公开(公告)号：US10474033B2

公开(公告)日：2019-11-12

申请号：US15692087

申请日：2017-08-31

Applicant: Applied Materials, Inc.

Inventor： Viachslav Babayan ,  Douglas A. Buchberger, Jr. ,  Qiwei Liang ,  Ludovic Godet ,  Srinivas D. Nemani ,  Daniel J. Woodruff ,  Randy Harris ,  Robert B. Moore

IPC: G03D5/00 ,  G03F7/20 ,  H01L21/687 ,  G03F7/16 ,  G03F7/26 ,  G03F7/38

Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

公开(公告)号：US20180033673A1

公开(公告)日：2018-02-01

申请号：US15657190

申请日：2017-07-23

Applicant: APPLIED MATERIALS, INC.

Inventor： Srinivas D. Nemani ,  Shambhu N. Roy ,  Sultan Malik ,  Viachslav Babayan

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/02

CPC classification number: H01L21/68735 ,  H01L21/02274 ,  H01L21/67098 ,  H01L21/68742 ,  H01L21/68764 ,  H01L21/68785

Abstract: Embodiments of methods and apparatus for processing a substrate are provided herein. In some embodiments, a substrate support includes a base having a first support surface designed to support a substrate having a given width; a plurality of arcuate slots formed through the base; a corresponding plurality of lift pins disposed through the arcuate slots, wherein the lift pins are rotationally and vertically movable with respect to the base; and a cover plate disposed on but not coupled to the base to cover the first support surface, wherein the cover plate has a diameter greater than the given width, and wherein the cover plate includes a second support surface designed to support a substrate having the given width.

公开(公告)号：US09829790B2

公开(公告)日：2017-11-28

申请号：US14733923

申请日：2015-06-08

Applicant: Applied Materials, Inc.

Inventor： Douglas A. Buchberger, Jr. ,  Sang Ki Nam ,  Viachslav Babayan ,  Christine Y. Ouyang ,  Ludovic Godet ,  Srinivas D. Nemani

IPC: G03F7/20 ,  G03F7/004 ,  G03F7/38

CPC classification number: G03F7/0045 ,  G03F7/38 ,  G03F7/70 ,  G03F7/70866

Abstract: Methods disclosed herein provide apparatus and method for applying an electric field and/or a magnetic field to a photoresist layer without air gap intervention during photolithography processes. In one embodiment, an apparatus includes a processing chamber comprising a substrate support having a substrate supporting surface, a heat source embedded in the substrate support configured to heat a substrate positioned on the substrate supporting surface, an electrode assembly configured to generate an electric field in a direction substantially perpendicular to the substrate supporting surface, wherein the electrode assembly is positioned opposite the substrate supporting surface having a downward surface facing the substrate supporting surface, wherein the electrode assembly is spaced apart from substrate support defining a processing volume between the electrode assembly and the substrate supporting surface, and a confinement ring disposed on an edge of the substrate support or the electrode assembly configured to retain an intermediate medium.