公开(公告)号：US10277979B2

公开(公告)日：2019-04-30

申请号：US15159693

申请日：2016-05-19

申请人： Knowles Electronics, LLC

发明人： Vahid Naderyan ,  Wade Conklin ,  Michael Kuntzman ,  Sung Lee

IPC分类号： H04R1/28 ,  H04R23/00 ,  H04R19/00 ,  H04R1/22 ,  H04R19/04

摘要： Systems and apparatuses for a MEMS device. The MEMS device includes a diaphragm and a backplate spaced a distance from the diaphragm forming an air gap therebetween. The backplate includes a first surface facing toward the diaphragm and an opposing second surface facing away from the diaphragm. The first surface and the opposing second surface of the backplate cooperatively define a plurality of through-holes that extend through the backplate allowing air from the air gap to flow therethrough. Each of the plurality of through-holes include a first aperture disposed along the first surface, a second aperture disposed along the opposing second surface, and a sidewall extending between the first surface and the opposing second surface. The first aperture and the second aperture have different dimensions.