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    Chip on Film (COF) Substrate, COF Package and Display Device Including the Same
    21.
    发明申请
    Chip on Film (COF) Substrate, COF Package and Display Device Including the Same 有权
    芯片贴片（COF）衬底，包括它的COF封装和显示设备

    公开(公告)号：US20140054793A1

    公开(公告)日：2014-02-27

    申请号：US13933185

    申请日：2013-07-02

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jeong-Kyu Ha ,  Kwan-Jai Lee ,  Jae-Min Jung ,  Kyong-Soon Cho ,  Na-Rae Shin ,  Kyoung-Suk Yang ,  Pa-Lan Lee ,  So-Young Lim

    IPC: H01L23/498

    CPC classification number: H01L23/49838 ,  H01L23/4985 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A COF substrate may include a base film, first upper conductive patterns, at least one second upper conductive pattern and lower conductive patterns. The first upper conductive patterns may be arranged on an upper surface of the base film. Each of the first upper conductive patterns may have an inner pattern and an outer pattern spaced apart from each other. The second upper conductive pattern may be arranged on the upper surface of the base film between the first upper conductive patterns. The lower conductive patterns may be arranged on a lower surface of the base film. The lower conductive patterns may be electrically connected between the inner pattern and the outer pattern. Thus, conductive materials causing a short between the panel patterns may not exist between the inner pattern and the outer pattern on the upper surface of the base film.

    Abstract translation: COF基板可以包括基膜，第一上导电图案，至少一个第二上导电图案和下导电图案。 第一上导电图案可以布置在基膜的上表面上。 每个第一上导电图案可以具有彼此间隔开的内图案和外图案。 第二上导电图案可以布置在第一上导电图案之间的基膜的上表面上。 下导电图案可以布置在基膜的下表面上。 下部导电图案可以电连接在内部图案和外部图案之间。 因此，在基片的上表面上的内图案和外图案之间可能不存在在面板图案之间引起短路的导电材料。

    Chip on film package including distributed via plugs
    26.
    发明授权
    Chip on film package including distributed via plugs 有权
    片上封装包括分布式插头

    公开(公告)号：US09437526B2

    公开(公告)日：2016-09-06

    申请号：US14259200

    申请日：2014-04-23

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： So-Young Lim ,  Na-Rae Shin ,  Jeong-Kyu Ha ,  Kyoung-Suk Yang ,  Pa-Lan Lee

    IPC: H01L23/498 ,  H01L23/495 ,  H01L23/482 ,  H05K1/11 ,  H01L23/00

    CPC classification number: H01L23/49541 ,  H01L23/00 ,  H01L23/4824 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/16 ,  H01L2224/16225 ,  H05K1/118

    Abstract: A chip on film (COF) package includes a film substrate, first leads on a first surface of the film substrate, the first leads having a first length, and second leads on the first surface of the film substrate, the second leads having a second length larger than the first length, first via plugs penetrating the film substrate and connected to first ends of the first leads, and second via plugs penetrating the film substrate and connected to first ends of the second leads, and first connection leads on a second surface of the film substrate facing the first surface, the first connection leads having first ends connected to the first via plugs, and second connection leads on the second surface of the film substrate, the second connection leads having first ends electrically connected to the second via plugs.

    Abstract translation: 膜芯片（COF）封装包括薄膜基板，第一引线在薄膜基板的第一表面上，第一引线具有第一长度，第二引线在薄膜基板的第一表面上，第二引线具有第二引线 长度大于第一长度，首先通过插入薄膜基板并连接到第一引线的第一端的插塞，以及穿过薄膜基片并连接到第二引线的第一端的第二通孔塞，第二表面上的第一连接引线 所述第一连接引线具有连接到所述第一通孔的第一端和所述薄膜基板的第二表面上的第二连接引线，所述第二连接引线具有电连接到所述第二通孔塞 。

    Semiconductor packages and display devices including semiconductor packages
    27.
    发明授权
    Semiconductor packages and display devices including semiconductor packages 有权
    包括半导体封装的半导体封装和显示装置

    公开(公告)号：US09362333B2

    公开(公告)日：2016-06-07

    申请号：US14327138

    申请日：2014-07-09

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jae-Min Jung ,  Jeong-Kyu Ha

    IPC: H01L27/15 ,  H01L23/498 ,  H01L23/538 ,  H01L23/14 ,  H01L23/00

    CPC classification number: H01L27/15 ,  H01L23/145 ,  H01L23/4985 ,  H01L23/5387 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2924/014

    Abstract: Semiconductor packages are provided. A semiconductor package may include a semiconductor chip. The semiconductor package may include a substrate and first and second conductive regions on the substrate. In some embodiments, the substrate may be a flexible substrate, and the first and second conductive regions may be on the same surface of the flexible substrate. Display devices including semiconductor packages are also provided. In some embodiments, a display device may include a flexible substrate that is bent such that first and second conductive regions thereof are connected to each other via an intervening third conductive region.

    Abstract translation: 提供半导体封装。 半导体封装可以包括半导体芯片。 半导体封装可以包括衬底和衬底上的第一和第二导电区域。 在一些实施例中，衬底可以是柔性衬底，并且第一和第二导电区域可以在柔性衬底的相同表面上。 还提供了包括半导体封装的显示装置。 在一些实施例中，显示装置可以包括弯曲的柔性基板，使得其第一和第二导电区域经由居间的第三导电区域相互连接。

    Display apparatus
    28.
    发明授权
    Display apparatus 有权
    显示装置

    公开(公告)号：US09313889B2

    公开(公告)日：2016-04-12

    申请号：US14262658

    申请日：2014-04-25

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kyoungsuk Yang ,  Jeong-Kyu Ha ,  PaLan Lee ,  Narae Shin ,  Soyoung Lim ,  Jae-Min Jung ,  KyongSoon Cho

    IPC: H05B33/00 ,  H05K1/02 ,  H05K5/00 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

    CPC classification number: H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0949 ,  H05K2201/10128

    Abstract: Provided is a display apparatus. The display apparatus includes a display panel, a flexible circuit film having a rear surface connected to the display panel, and a front surface opposite to the rear surface, the front surface having a chip mounted thereon, and a first lead bonding portion electrically connecting the chip to the display panel. The first lead bonding portion includes a first portion connected to the chip and overlying a portion of the flexible circuit film, a second portion passing through the flexible circuit film, and a third portion disposed between the flexible circuit film and the display panel on the rear surface of the flexible circuit film, where the third portion overlaps the first portion.

    Abstract translation: 提供了一种显示装置。 显示装置包括显示面板，具有连接到显示面板的后表面的柔性电路薄膜和与背面相对的前表面，前表面具有安装在其上的芯片，以及第一引线接合部分， 芯片到显示面板。 第一引线接合部分包括连接到芯片并覆盖柔性电路膜的一部分的第一部分，穿过柔性电路膜的第二部分和设置在柔性电路膜和后面的显示面板之间的第三部分 柔性电路膜的表面，其中第三部分与第一部分重叠。

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