公开(公告)号：US06228234B1

公开(公告)日：2001-05-08

申请号：US09222346

申请日：1998-12-29

Applicant: Yoshihiro Oshima ,  Masayasu Kakinuma

Inventor： Yoshihiro Oshima ,  Masayasu Kakinuma

IPC: C23C1434

CPC classification number: C23C14/0063

Abstract: The invention provides an apparatus for sputtering, with which it is easy to control gas flow rate in a short time, and relates to an apparatus for sputtering in which reactive gas is supplied to a gas distributor having a plurality of gas nozzles provided in a vacuum chamber, the reactive gas is jetted from the gas nozzles, and a gauge port type connector for detaching the gas distributor is provided in the vacuum chamber. The gas nozzles comprise screws, each screw has a hole for jetting reactive gas and is directed in the outside direction of the chamber. Therefore, it is possible to change the gas flow rate easily in a short time.

Abstract translation: 本发明提供一种用于溅射的设备，其易于在短时间内控制气体流量，并且涉及一种用于溅射的设备，其中将反应性气体供应到具有设置在真空中的多个气体喷嘴的气体分配器 反应气体从气体喷嘴喷射，并且用于分离气体分配器的量规端口型连接器设置在真空室中。 气体喷嘴包括螺钉，每个螺杆具有用于喷射反应气体的孔，并且被引导到室的外部方向。 因此，可以在短时间内容易地改变气体流量。