventor: Yong YANG

    Abstract: A surface light source and a light emitting diode thereof are provided. The surface light source chip includes a sapphire substrate, an N-type GaN buffer layer under the sapphire substrate, and a chip positive electrode area and a chip negative electrode area formed under the N-type GaN buffer layer, wherein the chip positive electrode area includes an N-type GaN layer, a multiple quantum well (MQW) emitting layer, an omni-directional reflector (ODR) layer and a chip positive electrode from top to bottom sequentially, and the chip negative electrode area includes a chip negative electrode. The light emitting diode includes the surface light source chips mentioned above.

    FLIP CHIP, SURFACE LIGHT SOURCE, AND DISPLAY DEVICE USING SURFACE LIGHT SOURCE THEREOF

    公开(公告)号:US20210242378A1

    公开(公告)日:2021-08-05

    申请号:US16972620

    申请日:2018-11-01

    Inventor: Yong YANG

    Abstract: A flip chip, a surface light source, and a display device using the surface light source are described. The flip chip comprises a metal grid layer having metal wire grid polarizers which are arranged in parallel; a wafer substrate arranged under the metal wire grid polarizer of the metal grid layer; a N-doped layer and a negative-electrode wire, wherein the N-doped layer and the negative-electrode wire are arranged under the wafer substrate; a quantum well layer arranged under the N-doped layer; a P-doped layer arranged under the quantum well layer; an optical activity material layer arranged under the P-doped layer; a reflecting layer arranged under the optical activity material layer; and a positive-electrode wire arranged under the reflecting layer. The present disclosure improves the light-emitting efficiency of the surface light source in large-angle direction and the visual angle range of the surface light source is expanded.

    DIE-BONDING METHOD AND SPRAYING DEVICE FOR LED

    公开(公告)号:US20210217924A1

    公开(公告)日:2021-07-15

    申请号:US16638480

    申请日:2019-06-17

    Inventor: Yong YANG

    Abstract: A die-bonding method and a spraying device for an LED include: providing a substrate provided with a pad and a white oil layer covering wiring, placing a steel mesh on the substrate, and then spraying suspension containing solder paste on the pad by the spraying device, to form a solder paste film layer. Finally, a reflow process for the solder is performed. The solder paste is prepared on the pad by spraying, so that a crystal wafer is prevented from being tilted or short-circuited due to pulling or dragging of the solder paste during the reflow process for the solder, thereby improving uneven brightness of the surface light source.

    Display Panel and Display Device
    37.
    发明申请

    公开(公告)号:US20210116755A1

    公开(公告)日:2021-04-22

    申请号:US16652429

    申请日:2019-11-14

    Inventor: Yong YANG

    Abstract: A display panel and a display device are provided by this disclosure. The display panel comprises an imaging area and a main display area surrounding the imaging area, wherein the imaging area comprises a LED lamp plate, a light controlling layer disposed on the LED lamp plate, a diffusion layer disposed on the LED lamp plate, a liquid crystal structural layer disposed on the light controlling layer, and a groove extending from the LED lamp plate to a surface of the liquid crystal structural layer close to the diffusion layer.

    BACKLIGHT MODULE
    38.
    发明申请

    公开(公告)号:US20210080785A1

    公开(公告)日:2021-03-18

    申请号:US16630486

    申请日:2019-11-13

    Inventor: Yong YANG

    Abstract: The present disclosure discloses a backlight module. The present disclosure reduces a luminance of a chip at a positive viewing angle by using a semi-transmissive membrane layer in a mini-LED structure, and increases the luminous intensity between chips, thereby improving uniformity of light-mixing of an entire surface structure of the mini-LED, such that a backlight module of an ultra-thin liquid crystal display panel is prepared.

    DOUBLE-SIDED DISPLAY DEVICE AND DISPLAY MODULE THEREOF

    公开(公告)号:US20190384112A1

    公开(公告)日:2019-12-19

    申请号:US15745058

    申请日:2017-12-05

    Abstract: The disclosure provides a double-sided display device and a display module thereof, the display module includes a backlight module, a first display surface, and a second display surface. The first display surface is a liquid crystal display panel, the backlight module is disposed between the first display surface and the second display surface, the backlight module includes a transparent substrate, a light source, and an optical film set, the light source is disposed on a surface of the transparent substrate facing the optical film set, and the optical film set is located between the light source and the first display surface. The display module proposed in the disclosure uses the backlight module as a light source of the first display surface and the second display surface so as to realize double-sided display characteristics of the liquid crystal display module and enhance the user experience.

    A NANOIMPRINT TEMPLATE, A METHOD OF MAKING THE SAME AND APPLICATIONS THEREOF

    公开(公告)号:US20190227429A1

    公开(公告)日:2019-07-25

    申请号:US15579441

    申请日:2017-11-21

    Abstract: A nanoimprint template is provided, including a main template, a plurality of photoresist micro-structures arranged on the main template, and a fluororubber polymer layer coated on an outer layer of the photoresist micro-structures. The fluororubber polymer layer has a bonding function with the main template, so as to fixedly connect to the surface of the main template. The nanoimprint template can not only protect the photoresist microstructure therein, but also prevent the nanoimprint template from being deformed during operating, thereby improving the process quality. Moreover, the surface oil resistance and corrosion resistance of the nanoimprint template is improved, so that the surface has lower surface energy, which can effectively improve the degumming problem during operating. A manufacturing method of the nanoimprint template and the application thereof in manufacturing a microstructure substrate are also provided, the microstructure size and shape of the formed microstructure substrate can be ensured.

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