公开(公告)号：US20080253924A1

公开(公告)日：2008-10-16

申请号：US10597568

申请日：2005-08-10

申请人： Keiichiro Oishi

发明人： Keiichiro Oishi

IPC分类号： C22C9/04 ,  C22C9/00 ,  B22D27/00

CPC分类号： C22C9/04 ,  B22D21/022 ,  B22D21/025 ,  B22D27/00 ,  C22C1/03 ,  C22C1/06 ,  C22C9/00 ,  C22C30/02 ,  C22C30/06 ,  C22F1/08

摘要： An advantage of the invention is to provide a master alloy used in a casting of a modified copper alloy, grains of which can be refined during a melt-solidification, and also a method of casting a modified copper alloy using the same.In order to achieve the advantage, master alloy for casting a copper alloy in a form of Cu: 40 to 80%, Zr: 0.5 to 35% and the balance of Zn; and Cu: 40 to 80%, Zr: 0.5 to 35%, P: 0.01 to 3% and the balance of Zn are used, and thus grain-refined copper alloy casting products are obtained.

摘要翻译： 本发明的一个优点是提供一种用于铸造熔融凝固时精炼的改性铜合金的母合金，以及使用该合金铸造改性铜合金的方法。 为了获得优势，用于铸造铜合金的母合金为Cu：40〜80％，Zr：0.5〜35％，余量为Zn; Cu：40〜80％，Zr：0.5〜35％，P：0.01〜3％，余量为Zn，得到精制铜合金铸件。

公开(公告)号：US20070169855A1

公开(公告)日：2007-07-26

申请号：US10597454

申请日：2005-08-10

申请人： Keiichiro Oishi

发明人： Keiichiro Oishi

IPC分类号： C22C9/04

CPC分类号： C22C9/04 ,  B22D21/022 ,  B22D21/025 ,  B22D27/00 ,  C22C1/03 ,  C22C1/06 ,  C22C9/00 ,  C22C30/02 ,  C22C30/06 ,  C22F1/08

摘要： Disclosed is a copper alloy. The copper alloy consists essentially of Cu : 69 to 88 mass %, Si : 2 to 5 mass %, Zr: 0.0005 to 0.04 mass %, P : 0.01 to 0.25 mass %, and Zn : balance; has relation of, in terms of a content of an element a, [a] mass %, f0=[Cu]−3.5[Si]−3[P]=61 to 71, f1=[P]/[Zr]=0.7 to 200, f2=[Si]/[Zr]=75 to 5000, and f3=[Si]/[P]=12 to 240; has a metal structure that contains α phase and, K phase and/or γ phase, and has relation of, in terms of a content of a phase b, [b]%, in an area rate, f4=[α]+[γ]+[K]≧85 and f5=[γ]+[K]+0.3[μ]−[β]=5 to 95; and has an average grain diameter of 200 μm or less in a macrostructure when melted and solidified.

摘要翻译： 公开了一种铜合金。 铜合金基本上由以下组成：Cu：69〜88质量％，Si：2〜5质量％，Zr：0.0005〜0.04质量％，P：0.01〜0.25质量％，Zn：余量; 关于元素a的含量，[a]质量％，f0 = [Cu] -3.5 [Si] -3 [P] = 61〜71，f1 = [P] / [Zr] = 0.7〜200，f2 = [Si] / [Zr] = 75〜5000，f3 = [Si] / [P] = 12〜240; 具有包含α相和K相和/或γ相的金属结构，并且以相对于b的含量[b]％的关系，以面积率f4 =α+ γ+ [K]> = 85，f5 =γ+ [K]+0.3μ-β= 5〜95; 并且当熔融固化时，在宏观结构中的平均粒径为200μm以下。

公开(公告)号：US20060260721A1

公开(公告)日：2006-11-23

申请号：US10529804

申请日：2003-09-19

申请人： Keiichiro Oishi

发明人： Keiichiro Oishi

IPC分类号： C22C9/06

CPC分类号： C22C9/06 ,  B23K35/302 ,  B23K2101/14 ,  B23K2103/12 ,  C21D9/50 ,  C22C9/02 ,  C22C9/04 ,  C22F1/08 ,  F28F21/085

