公开(公告)号：US20060027884A1

公开(公告)日：2006-02-09

申请号：US10914468

申请日：2004-08-09

Applicant: Jeffrey Melzak ,  Chien-Hung Wu

Inventor： Jeffrey Melzak ,  Chien-Hung Wu

IPC: H01L29/82

CPC classification number: B81C1/00246 ,  B81C2203/0728

Abstract: MEMS structures that include silicon carbide micromechanical components, as well as methods of forming and using the same, are provided. The silicon carbide micromechanical components may be integrated on the same structure with electronic components that control or detect movement of the micromechanical components. MEMS structures of the invention may be used in a variety of applications including microsensor and microactuator applications.

Abstract translation: 提供了包括碳化硅微机械部件的MEMS结构以及其形成和使用方法。 碳化硅微机械部件可以集成在与控制或检测微机械部件的移动的电子部件相同的结构上。 本发明的MEMS结构可用于各种应用，包括微传感器和微致动器应用。