公开(公告)号：US20050277300A1

公开(公告)日：2005-12-15

申请号：US10868309

申请日：2004-06-15

Applicant: Dirk Efferenn ,  Jens Hahn ,  Uwe Kahler ,  Chung-Hsin Lin ,  Jens Bachmann ,  Wen-Bin Lin ,  Grit Bonsdorf

Inventor： Dirk Efferenn ,  Jens Hahn ,  Uwe Kahler ,  Chung-Hsin Lin ,  Jens Bachmann ,  Wen-Bin Lin ,  Grit Bonsdorf

IPC: H01L21/302 ,  H01L21/3213 ,  H01L21/768

CPC classification number: H01L21/32134 ,  H01L21/76838 ,  H01L21/76849

Abstract: A method for providing whisker-free aluminum metal lines or aluminum alloy lines in integrated circuits includes the following steps: providing a substrate; providing a whisker-containing layer made of aluminum metal or an aluminum alloy on the substrate; back-etching and/or resputtering the whisker-containing layer such that the whiskers are essentially removed; and structuring the whisker-free layer into the lines.

Abstract translation: 一种在集成电路中提供无晶须的铝金属线或铝合金线的方法包括以下步骤：提供基板; 在基板上提供由铝金属或铝合金制成的含晶须层; 背面蚀刻和/或重新溅射含晶须层，使得晶须基本上被除去; 并将不含晶须的层结构化成线。