摘要： The present invention discloses a heat resistance copper alloy material characterized in that said copper alloy material comprises 0.15 to 0.33 mass percent of Co, 0.041 to 0.089 mass percent of P, 0.02 to 0.25 mass percent of Sn, 0.01 to 0.40 mass percent of Zn and the remaining mass percent of Cu and inevitable impurities, wherein each content of Co, P, Sn and Zn satisfies the relationships 2.4≦([Co]−0.02)/[P]≦5.2 and 0.20≦[Co]+0.5[P]+0.9[Sn]+0.1[Zn]≦0.54, wherein [Co], [P], [Sn] and [Zn] are said mass percents of Co, P, Sn and Zn content, respectively; and said copper alloy material is a pipe, plate, bar, wire or worked material obtained by working said pipe, plate, bar or wire material into predetermined shapes.

摘要翻译： 本发明公开了一种耐热铜合金材料，其特征在于，所述铜合金材料包含Co：0.15〜0.33质量％，P：0.041〜0.089质量％，Sn：0.02〜0.25质量％，Zn：0.01〜0.40质量％ Co，P，Sn和Zn的各种含量满足2.4 <=（[Co] -0.02）/ [P] <= 5.2和0.20 <= [Co] +0.5的关系的Cu和不可避免的杂质的剩余质量百分比 [P] +0.9 [Sn] +0.1 [Zn] <= 0.54，其中[Co]，[P]，[Sn]和[Zn]分别是Co，P，Sn和Zn含量的质量百分比; 并且所述铜合金材料是通过将所述管，板，棒或线材加工成预定形状而获得的管，板，棒，线或加工材料。

公开(公告)号：US20050247381A1

公开(公告)日：2005-11-10

申请号：US11094815

申请日：2005-03-31

申请人： Keiichiro Oishi

发明人： Keiichiro Oishi

IPC分类号： C22C9/04 ,  C22F1/08

CPC分类号： C22C9/04 ,  C22F1/08

摘要： The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4 percent, by weight, of lead, and the remaining percent, by weight, of zinc.

摘要翻译： 根据本发明的自由切割铜合金与常规的自由切割铜合金相比含有大量的铅，但是提供了工业上令人满意的机械加工性。 该自由切割合金包含以重量计为69％至79％的铜，2.0％至4.0％重量的硅，0.02％至0.4％的铅，以及其余的重量百分比的锌。

公开(公告)号：US20050092401A1

公开(公告)日：2005-05-05

申请号：US11004879

申请日：2004-12-07

申请人： Keiichiro Oishi

发明人： Keiichiro Oishi

IPC分类号： C22C9/04 ,  C22F1/08 ,  C22C9/10

CPC分类号： C22C9/04 ,  C22F1/08

摘要： The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4, by weight, of lead, and the remaining percent, by weight, of zinc.

摘要翻译： 根据本发明的自由切割铜合金与常规的自由切割铜合金相比含有大量的铅，但是提供了工业上令人满意的机械加工性。 该自由切削合金包含69-79％（重量）的铜，2.0-4.0％（重量）的硅，0.02-0.4％（重量）的铅和剩余的锌的重量百分数。

公开(公告)号：US10017841B2

公开(公告)日：2018-07-10

申请号：US11573640

申请日：2005-08-10

申请人： Keiichiro Oishi

发明人： Keiichiro Oishi

IPC分类号： C22C9/04 ,  B22D21/02 ,  C22C1/06 ,  C22C30/02 ,  C22C30/06 ,  C22F1/08 ,  B22D27/00 ,  C22C1/03 ,  C22C9/00

CPC分类号： C22C9/04 ,  B22D21/022 ,  B22D21/025 ,  B22D27/00 ,  C22C1/03 ,  C22C1/06 ,  C22C9/00 ,  C22C30/02 ,  C22C30/06 ,  C22F1/08

摘要： Copper alloy casting contains Cu: 58-72.5 mass %; Zr: 0.0008-0.045 mass %; P: 0.01-0.25 mass %; one or more elements selected from Pb: 0.01-4 mass %, Bi: 0.01-3 mass %, Se: 0.03-1 mass %, and Te: 0.05-1.2 mass %; and Zn: a remainder, wherein [Cu]−3[P]+0.5([Pb]+[Bi]+[Se]+[Te])=60-90, [P]/[Zr]=0.5-120, and 0.05[γ]+([Pb]+[Bi]+[Se]+[Te])=0.45-4 (the content of an element ‘a’ is denoted as [a] mass %; the content of γ phase is denoted as [γ]% by area ratio; and an element ‘a’ that is not contained is denoted as [a]=0). The total content of α phase and γ phase is 85% or more, γ phase content is 25% or less by area ratio, and mean grain size in the macrostructure during melt-solidification is 250 μm or less.

