公开(公告)号：US20220093362A1

公开(公告)日：2022-03-24

申请号：US17370619

申请日：2021-07-08

Applicant: Applied Materials, Inc.

Inventor： Joseph Frederick BEHNKE ,  Reyn Tetsuro WAKABAYASHI ,  Carlaton WONG ,  Timothy Joseph FRANKLIN ,  Joseph F. SOMMERS

IPC: H01J37/32

Abstract: Embodiments of showerheads are provided herein. In some embodiments, a showerhead assembly includes a chill plate comprising a gas plate and a cooling plate having an aluminum-silicon foil interlayer disposed therebetween for diffusion bonding the gas plate to the cooling plate and a heater plate comprising a first plate, a second plate, and a third plate, wherein an aluminum-silicon foil interlayer is disposed between the first plate and the cooling plate for diffusion bonding the first plate to the cooling plate, wherein an aluminum-silicon foil interlayer is disposed between the first plate and the second plate for diffusion bonding the first plate to the second plate, and wherein an aluminum-silicon foil interlayer is disposed between the second plate and the third plate for diffusion bonding the second plate to the third plate.

公开(公告)号：US20200370177A1

公开(公告)日：2020-11-26

申请号：US16876845

申请日：2020-05-18

Applicant: Applied Materials, Inc.

Inventor： Timothy Joseph FRANKLIN ,  Adam FISCHBACH ,  Edward HAYWOOD ,  Abhijit B. MALLICK ,  Pramit MANNA ,  Carlaton WONG ,  Stephen C. GARNER ,  Eswaranand VENKATASUBRAMANIAN

IPC: C23C16/458 ,  H01J37/32 ,  C23C16/46 ,  C23C16/455 ,  C23C16/50

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods utilized in the manufacture of semiconductor devices. More particularly, embodiments of the present disclosure relate to a substrate processing chamber, and components thereof, for forming semiconductor devices.