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公开(公告)号:US20200154532A1
公开(公告)日:2020-05-14
申请号:US16678775
申请日:2019-11-08
Applicant: LG Electronics Inc.
Inventor: Seongjun KIM , Jaekyung YANG , Yongsoo LEE
Abstract: An induction heating device includes: a working coil including a conducting wire that is wound in an annular shape and that is connected to a plurality of electric terminals; a ferrite core disposed vertically below the working coil and configured to direct upward an alternating magnetic field generated by the working coil, the ferrite core defining a stepped portion at each corner of the ferrite core; a base plate that supports the ferrite core on an upper surface of the base plate and that defines a connection hole having a shape corresponding to the corner of the ferrite core; and an indicator substrate disposed vertically below the base plate. The indicator substrate includes a connector that is disposed on an upper surface of the indicator substrate, that is coupled to one or more of the plurality of electric terminals, and that protrudes upward through the connection hole.
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公开(公告)号:US20170164799A1
公开(公告)日:2017-06-15
申请号:US15439128
申请日:2017-02-22
Applicant: LG ELECTRONICS INC.
Inventor: Seongjun KIM , Jinwoo LEE , Seogyong KIM
IPC: A47L9/04
CPC classification number: A47L9/0416 , A47L9/02 , A47L9/04 , A47L9/0427 , A47L9/0433 , A47L9/0444 , A47L9/0455 , A47L9/0477
Abstract: A nozzle for a vacuum cleaner and a vacuum cleaner are provided. The nozzle may include a main nozzle; at least one movable nozzle rotatably coupled to the main nozzle; and a rotary cleaner provided inside of the main nozzle and the movable nozzle that cleans a floor surface using a rotary motion. The rotary cleaner may include a main shaft rotatably provided inside of the main nozzle, and at least one auxiliary shaft provided inside of the movable nozzle and connected to the main shaft. The at least one auxiliary shaft may rotate using a rotational force transmitted from the main shaft.
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公开(公告)号:US20250024564A1
公开(公告)日:2025-01-16
申请号:US18897796
申请日:2024-09-26
Applicant: LG Electronics Inc.
Inventor: Seongjun KIM , Wontae KIM , Seonghoon HWANG
Abstract: An induction heating type cooktop includes a cover plate that is coupled to a top of a case and that includes an upper plate configured to seat an object to be heated, a working coil disposed inside the case and configured to heat the object, an insulator disposed between a bottom surface of the upper plate and the working coil, and a thin film that is disposed on at least one of a top surface of the upper plate or the bottom surface of the upper plate and that includes a plurality of sub-films that are arranged about a central portion of the thin film. An outer boundary of one of the plurality of sub-films is positioned radially outward of an outer boundary of another of the plurality of sub-films relative to the central portion of the thin film.
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公开(公告)号:US20240064877A1
公开(公告)日:2024-02-22
申请号:US18500805
申请日:2023-11-02
Applicant: LG Electronics Inc.
Inventor: Seonghoon HWANG , Wontae KIM , Seongjun KIM
CPC classification number: H05B6/1209 , G01K1/026 , G01K7/02 , H05B3/74 , H05B6/062 , H05B6/105 , H05B6/1245 , H05B6/1272
Abstract: An induction heating type cooktop includes a case, a cover plate that is connected to an upper end of the case and that has an upper surface configured to support an object to be heated, a working coil disposed inside the case, a thin layer disposed at the cover plate, a temperature sensor configured to sense a temperature of the thin layer, and a heat insulator that is configured to block heat transfer from the thin layer to the working coil and that defines at least one sensing hole that receives the temperature sensor.
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公开(公告)号:US20230371138A1
公开(公告)日:2023-11-16
申请号:US18220644
申请日:2023-07-11
Applicant: LG Electronics Inc.
Inventor: Seongjun KIM , Wontae KIM , Seonghoon HWANG
CPC classification number: H05B6/1263 , H05B6/062
Abstract: An induction heating type cooktop includes a case, a cover plate that is connected to an upper end of the case and that has an upper surface configured to support an object to be heated, a working coil disposed inside the case, a thin layer disposed at the cover plate and configured to be heated by the working coil through induction, and a working coil cooling fan configured to blow air toward the working coil.
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26.
公开(公告)号:US20200163170A1
公开(公告)日:2020-05-21
申请号:US16687935
申请日:2019-11-19
Applicant: LG Electronics Inc.
Inventor: Seongjun KIM , Seongho SON , Yongsoo LEE
Abstract: An induction heating device includes: a case; working coils; a base plate that supports the working coils; light guides that are installed on the base plate and that cover outer portions of each working coil; light emitting elements disposed below the light guides and configured to emit light; and an indicator substrate that is disposed below the base plate and that seats the light emitting elements. The indicator substrate includes a first indicator substrate, where a first portion of the light emitting elements are arranged along outer portions of the first indicator substrate, and a second indicator substrate disposed at a rear side of the first indicator substrate, where a second portion of the light emitting elements are arranged along outer portions of the second indicator substrate except for an outer portion at a front side that is adjacent to and faces the rear side of the first indicator substrate.
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公开(公告)号:US20200154598A1
公开(公告)日:2020-05-14
申请号:US16678767
申请日:2019-11-08
Applicant: LG Electronics Inc.
Inventor: Seongjun KIM , Seongho SON , Yongsoo LEE
Abstract: An induction heating device includes a case having a lower plate that defines an inlet and an exhaust slit; a cover plate coupled to the case; a working coil disposed inside the case; an indicator substrate support coupled to the lower plate and disposed below the working coil; an inverter substrate disposed on a lower surface of the indicator substrate support and including an inverter and a first heat sink configured to dissipate heat generated from the inverter; and a first blowing fan disposed at the lower plate and configured to draw air from an outside of the case through the inlet and discharge the air to the inverter substrate. The exhaust slit is configured to discharge, to an area below the lower plate, at least a portion of air discharged from the first blowing fan to the inverter substrate.
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