公开(公告)号：US20110265917A1

公开(公告)日：2011-11-03

申请号：US13144057

申请日：2009-12-25

申请人： Keiichiro Oishi

发明人： Keiichiro Oishi

IPC分类号： C22F1/08 ,  C22C9/06 ,  C22C9/02

CPC分类号： H01B1/026 ,  C22C9/02 ,  C22C9/06 ,  C22F1/08

摘要： In a high-strength and high-electrical conductivity copper alloy rolled sheet, 0.14 to 0.34 mass % of Co, 0.046 to 0.098 mass % of P, 0.005 to 1.4 mass % of Sn are contained, [Co] mass % representing a Co content and [P] mass % representing a P content satisfy the relationship of 3.0≦([Co]−0.007)/([P]−0.009)≦5.9, a total cold rolling ratio is equal to or greater than 70%, a recrystallization ratio is equal to or less than 45% a an average grain size of recrystallized grains is in the range of 0.7 to 7 μm, an average grain diameter of precipitates is in the range of 2.0 to 11 nm, and an average grain size of fine crystals is in the range of 0.3 to 4 μm. By the precipitates of Co and P, the solid solution of Sn, and fine crystals, the strength, conductivity and ductility of the copper alloy rolled sheet are improved.

摘要翻译： 在高强度高导电性铜合金轧制板中，Co：0.14〜0.34质量％，P：0.046〜0.098质量％，Sn：0.005〜1.4质量％，[Co]质量％表示Co含量 以及表示P含量的[P]质量％满足3.0＆nlE（[Co] -0.007）/（[P] -0.009）＆nlE; 5.9的关系，总冷轧比等于或大于70％ 再结晶比等于或小于45％，再结晶晶粒的平均晶粒尺寸在0.7〜7μm的范围内，析出物的平均粒径在2.0〜11nm的范围内，平均粒径 的细晶体在0.3〜4μm的范围内。 通过Co和P的析出，提高了Sn，和细晶体的固溶体对铜合金轧制板的强度，导电性和延展性。

公开(公告)号：US20110265916A1

公开(公告)日：2011-11-03

申请号：US13144034

申请日：2009-12-25

申请人： Keiichiro Oishi

发明人： Keiichiro Oishi

IPC分类号： C22F1/08 ,  C22C9/04 ,  C22C9/06 ,  C21D11/00 ,  C22C9/02

CPC分类号： H01B1/026 ,  C22C9/02 ,  C22C9/06 ,  C22F1/08

摘要： A high-strength and high-electrical conductivity copper alloy rolled sheet has an alloy composition containing 0.14 to 0.34 mass % of Co, 0.046 to 0.098 mass % of P, 0.005 to 1.4 mass % of Sn and the balance including Cu and inevitable impurities, wherein [Co] mass % representing a Co content and [P] mass % representing a P content satisfy the relationship of 3.0≦([Co]−0.007)/([P]−0.009)≦5.9. In a metal structure, precipitates are formed, the shape of the precipitates is substantially circular or elliptical, the precipitates have an average grain diameter of 1.5 to 9.0 nm, or 90% or more of all the precipitates have a diameter of 15 nm or less to be fine precipitates, and the precipitates are uniformly dispersed. With the precipitation of the fine precipitates of Co and P and the solid-solution of Sn, the strength, conductivity and heat resistance are improved and a reduction in costs is realized.

