公开(公告)号：US20210320000A1

公开(公告)日：2021-10-14

申请号：US17078278

申请日：2020-10-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jungseok AHN ,  Unbyoung KANG ,  Chungsun LEE ,  Teakhoon LEE

IPC: H01L21/02 ,  B24B21/00 ,  B26D7/18 ,  B28D5/02 ,  H01L21/304

Abstract: The wafer trimming device includes a chuck table configured to hold a target wafer via suction, thereby fixing the target wafer, a notch trimmer configured to trim a notch of the target wafer, and an edge trimmer configured to trim an edge of the target wafer. The notch trimmer includes a notch trimming blade configured to rotate about a rotation axis perpendicular to a circumferential surface of the target wafer. The edge trimmer includes an edge trimming blade configured to rotate about a rotation axis parallel to the circumferential surface of the target wafer.