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公开(公告)号：US20220223367A1
公开(公告)日：2022-07-14
申请号：US17147262
申请日：2021-01-12
Applicant: Applied Materials, Inc.
Inventor： Kirankumar Neelasandra SAVANDAIAH , Srinivasa Rao YEDLA , Thomas BREZOCZKY , Nitin Bharadwaj SATYAVOLU
IPC: H01J37/16 , H01J37/32 , C23C16/455
Abstract: Aspects of the present disclosure relate to systems and apparatuses for a substrate processing assembly with a low processing volume. In disclosed embodiments, a processing volume may include a processing space adjacent to a substrate being processed on a substrate support as well as a volume of the processing chamber surrounding and below the substrate support. In some embodiments, the total processing volume is 15 liters or less in certain embodiments, resulting in lower gas usage and faster processing times than conventional approaches. In some embodiments, the distance between the substrate and a target, electrode, chamber lid, or showerhead face is 35 mm or less in certain embodiments. In certain embodiments, the processing chamber has a dedicated pump for pumping the chamber to a processing pressure as well as evacuating the chamber after processing of the substrate.
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公开(公告)号：US20220216079A1
公开(公告)日：2022-07-07
申请号：US17143712
申请日：2021-01-07
Applicant: Applied Materials, Inc.
Inventor： Bhaskar PRASAD , Thomas BREZOCZKY , Kirankumar Neelasandra SAVANDAIAH , Anubhav SRIVASTAVA
IPC: H01L21/67 , H01L21/683
Abstract: Embodiments described herein relate to methods and apparatus for detecting and/or monitoring, e.g., abnormalities in wafer transfer and handling. In an embodiment, a method for wafer dechucking verification is provided. The method includes initiating a wafer transfer operation to transfer a wafer between components of a semiconductor processing system, the semiconductor processing system comprising a motor coupled to a lift pin, the motor configured to adjust a height of the lift pin above a pedestal, the lift pin for raising or lowering the wafer. The method further includes measuring one or more first parameters during the wafer transfer operation, comparing the one or more first parameters to one or more first pre-determined parameter ranges, and changing a force applied to the lift pin based on the one or more first parameters. Apparatus for wafer dechucking verification and non-transitory computer-readable mediums storing instructions for wafer dechucking verification are also provided
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公开(公告)号：US20220093439A1
公开(公告)日：2022-03-24
申请号：US17024802
申请日：2020-09-18
Applicant: Applied Materials, Inc.
Inventor： Bhaskar PRASAD , Kirankumar Neelasandra SAVANDAIAH , Srinivasa Rao YEDLA , Nitin Bharadwaj SATYAVOLU , Hari Prasath RAJENDRAN , Lakshmikanth Krishnamurthy SHIRAHATTI , Thomas BREZOCZKY
IPC: H01L21/683 , H01L21/67
Abstract: In one example, an electrostatic chuck comprises a chuck body having a top surface configured to support a substrate and a bottom surface opposite the top surface. The chuck body comprises one or more chucking electrodes, and one or more heating elements. The chuck body further comprises first terminals disposed on the bottom surface of the chuck body and coupled with the one or more heating elements, second terminals disposed on the bottom surface of the chuck body and coupled with the one or more chucking electrodes, and third terminals disposed on the bottom first surface of the chuck body and coupled with the one or more chucking electrodes.
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公开(公告)号：US20250069914A1
公开(公告)日：2025-02-27
申请号：US18811897
申请日：2024-08-22
Applicant: Applied Materials, Inc.
Inventor： Thomas BREZOCZKY , Punnati KRUSHNA REDDY , Azhar ALI M.A. , Kirankumar Neelasandra SAVANDAIAH , Lakshmikanth Krishnamurthy SHIRAHATTI , Dhritiman Subha KASHYAP
IPC: H01L21/67 , H01L21/677 , H01L21/687
Abstract: Degas stations for degassing substrates that are conveyed through a substrate processing system on a magnetically levitated carrier and related methods are provided. The degas station includes a housing, a magnetic levitation system coupled to the housing configured to levitate and move a carrier within the housing, a first heater assembly and a second heater assembly. The first heater assembly is disposed in the housing. The first heater assembly includes a first support, a first reflector disposed within the housing by the first support, and a first heat source coupled to reflector. The second heater assembly is disposed in the housing above the first heater assembly. The second heater assembly includes a second support, a second reflector disposed within the housing by the second support, and a second heat source coupled to the second reflector. At least one substrate support member is disposed between the first heater assembly and the second heater assembly.
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公开(公告)号：US20240371678A1
公开(公告)日：2024-11-07
申请号：US18772590
申请日：2024-07-15
Applicant: Applied Materials, Inc.
