公开(公告)号：US20220078918A1

公开(公告)日：2022-03-10

申请号：US17309699

申请日：2019-12-30

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ankit Mahajan ,  Mikhail L. Pekurovsky ,  Saagar A. Shah ,  Kayla C. Niccum ,  Kara A. Meyers ,  Christopher G. Walker

IPC: H05K3/32 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H05K3/40 ,  H05K3/36 ,  H05K3/12 ,  H01R12/62

Abstract: A method for manufacturing an electronic device includes providing a substrate with a first major surface having a microchannel, wherein the microchannel has a first end and a second end; dispensing a conductive liquid in the microchannel to cause the conductive liquid to move, primarily by capillary pressure, in a first direction toward the first end of the microchannel and in a second direction toward the second end of the microchannel; and solidifying the conductive liquid to form an electrically conductive trace electrically connecting a first electronic device at the first end of the microchannel to a second electronic device at the second end of the microchannel.

公开(公告)号：US20210319955A1

公开(公告)日：2021-10-14

申请号：US16949910

申请日：2019-05-16

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ankit Mahajan ,  Saagar A. Shah ,  Mikhail L. Pekurovsky ,  Thomas J. Metzler ,  Kayla C. Niccum ,  Eric A. Vandre ,  Aniruddha Upadhye ,  Robert R. Owings ,  Jeremy K. Larsen ,  Zohaib Hameed

IPC: H01G4/33 ,  H01F17/00 ,  H01F41/04 ,  H01C17/075 ,  H01C7/00 ,  H01C1/01 ,  H01C1/034 ,  H01C17/00 ,  H01G2/06 ,  H01G4/005 ,  H01G4/224

Abstract: Ultrathin and flexible electrical devices including circuit dies such as, for example, a capacitor chip, a resistor chip, and/or an inductor chip, and methods of making and using the same are provided. Circuit dies are attached to a major surface of a flexible substrate having channels Electrically conductive traces are formed in the channels, self-aligned with the circuit dies, and in direct contact with the bottom surface of the circuit dies.