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公开(公告)号:US20190246525A1
公开(公告)日:2019-08-08
申请号:US16389792
申请日:2019-04-19
Applicant: Amazon Technologies, Inc.
Inventor: Darin Lee Frink , Kevin Bailey , Peter George Ross , Bryan James Donlan , James Caleb Kirschner , Mary Crys Calansingin , Paul David Franklin , Mastaka Kubo
Abstract: A data center may include a tape library rack module along with rack computer systems. The rack computer systems may be configured to provide computing capacity within a data center environment. In some embodiments, the tape library rack module may include an enclosure encompassing an interior of the tape library rack module, a rack within the interior, and a tape library unit mounted on the rack. The tape library rack unit may include tape cartridges configured to store data within a tape environment that is different than the data center environment. The tape library rack unit may be within a portion of the interior that is enclosed such that it is environmentally isolated from the data center environment. In some examples, the tape library rack module may include a cooling unit and/or a humidifier unit, which may provide the tape environment to the environmentally isolated portion of the interior of the tape library rack module.
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公开(公告)号:US10296478B1
公开(公告)日:2019-05-21
申请号:US14852126
申请日:2015-09-11
Applicant: Amazon Technologies, Inc.
Inventor: Jason Alexander Harland , Max Jesse Wishman , Darin Lee Frink
Abstract: A system and method are described for configuring a motherboard using expansion cards plugged into motherboard slots. In particular, each of the expansion cards can include a control signal that is supplied to the motherboard and that can configure hardware positioned on the motherboard. In one embodiment, the configuration allows a communication path to be switched on to allow the expansion cards to cross communicate.
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公开(公告)号:US09936611B1
公开(公告)日:2018-04-03
申请号:US14217121
申请日:2014-03-17
Applicant: Amazon Technologies, Inc.
Inventor: Christopher Strickland Beall , David Edward Bryan , Darin Lee Frink , Jason Alexander Harland
CPC classification number: H05K7/20736 , B21D39/00 , G11B33/128 , G11B33/142 , H05K7/1488
Abstract: A system for storing data includes a rack and one or more data storage modules mounted on the rack. The data storage modules may include a chassis, two or more vertically-oriented backplanes coupled to the chassis, two or more mass storage devices coupled to the backplanes, and one or more air passages extending beneath one or more of the backplanes. Each backplane is configured to preclude airflow through the backplane between opposite vertical faces and can couple mass storage devices on one or more of the opposite vertical faces. One or more of the air passages can supply an upwards-directed airflow along one of the opposite vertical faces of a backplane to remove heat from a heat producing component of a mass storage device coupled to the vertical face of the vertically-oriented backplane.
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公开(公告)号:US20180084665A1
公开(公告)日:2018-03-22
申请号:US15823498
申请日:2017-11-27
Applicant: Amazon Technologies, Inc.
Inventor: Roey Rivnay , Darin Lee Frink , Christopher Strickland Beall , Felipe Enrique Ortega Gutierrez
IPC: H05K7/14
CPC classification number: H05K7/1485
Abstract: A system includes a rack and one or more server systems mounted in the rack. A server system includes at least one sever node and each server node includes an array of devices including mass storage devices and at least one server device. Segments of the array of devices of a particular server node are mounted in sub-node chassis that include intra node connectors. Multiple sub-node chassis that each include devices such as mass storage devices or server devices of the sever node couple together via the intra node connectors when installed in a server system chassis to form a server node. Each server node of a server system may be a separate logical node. Also, the sub-node chassis of a server node may be configured for vertical airflow through the sub-node chassis in addition to cross airflow.
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公开(公告)号:US09888615B1
公开(公告)日:2018-02-06
申请号:US15389327
申请日:2016-12-22
Applicant: Amazon Technologies, Inc.
Inventor: Darin Lee Frink , Kevin Bailey , Peter George Ross , Bryan James Donlan , James Caleb Kirschner , Mary Crys Calansingin , Paul David Franklin , Masataka Kubo
CPC classification number: H05K7/20745 , G11B15/68 , G11B25/063 , G11B33/04 , G11B33/1406 , G11B33/144 , H05K7/1498 , H05K7/20836
Abstract: A data center may include a tape library rack module along with rack computer systems. The rack computer systems may be configured to provide computing capacity within a data center environment. In some embodiments, the tape library rack module may include an enclosure encompassing an interior of the tape library rack module, a rack within the interior, and a tape library unit mounted on the rack. The tape library rack unit may include tape cartridges configured to store data within a tape environment that is different than the data center environment. The tape library rack unit may be within a portion of the interior that is enclosed such that it is environmentally isolated from the data center environment. In some examples, the tape library rack module may include a cooling unit and/or a humidifier unit, which may provide the tape environment to the environmentally isolated portion of the interior of the tape library rack module.
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公开(公告)号:US09832905B2
公开(公告)日:2017-11-28
申请号:US15087746
申请日:2016-03-31
Applicant: Amazon Technologies, Inc.
Inventor: Roey Rivnay , Darin Lee Frink , Christopher Strickland Beall , Felipe Enrique Ortega Gutierrez
CPC classification number: H05K7/1485
Abstract: A system includes a rack and one or more server systems mounted in the rack. A server system includes at least one sever node and each server node includes an array of devices including mass storage devices and at least one server device. Segments of the array of devices of a particular server node are mounted in sub-node chassis that include intra node connectors. Multiple sub-node chassis that each include devices such as mass storage devices or server devices of the sever node couple together via the intra node connectors when installed in a server system chassis to form a server node. Each server node of a server system may be a separate logical node. Also, the sub-node chassis of a server node may be configured for vertical airflow through the sub-node chassis in addition to cross airflow.
