公开(公告)号：US20220248551A1

公开(公告)日：2022-08-04

申请号：US17590039

申请日：2022-02-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoonhee LEE ,  Hangyu HWANG ,  Junghyun IM

IPC: H05K5/02 ,  H01Q1/24 ,  H04M1/02 ,  G06F1/16

Abstract: Various embodiments of the present disclosure relate to an electronic device including a housing and a method of manufacturing the housing. The electronic device includes a housing forming an exterior of the electronic device. The housing is constituted to include a non-conductive part including a non-conductive protrusion protruded from at least some area of the non-conductive part, a conductive deposition layer disposed on a top surface of the non-conductive part except on the non-conductive protrusion, and a decoration layer formed on the top of the conductive deposition layer. Accordingly, the housing is lightweight and can perform a function of an antenna radiator. Other various embodiments are possible.

公开(公告)号：US20210329799A1

公开(公告)日：2021-10-21

申请号：US17301845

申请日：2021-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghyun IM ,  Hyosang LIM ,  Heekwang LIM ,  Seungchang BAEK ,  Hyeongsam SON ,  Sungho CHO ,  Hangyu HWANG ,  Jongchul CHOI

IPC: H05K5/02 ,  H05K5/00

Abstract: An electronic device includes a front plate, a back plate that faces away from the front plate, a display, a frame, a polymer member, and an adhesive layer. The display is disposed between the front plate and the back plate and visible through the front plate. The frame surrounds an interior space between the front plate and the back plate and formed of a metallic material. The frame includes a first metal part and a second metal part. The polymer member is coupled to the frame and contains a polymer material. The adhesive layer bonds the polymer member and the frame. The frame includes an opening formed in a first part thereof. The opening is formed through the first metal part and being formed to a specified depth through the second metal part. The polymer member forms at least part of an inner surface of the opening.

公开(公告)号：US20210120927A1

公开(公告)日：2021-04-29

申请号：US17252881

申请日：2019-04-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongbae JEON ,  Changsu KIM ,  Sangsik NA ,  Pranveer Singh RATHORE ,  Hangyu HWANG

IPC: A45C11/00 ,  A45C13/00

Abstract: A cover device according to an embodiment of the present invention, may include a first plate including a first surface and a second surface facing away from the first surface, and being substantially rectangular, the first plate including a first edge having a first length and extending in a first direction, a second edge having a second length longer than the first length and extending in a second direction orthogonal to the first direction, a third edge parallel to the first edge, having the first length, and extending in the first direction from the second edge, and a fourth edge parallel to the second edge, having the second length, and extending from the first edge in the second direction, a first sidewall perpendicular to the first surface and extending from the first edge, a second sidewall perpendicular to the first surface and the first sidewall and extending from the second edge, a third sidewall perpendicular to the first surface and the second sidewall and extending from the third edge, and a fourth sidewall perpendicular to the first surface and the third sidewall and extending from the fourth edge, wherein the first surface, the first sidewall, the second sidewall, the third sidewall and the fourth sidewall together may form a recess for receiving and holding the electronic device, and the first surface may include at least one parting line having a third length longer than the first length and shorter than the second length and extending in the second direction.

公开(公告)号：US20210120681A1

公开(公告)日：2021-04-22

申请号：US17069965

申请日：2020-10-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hangyu HWANG ,  Youngjong SHIN ,  Sangbeom KO ,  Sungho CHO ,  Sunyoung JI ,  Younghee CHOI ,  Changyoun HWANG

IPC: H05K5/00 ,  B29C45/37

Abstract: An electronic device and method for forming a housing of the same is disclosed. The electronic device includes: a housing including: a first plate forming a front surface of the housing, a second plate integrally forming a rear surface and side surface of the housing, wherein a space is enclosed between the front surface, side surface and rear surface, and wherein the second plate includes a first surface forming the side and rear surfaces of the housing, and a second surface disposed opposite to the first surface, and a display disposed in the space and at least partially visible through the first plate, wherein at least a portion of the second surface includes a pattern having surface roughness having a height of 0.1 μm to 1 μm.