Abstract:
A digital X-ray detector includes a scintillator that is configured to absorb radiation emitted from an X-ray radiation source and to emit light photons in response to the absorbed radiation. The detector also includes a complementary metal-oxide-semiconductor (CMOS) light imager that is configured to absorb the light photons emitted by the scintillator. The CMOS light imager includes a first surface and a second surface. The first surface is disposed opposite the second surface. The scintillator contacts the first surface of the CMOS light imager. The CMOS light imager further includes a CMOS pixel array with an array of CMOS pixels. Each individual CMOS pixel includes at least two row select transistors.
Abstract:
The present approaches relate to the fabrication of non-rectangular (e.g., non-square) light imager panels having comparable active areas to rectangular light imager panels but manufactured using fewer c-Si wafers. Such light imager panels may be generally squircle shaped (e.g., a square or rectangle with one or more rounded corners and may be manufactured using conventional crystalline silicon (c-Si) wafers, such as 8″ wafers.
Abstract:
The present approach relates to the fabrication of radiation detectors. In certain embodiments, additive manufacture techniques, such as 3D metallic printing techniques are employed to fabricate one or more parts of a detector. In an example of one such printing embodiment, amorphous silicon may be initially disposed onto a substrate and a laser may be employed to melt some or all of the amorphous silicon so as to form crystalline silicon circuitry of a light imager panel. Such printing techniques may also be employed to fabricate other aspects of a radiation detector, such as a scintillator layer.
Abstract:
The present approach relates to the fabrication of radiation detectors. In certain embodiments, additive manufacture techniques, such as 3D metallic printing techniques are employed to fabricate one or more parts of a detector. In an example of one such printing embodiment, amorphous silicon may be initially disposed onto a substrate and a laser may be employed to melt some or all of the amorphous silicon so as to form crystalline silicon circuitry of a light imager panel. Such printing techniques may also be employed to fabricate other aspects of a radiation detector, such as a scintillator layer.
Abstract:
Systems and methods for generating an X-ray image using a digital flat panel detector with a squircle shape are described. The flat panel X-ray detector contains a circuit board, a light imager electrically connected to the circuit board, and a scintillator coupled on the light imager. The detector has superellipse shape or a cornerless shape with a first substantially straight edge and a second substantially straight edge running substantially perpendicular to the first edge, wherein the first and second edges do not physically intersect with each other at 90 degrees. The flat panel detector with this shape can be used in an x-ray imaging system that uses the detector to detect x-rays and produce an x-ray image. With this shape, the active sensing area of the detector can be similar to those currently available with rectangular or square flat panel detectors, while using less material to create the detector.
Abstract:
The present approach relates to the fabrication of radiation detectors. In certain embodiments, additive manufacture techniques, such as 3D metallic printing techniques are employed to fabricate one or more parts of a detector. In an example of one such printing embodiment, amorphous silicon may be initially disposed onto a substrate and a laser may be employed to melt some or all of the amorphous silicon so as to form crystalline silicon circuitry of a light imager panel. Such printing techniques may also be employed to fabricate other aspects of a radiation detector, such as a scintillator layer.
Abstract:
An imaging system includes an analog-to-digital converter configured to convert an analog pixel value into a first digital pixel value. The imaging system also includes an index value source configured to receive the first digital pixel value from the analog-to-digital converter and to generate a digital index value based on a comparison of the first digital pixel value to a digital reference value. In addition, the imaging system includes a transmitter in communication with the index value source and configured to transmit the digital index value. Further, the imaging system includes an image processing component configured to receive the digital index value and to generate a second digital pixel value based at least in part on the received digital index value and a lookup table of the image processing component.
Abstract:
A computer-implemented method for reducing image artifacts in X-ray image data includes dividing pixels of X-ray image data into a plurality of pixel value regions based on a pixel value of each pixel, wherein each pixel value region has a different range of pixel values. The method also includes generating calibrated X-ray image data for each pixel value region, wherein the respective calibrated X-ray image data for each pixel value region is generated using a different dose of radiation. Further, the method includes calculating a gain slope for each pixel value region based on the calibrated X-ray image data, and calculating a pixel gain correction for the pixels of the X-ray image data based on at least one of the calculated gain slopes.