公开(公告)号：US07173820B2

公开(公告)日：2007-02-06

申请号：US11404169

申请日：2006-04-14

Applicant: James R. Fink ,  John H. Bean, Jr. ,  Stephen F. Held ,  Richard J. Johnson ,  Rollie R. Johnson

Inventor： James R. Fink ,  John H. Bean, Jr. ,  Stephen F. Held ,  Richard J. Johnson ,  Rollie R. Johnson

IPC: H05K7/20

CPC classification number: H05K7/20 ,  H05K7/20745 ,  H05K7/2079

Abstract: A modular data center, for housing and cooling electronic equipment, includes multiple housings, a first portion of the housings configured to hold heat-producing electronic equipment and a second portion of the housings configured to hold at least one cooling unit, each of the housings of the first portion having a front and a back and configured to hold the heat-producing electronic equipment such that gas is drawn into the equipment from fronts of the equipment, heated by the equipment to become heated gas, and expelled by the electronic equipment is expelled through the backs of the housings, where the housings are disposed and coupled to form a laterally-enclosed arrangement laterally enclosing a hot region and defining a top opening allowing gas to vertically exit the hot region, and where backs of the housings of the first portion are disposed adjacent to the hot region such that the heat-producing equipment, when mounted to the housings, will expel the heated gas into the hot region.

Abstract translation: 用于壳体和冷却电子设备的模块化数据中心包括多个壳体，壳体的第一部分被配置为保持发热电子设备，并且壳体的第二部分被构造成保持至少一个冷却单元，每个壳体 所述第一部分具有前部和后部并且构造成保持所述发热电子设备，使得气体从所述设备的前部被吸入所述设备中，由所述设备加热以变成加热气体并被所述电子设备排出 通过壳体的后部排出，其中壳体被设置和联接以形成横向封闭的布置，横向封闭热区域并限定允许气体垂直离开热区域的顶部开口，并且第一 所述发热设备在安装在所述壳体上时将被排出的热气体 egion。

公开(公告)号：US07046514B2

公开(公告)日：2006-05-16

申请号：US10863740

申请日：2004-06-07

Applicant: James R. Fink ,  John H. Bean, Jr. ,  Stephen F. Held ,  Richard J. Johnson ,  Rollie R. Johnson

Inventor： James R. Fink ,  John H. Bean, Jr. ,  Stephen F. Held ,  Richard J. Johnson ,  Rollie R. Johnson

IPC: H05K7/20

CPC classification number: H05K7/20 ,  H05K7/20745 ,  H05K7/2079

Abstract: A modular data center, for housing and cooling electronic equipment, includes multiple housings, a first portion of the housings configured to hold heat-producing electronic equipment and a second portion of the housings configured to hold at least one cooling unit, each of the housings of the first portion having a front and a back and configured to hold the heat-producing electronic equipment such that gas is drawn into the equipment from fronts of the equipment, heated by the equipment to become heated gas, and expelled by the electronic equipment is expelled through the backs of the housings, and at least one panel coupled to a pair of the housings to bridge a gap between the pair of the housings, where the housings and the at least one panel are disposed and coupled to form a laterally-enclosed arrangement laterally enclosing a hot region and defining a top opening allowing gas to vertically exit the hot region, and where backs of the housings of the first portion are disposed adjacent to the hot region such that the heat-producing equipment, when mounted to the housings, will expel the heated gas into the hot region.

Abstract translation: 用于壳体和冷却电子设备的模块化数据中心包括多个壳体，壳体的第一部分被配置为保持发热电子设备，并且壳体的第二部分被构造成保持至少一个冷却单元，每个壳体 所述第一部分具有前部和后部并且构造成保持所述发热电子设备，使得气体从所述设备的前部被吸入所述设备中，由所述设备加热以变成加热气体并被所述电子设备排出 通过壳体的后部排出，以及耦合到一对壳体的至少一个面板，以桥接一对壳体之间的间隙，其中壳体和至少一个面板被设置和联接以形成横向封闭 横向包围热区域并限定允许气体垂直离开热区域的顶部开口，并且第一部分的壳体的后部被设置为adj 使得发热设备在安装到壳体上时将被加热的气体排出到热区域。