Inventor： Anubhav SRIVASTAVA , Bhaskar PRASAD , Kirankumar Neelasandra SAVANDAIAH , Thomas BREZOCZKY , Nitin Bharadwaj SATYAVOLU
IPC: H01L21/687
Abstract: Embodiments of the present disclosure generally relate to lift pins and to apparatus for controlling lift pin movement. In an embodiment, an apparatus for positioning a substrate in a chamber is provided. The apparatus includes a chamber component, a lift pin having a top surface for supporting the substrate and a lift pin shaft and a stopper. The apparatus further includes a compressible element positioned between the chamber component and the stopper, the compressible element further positioned around the lift pin shaft, the lift pin being moveable relative to a substrate transfer plane by movement of a substrate support in contact with the compressible element.
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36.发明公开
公开(公告)号：US20240332046A1
公开(公告)日：2024-10-03
申请号：US18585505
申请日：2024-02-23
Applicant: Applied Materials, Inc.
Inventor： Kirankumar Neelasandra SAVANDAIAH , Nitin Bharadwaj SATYAVOLU , Srinivasa Rao YEDLA , Bhaskar PRASAD , Thomas BREZOCZKY
CPC classification number: H01L21/67126 , C23C14/35 , C23C14/50 , H01J37/32513 , H01J37/32715 , H01J37/3405 , H01J37/3426 , H01J2237/2007 , H01J2237/332 , H01L21/67167 , H01L21/67207
Abstract: A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed. A seal ring assembly is coupled to the support chuck. The seal ring assembly includes an inner assembly, an assembly bellows circumscribing the inner assembly, and a bellows disposed between the inner and outer platform. An inner ring is disposed between inner assembly of the seal ring assembly and the bottom surface of the support chuck. An outer ring disposed between the seal ring assembly and the lower sealing surface of the process chamber wall. The support chuck is raised to form an isolation seal between the processing chamber volume and the transfer chamber volume using the bellows, the inner ring, and the outer ring.
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公开(公告)号：US20240153802A1
公开(公告)日：2024-05-09
申请号：US18141909
申请日：2023-05-01
Applicant: Applied Materials, Inc.
Inventor： Bhaskar PRASAD , Kirankumar Neelasandra SAVANDAIAH , Thomas BREZOCZKY , Lakshmikanth Krishnamurthy SHIRAHATTI
IPC: H01L21/677 , H01L21/67 , H01L21/683 , H01L21/687
CPC classification number: H01L21/67709 , H01L21/67201 , H01L21/67742 , H01L21/6838 , H01L21/68742 , H01L21/68785
Abstract: A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.
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公开(公告)号：US20240153799A1
公开(公告)日：2024-05-09
申请号：US18141914
申请日：2023-05-01
Applicant: Applied Materials, Inc.
Inventor： Bhaskar PRASAD , Kirankumar Neelasandra SAVANDAIAH , Thomas BREZOCZKY , Lakshmikanth Krishnamurthy SHIRAHATTI
IPC: H01L21/677
CPC classification number: H01L21/67706 , H01L21/67709 , H01L21/6773
Abstract: A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.
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39.发明公开
公开(公告)号：US20230282500A1
公开(公告)日：2023-09-07
申请号：US18317347
申请日：2023-05-15
Applicant: Applied Materials, Inc.
Inventor： Bhaskar PRASAD , Kirankumar Neelasandra SAVANDAIAH , Thomas BREZOCZKY , Srinivasa Rao YEDLA
CPC classification number: H01L21/67248 , H01L22/12 , H01L21/6833
Abstract: Embodiments of the present disclosure relate to apparatus, systems and methods for substrate processing. A detachable substrate support is disposed within a processing volume of a processing chamber and the substrate support includes a substrate interfacing surface and a back surface. The pedestal hub has a supporting surface removably coupled to the substrate support. A hub volume of the pedestal hub includes temperature measuring assembly disposed therein positioned to receive electromagnetic energy emitted from the back surface of the substrate support. The temperature measuring assembly measures an intensity of the electromagnetic energy entering the assembly and generates intensity signals. An apparent temperature of the substrate is determined based on the intensity signals.
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公开(公告)号：US20230032146A1
公开(公告)日：2023-02-02
申请号：US17386489
申请日：2021-07-27
Applicant: Applied Materials, Inc.
Inventor： Kirankumar Neelasandra SAVANDAIAH , Srinivasa Rao YEDLA , Lakshmikanth Krishnamurthy SHIRAHATTI , Thomas BREZOCZKY
Abstract: The present disclosure generally provides for a system and method for measuring one or more characteristics of one or more substrates in a multi-station processing system using one or more metrology modules at a plurality of metrology stations. In one embodiment, a system controller is configured to cause the multi-station processing system to perform a method that includes processing a plurality of substrates at a plurality of processing stations, advancing one or more of the plurality of substrates to a respective metrology station, measuring one or more characteristics of the plurality of substrates at the respective metrology station, determining a processing performance metric based on the one or more characteristics, comparing the processing performance metric to a tolerance limit to determine if an out of tolerance condition has occurred, and adjusting one or more processing parameters when it is determined that an out of tolerance condition has occurred.
