公开(公告)号：US20220128908A1

公开(公告)日：2022-04-28

申请号：US17436113

申请日：2020-02-06

Applicant: ASML NETHERLANDS B.V.

Inventor： Maialen LARRANAGA ,  Dimitra GKOROU ,  Faegheh HASIBI ,  Alexander YPMA

IPC: G03F7/20 ,  G06N20/00

Abstract: A method of extracting a feature from a data set includes iteratively extracting a feature from a data set based on a visualization of a residual pattern within the data set, wherein the feature is distinct from a feature extracted in a previous iteration, and the visualization of the residual pattern uses the feature extracted in the previous iteration. Visualizing the data set using the feature extracted in the previous iteration may include showing residual patterns of attribute data that are relevant to target data. Visualizing the data set using the feature extracted in the previous iteration may involve adding cluster constraints to the data set, based on the feature extracted in the previous iteration. Additionally or alternatively, visualizing the data set using the feature extracted in the previous iteration may involve defining conditional probabilities conditioned on the feature extracted in the previous iteration.

公开(公告)号：US20220083834A1

公开(公告)日：2022-03-17

申请号：US17423658

申请日：2019-12-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Faegheh HASIBI ,  Leon Paul VAN DIJK ,  Maialen LARRANAGA ,  Alexander YPMA ,  Richard Johannes Franciscu VAN HAREN

IPC: G06N3/04

Abstract: A method for predicting a property associated with a product unit. The method may include: obtaining a plurality of data sets, wherein each of the plurality of data sets includes data associated with a spatial distribution of a parameter across the product unit; representing each of the plurality of data sets as a multidimensional object; obtaining a convolutional neural network model trained with previously obtained multidimensional objects and properties of previous product units; and applying the convolutional neural network model to the plurality of multidimensional objects representing the plurality of data sets, to predict the property associated with the product unit.

公开(公告)号：US20220004108A1

公开(公告)日：2022-01-06

申请号：US17479078

申请日：2021-09-20

Applicant: ASML NETHERLANDS B.V.

Inventor： Jelle NIJE ,  Alexander YPMA ,  Dimitra GKOROU ,  Georgios TSIROGIANNIS ,  Robert Jan VAN WIJK ,  Tzu-Chao CHEN ,  Frans Reinier SPIERING ,  Sarathi ROY ,  Cédric Désiré GROUWSTRA

IPC: G03F7/20

Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.

公开(公告)号：US20210325788A1

公开(公告)日：2021-10-21

申请号：US17363057

申请日：2021-06-30

Applicant: ASML NETHERLANDS B.V.

Inventor： Alexander YPMA ,  Cyrus Emil TABERY ,  Simon Hendrik Celine VAN GORP ,  Chenxi LIN ,  Dag SONNTAG ,  Hakki Ergün CEKLI ,  Ruben ALVAREZ SANCHEZ ,  Shih-Chin LIU ,  Simon Philip Spencer HASTINGS ,  Boris MENCHTCHIKOV ,  Christiaan Theodoor DE RUITER ,  Peter TEN BERGE ,  Michael James LERCEL ,  Wei DUAN ,  Pierre-Yves Jerome Yvan GUITTET

IPC: G03F7/20

Abstract: A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical characteristic measurements from previously processed substrates and of process metrology data including measurements of at least one parameter related to the process characteristic measured from the previously processed substrates; obtaining process metrology data related to the substrate describing the at least one parameter; and predicting the electrical characteristic of the substrate based on the sensitivity and the process metrology data.

公开(公告)号：US20210157247A1

公开(公告)日：2021-05-27

申请号：US16493326

申请日：2018-04-09

Applicant: ASML NETHERLANDS B.V.

Inventor： Alexander YPMA ,  Vahid BASTANI ,  Dag SONNTAG ,  Jelle NIJE ,  Hakki Ergün CEKLI ,  Georgios TSIROGIANNIS ,  Robert Jan VAN WIJK

IPC: G03F7/20

Abstract: A method of maintaining a set of fingerprints representing variation of one or more process parameters across wafers subjected to a device manufacturing method, the method including: receiving measurement data of one or more parameters measured on wafers; updating the set of fingerprints based on an expected evolution of the one or more process parameters; and evaluation of the updated set of fingerprints based on decomposition of the received measurement data in terms of the updated set of fingerprints. Each fingerprint may have a stored likelihood of occurrence, and the decomposition may involve: estimating, based the received measurement data, likelihoods of occurrence of the set of fingerprints in the received measurement data; and updating the stored likelihoods of occurrence based on the estimated likelihoods.

公开(公告)号：US20200050180A1

公开(公告)日：2020-02-13

申请号：US16340771

申请日：2017-09-21

Applicant: ASML NETHERLANDS B.V.

Inventor： Weitian KOU ,  Alexander YPMA ,  Marc HAUPTMANN ,  Michiel KUPERS ,  Min-Sub HAN

IPC: G05B19/418

Abstract: A lithographic process is performed on a plurality of semiconductor substrates. The method includes selecting one or more of the substrates as one or more sample substrates. Metrology steps are performed only on the selected one or more sample substrates. Based on metrology results of the selected one or more sample substrates, corrections are defined for use in controlling processing of the substrates or of future substrates. The selection of the one or more sample substrates is based at least partly on statistical analysis of object data measured in relation to the substrates. The same object data or other data can be used for grouping substrates into groups. Selecting of one or more sample substrates can include selecting substrates that are identified by the statistical analysis as most representative of the substrates in their group and/or include elimination of one or more substrates that are identified as unrepresentative.