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公开(公告)号：US09949408B2
公开(公告)日：2018-04-17
申请号：US15166551
申请日：2016-05-27
Applicant: Cisco Technology, Inc.
Inventor： Vic Chia , M. Baris Dogruoz
CPC classification number: H05K7/20736 , H05K7/20727 , H05K9/002 , H05K9/0041
Abstract: In one embodiment, an electromagnetic interference (EMI) shielding faceplate is configured to mount to a line-card slot of a multi-line-card electronic enclosure having an airflow cooling system. A perforation pattern in the faceplate defines an array of perforations in the faceplate, while a flow control sheet affixed to the faceplate and covering an adjustable percentage of the array of perforations in the faceplate from 0-100%, where an amount of airflow impedance caused by the perforations for the airflow cooling system is based on the percentage of the array of perforations covered by the flow control sheet.
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公开(公告)号：US20170347495A1
公开(公告)日：2017-11-30
申请号：US15166551
申请日：2016-05-27
Applicant: Cisco Technology, Inc.
Inventor： Vic Chia , M. Baris Dogruoz
CPC classification number: H05K7/20736 , H05K7/20727 , H05K9/002 , H05K9/0041
Abstract: In one embodiment, an electromagnetic interference (EMI) shielding faceplate is configured to mount to a line-card slot of a multi-line-card electronic enclosure having an airflow cooling system. A perforation pattern in the faceplate defines an array of perforations in the faceplate, while a flow control sheet affixed to the faceplate and covering an adjustable percentage of the array of perforations in the faceplate from 0-100%, where an amount of airflow impedance caused by the perforations for the airflow cooling system is based on the percentage of the array of perforations covered by the flow control sheet.
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公开(公告)号：US09379039B2
公开(公告)日：2016-06-28
申请号：US14018189
申请日：2013-09-04
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Mandy Hin Lam , Hong Tran Huynh , M. Baris Dogruoz
IPC: H05K7/20 , H01L23/473 , H01L23/40
CPC classification number: H01L23/473 , H01L23/4006 , H01L2023/405 , H01L2924/0002 , H01L2924/00
Abstract: An apparatus is provided that includes a planar heat conducting material that comprises a first heat sink conduction portion configured to conduct heat between a first integrated circuit and a first heat sink, a second heat sink conduction portion configured to conduct heat between a second integrated circuit and a second heat sink, and a thermal bridge portion configured to conduct heat between the first heat sink conduction portion and the second heat sink conduction portion, such that the thermal bridge portion allows for flexural compensation for a height difference between the first integrated circuit and the second integrated circuit.
Abstract translation: 提供了一种装置，其包括平面导热材料，其包括构造成在第一集成电路和第一散热器之间传导热量的第一散热器传导部分，第二散热器传导部分，被配置为在第二集成电路和 第二散热器和热桥部分，其构造成在第一散热器传导部分和第二散热器传导部分之间传导热量，使得热桥部分允许对第一集成电路和第二散热器传导部分之间的高度差进行挠曲补偿 第二集成电路。
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公开(公告)号：US12279399B2
公开(公告)日：2025-04-15
申请号：US17976276
申请日：2022-10-28
Applicant: Cisco Technology, Inc.
Inventor： M. Baris Dogruoz , Mandy Hin Lam , Mark Nowell , Rakesh Chopra
IPC: H05K7/20 , F28F13/00 , G02B6/42 , H01R13/514
Abstract: Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.
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公开(公告)号：US12156372B2
公开(公告)日：2024-11-26
申请号：US18178686
申请日：2023-03-06
Applicant: Cisco Technology, Inc.
Inventor： M. Baris Dogruoz , Mark Nowell , Yi Tang , Rakesh Chopra , Mandy Hin Lam
Abstract: In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.
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Patent Agency Ranking
公开(公告)号：US12038619B2
公开(公告)日：2024-07-16
申请号：US18187152
申请日：2023-03-21
Applicant: Cisco Technology, Inc.
Inventor： Joel Richard Goergen , Paolo Sironi , Giovanni Giobbio , M. Baris Dogruoz
CPC classification number: G02B6/428 , G02B6/4256 , G02B6/4261 , G02B6/4269 , H05K7/2039
Abstract: A housing for an electronic device includes a panel, where the panel includes a window. A cage includes a plurality of panels and a first end and a second end that opposes the first end. The cage further includes an opening at its first end and an enclosure disposed between the panels of the cage. Connecting structure is disposed at the first end of the cage, where the connecting structure secures the first end of the cage to the panel. The cage is suitably dimensioned to receive and retain a portion of a pluggable module within the enclosure when the pluggable module is inserted within the opening at the first end of the cage.
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公开(公告)号：US20230124658A1
公开(公告)日：2023-04-20
申请号：US17976276
申请日：2022-10-28
Applicant: Cisco Technology, Inc.
Inventor： M. Baris Dogruoz , Mandy Hin Lam , Mark Nowell , Rakesh Chopra
Abstract: Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.
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公开(公告)号：US11439041B2
公开(公告)日：2022-09-06
申请号：US16922383
申请日：2020-07-07
Applicant: Cisco Technology, Inc.
Inventor： Rakesh Chopra , M. Baris Dogruoz , Mark Nowell , Mandy Hin Lam
IPC: H01R13/00 , H05K7/20 , H05K7/14 , G02B6/42 , H01R13/518
Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.
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公开(公告)号：US20220239198A1
公开(公告)日：2022-07-28
申请号：US17156085
申请日：2021-01-22
Applicant: CISCO TECHNOLOGY, INC.
Inventor： M. Baris Dogruoz , Mark Nowell , Yi Tang , Rakesh Chopra , Mandy Hin Lam
Abstract: In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.
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公开(公告)号：US20220228820A1
公开(公告)日：2022-07-21
申请号：US17154785
申请日：2021-01-21
Applicant: CISCO TECHNOLOGY, INC.
Inventor： M. Baris Dogruoz , Mehmet Onder Cap , D. Brice Achkir , Joel Richard Goergen
Abstract: In one embodiment, a thermal management device includes a heat sink base and heat sink fins comprising a single element formed from a plurality of graphene layers with carbon nanotubes interposed between the graphene layers. A method is also disclosed herein.
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