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公开(公告)号:US09795062B1
公开(公告)日:2017-10-17
申请号:US15197633
申请日:2016-06-29
Applicant: Amazon Technologies, Inc.
Inventor: Peter George Ross , Darin Lee Frink , Frank Charles Paterra
IPC: H05K7/20
CPC classification number: H05K7/20745 , H05K7/20145 , H05K7/2079
Abstract: A portable data center includes a cooling system comprising a cooling circuit, one or more air plenums, and one or more air moving devices. The cooling circuit circulates a heat transfer fluid through a portion of the cooling circuit that passes through the one or more air plenums. The heat transfer fluid that passes through the one or more air plenums cools air flowing through the one or more air plenums via the one or more air moving devices. The cooling circuit also circulates the heat transfer through a separate portion of the portable data center where heat is rejected from the heat transfer fluid into the separate portion of the portable data center. In some embodiments, the air plenums and at least a portion of the cooling circuit are mounted in a sub-floor space between a platform within the portable data center and an outer structure of the portable data center.
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公开(公告)号:US09785600B2
公开(公告)日:2017-10-10
申请号:US15231618
申请日:2016-08-08
Applicant: Amazon Technologies, Inc.
Inventor: Darin Lee Frink , Peter George Ross
IPC: H05K7/20 , G06F13/40 , G06F1/18 , G11B33/12 , G11B33/14 , G06F1/20 , G06F3/06 , G06F1/32 , H05K7/14
CPC classification number: G06F13/4068 , G06F1/181 , G06F1/187 , G06F1/20 , G06F1/206 , G06F1/3287 , G06F3/0619 , G06F3/0655 , G06F3/0689 , G11B33/128 , G11B33/142 , H05K7/1457 , H05K7/20572
Abstract: A system for storing data includes a rack, one or more data storage modules coupled to the rack, and one or more data control modules coupled to the rack. The data storage modules may include a chassis, two or more backplanes coupled to the chassis, and one or more mass storage devices (for example, hard disk drives) coupled to the backplanes. The data control modules may access the mass storage devices in the data storage modules.
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公开(公告)号:US09474190B1
公开(公告)日:2016-10-18
申请号:US14460075
申请日:2014-08-14
Applicant: Amazon Technologies, Inc.
Inventor: Christopher Strickland Beall , David Edward Bryan , Darin Lee Frink
CPC classification number: G06F1/185 , G06F1/187 , G06F1/20 , H05K7/1491 , H05K7/20145 , H05K7/20727 , H05K7/20736
Abstract: A rack-mountable computer system directs separate portions of a cooling airflow from an inlet air plenum in the computer system interior through separate air passages to remove heat from separate portions of a set of heat-producing components. The air passages can preclude a portion of cooling airflow removing heat from a component from being preheated by another component. Plenums and air passages can be established through the arrangement of components in the interior. Components can be arranged in progressive offsets throughout the depth of the interior to vary plenum flow area throughout the depth, which can progressively impede and redirect airflow through the inlet plenum into the air passages. Arrangements can include an angled row, a staggered configuration, etc. The computer system can include a chassis which can translate, while maintaining operation of hot-pluggable electronic components coupled throughout the depth, to enable swapping of hot-pluggable electronic components throughout the interior.
Abstract translation: 机架安装的计算机系统通过分开的空气通道将冷却气流的分开部分与计算机系统内部中的入口空气通风室引导,以从一组发热部件的分离部分移除热量。 空气通道可以排除一部分冷却气流,从部件中除去热量并被另一部件预热。 可以通过内部组件的布置来建立室内和空气通道。 组件可以在整个内部的深度上以渐进的偏移方式布置,以在整个深度上改变气室流动区域,这可以逐渐阻碍并将气流重新定向通过入口压气室进入空气通道。 安排可以包括成角度的行,交错的配置等。计算机系统可以包括底架,其可以在保持连接在整个深度上的可热插拔的电子部件的运行的同时平移,以使得热插拔电子部件能够在整个内部 。
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公开(公告)号:US09355252B1
公开(公告)日:2016-05-31
申请号:US14708634
申请日:2015-05-11
Applicant: Amazon Technologies, Inc.
Inventor: Michael David Marr , Matthew D. Klein , Samuel J. McKelvie , Darin Lee Frink
IPC: G06F9/00 , G06F15/177 , G06F21/57 , G06F9/44
CPC classification number: G06F21/575 , G06F9/4401 , G06F9/4411 , G06F9/44505 , G06F15/177 , G06F2221/034
Abstract: A service provider can maintain one or more host computing devices which may be utilized as bare metal instances by one or more customers of the service provider. Illustratively, each host computing device includes hardware components that are configured in a manner to allow the service provider to implement one or more processes upon a power cycle of the host computing device and prior to access of the host computing device resources by customers. In one aspect, a hosting platform includes components arranged in a manner to limit modifications to software or firmware on hardware components. In another aspect, the hosting platform can implement management functions for establishing control plane functions between the host computing device and the service provider that is independent of the customer. Additionally, the management functions can also be utilized to present different hardware or software attributes of the host computing device.
Abstract translation: 服务提供商可以维护一个或多个可由服务提供商的一个或多个客户作为裸机实例使用的主机计算设备。 示例性地,每个主机计算设备包括以允许服务提供商在主机计算设备的电源周期之后并且在客户访问主机计算设备资源之前实现一个或多个进程的方式配置的硬件组件。 一方面,托管平台包括以限制对硬件组件上的软件或固件的修改的方式布置的组件。 另一方面,托管平台可以实现用于在主机计算设备和独立于客户的服务提供商之间建立控制平面功能的管理功能。 此外,还可以利用管理功能来呈现主机计算设备的不同硬件或软件属性。
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