公开(公告)号：US20200372231A1

公开(公告)日：2020-11-26

申请号：US16639309

申请日：2019-09-17

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yingming LIU ,  Haisheng WANG ,  Xiaoliang DING ,  Xiufeng LI ,  Pengpeng WANG ,  Chenyang ZHANG ,  Yaqian JI ,  Peixiao LI ,  Jing LIU ,  Ruituo WANG ,  Lei CHEN

IPC: G06K9/00 ,  H01L41/18

Abstract: A fingerprint identification module, a manufacturing method and driving method thereof, and a display device. The fingerprint identification module includes: a driving backplate, including a substrate, identification circuits on the substrate, the identification circuits having a first electrode pad, a second electrode pad; acoustic units including: a first electrode; a piezoelectric film layer positioned on the side, close to the driving backplate, of the first electrode; a second electrode positioned on the side, close to the driving backplate, of the piezoelectric film layer; a first lead-out terminal electrically connected with the first electrode; a second lead-out terminal electrically connected with the second electrode; cavities being in one-to-one correspondence to the acoustic units, the cavities positioned between the second electrodes and the substrate, and one side face, away from the substrate, of cavity being defined by at least one side face, close to the substrate, of the second electrode.