Abstract:
A MEMS airflow sensor die having a heater control circuit, differential instrumentation amplifier, temperature compensation, and/or offset correction circuitry integrated with an airflow sensor on the MEMS die. The added circuitry may be placed on space available on the basic airflow die with MEMS fabrication techniques without enlarging the sensor die. The die with the added circuitry may result in a device having a reduced form factor, improved reliability and lower cost.
Abstract:
Flow sensor assemblies having increased flow range capabilities are disclosed. In one illustrative embodiment, a flow sensor assembly includes a housing with an inlet flow port, an outlet flow port, and a fluid channel extending between the inlet flow port and the outlet flow port. One or more partitions are provided in the fluid channel of the housing to define two or more fluid sub-passages. A flow sensor, for sensing a measure related to a flow rate of a fluid flowing through the fluid channel, is positioned in one of the two or more fluid sub-passages. In some cases, the cross-sectional area of each of the two or more fluid sub-passages may be substantially the same, but this is not required. The housing may be formed from a single molded part defining the inlet and outlet flow ports, at least a portion of the fluid channel, and one or more of the partitions. In this case, a top cover may be provided and mounted to the housing to define the remaining portion of the fluid channel, if desired.
Abstract:
A flow sensor apparatus and method. A seal with a conductive interconnect is provided that includes a mass flow sense element mounted to a housing containing a thick film and/or thin film bridge structure for sensing media (e.g., mass flow) within a flow tube. The seal effectively isolates wirebond pads and electrical connections from the sensed media. The media, whether liquid or gas, can contain ionics that eventually contaminate the top of the mass flow sense element. The use of the seal with the conductive interconnect thus seals off the electrical connections and prevents exposure to the sensed media.
Abstract:
A pressure sensing apparatus (1) includes an elastically deformable pressure-sensitive diaphragm assembly (13) having a pressure-sensitive metal or metal alloy diaphragm (14). A functional filled dielectric layer (25) is on the diaphragm and includes a base dielectric material and at least one CTE raising filler. A CTE of the functional filled dielectric layer provides a CTE @ 800° C.≧8 ppm/° C., such as ≧10 ppm/° C. A plurality of piezoresistive elements (27) are on the functional filled dielectric layer (25).