摘要翻译： 高强度高导电性铜合金轧制板的合金组成为：Co：0.14〜0.34质量％，P：0.046〜0.098质量％，Sn：0.005〜1.4质量％，余量：Cu和不可避免的杂质; 其中表示Co含量的[Co]质量％和表示P含量的[P]质量％满足3.0＆nlE的关系（[Co] -0.007）/（[P] -0.009）＆nlE; 5.9。 在金属结构中，形成析出物，析出物的形状为大致圆形或椭圆形，析出物的平均粒径为1.5〜9.0nm，所有析出物的直径为15nm以下的90％以上 为微细析出物，析出物均匀分散。 随着Co和P的微细析出物和Sn的固溶体的析出，提高了强度，导电性和耐热性，并且实现了成本的降低。

公开(公告)号：US07909946B2

公开(公告)日：2011-03-22

申请号：US10597454

申请日：2005-08-10

申请人： Keiichiro Oishi

发明人： Keiichiro Oishi

IPC分类号： C22C9/04

CPC分类号： C22C9/04 ,  B22D21/022 ,  B22D21/025 ,  B22D27/00 ,  C22C1/03 ,  C22C1/06 ,  C22C9/00 ,  C22C30/02 ,  C22C30/06 ,  C22F1/08

摘要： A copper alloy consists essentially of Cu: 69 to 88 mass %, Si: 2 to 5 mass %, Zr: 0.0005 to 0.04 mass %, P: 0.01 to 0.25 mass %, and Zn: balance; has relation of, in terms of content of element a, [a] mass %, f0=[Cu]−3.5[Si]−3[P]=61 to 71, f1=[P]/[Zr]=0.7 to 200, f2=[Si]/[Zr]=75 to 5000, and f3=[Si]/[P]=12 to 240; has a metal structure containing α phase and, K phase and/or γ phase, and has relation of, in terms of a content of phase b, [b]%, in an area rate, f4=[α]+[γ]+[K]≧85 and f5=[γ]+[K]+0.3[μ]−[β]=5 to 95; and has an average grain diameter of 200 μm or less in a macrostructure when melted and solidified.

摘要翻译： 铜合金主要由Cu：69〜88质量％，Si：2〜5质量％，Zr：0.0005〜0.04质量％，P：0.01〜0.25质量％，Zn：余量组成。 根据元素a的含量，[a]质量％，f0 = [Cu] -3.5 [Si] -3 [P] = 61〜71，f1 = [P] / [Zr] = 0.7〜 200，f2 = [Si] / [Zr] = 75〜5000，f3 = [Si] / [P] = 12〜240; 具有包含α相和K相和/或γ相的金属结构，并且根据b相的含量[b]％，以面积率f4 = [α] + [γ] + [K]≥85且f5 = [γ] + [K] +0.3 [μ] - [＆bgr]] = 5〜95; 并且当熔融固化时，在宏观结构中的平均粒径为200μm以下。

公开(公告)号：US20110056596A1

公开(公告)日：2011-03-10

申请号：US12514680

申请日：2008-11-10

申请人： Keiichiro Oishi

发明人： Keiichiro Oishi

IPC分类号： C22F1/08 ,  C22C9/02 ,  B21C1/00

CPC分类号： F28F21/085 ,  B21C1/003 ,  B21C23/002 ,  B21C23/085 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/06 ,  C22F1/08 ,  Y10T428/12

摘要： A high strength and high thermal conductivity copper alloy tube contains: Co of 0.12 to 0.32 mass %; P of 0.042 to 0.095 mass %; and Sn of 0.005 to 0.30 mass %, wherein a relationship of 3.0≦([Co]−0.007)/([P]−0.008)≦6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P, and the remainder includes Cu and inevitable impurities. Even when a temperature is increased by heat generated by a drawing process, a recrystallization temperature is increased by uniform precipitation of a compound of Co and P and by solid-solution of Sn. Thus, the generation of recrystallization nucleuses is delayed, thereby improving heat resistance and pressure resistance of the high strength and high thermal conductivity copper alloy tube.

摘要翻译： 高强度高导热铜合金管含有：Co：0.12〜0.32质量％ P为0.042〜0.095质量％ 和0.005〜0.30质量％的Sn，其中Co的含量[Co]质量％和含量[Co]的含量[Co]质量％满足3.0＆nlE;（[Co] -0.007）/（[P] -0.008）＆nlE; P]质量％，余量包括Cu和不可避免的杂质。 即使当通过拉伸工艺产生的热量升高温度时，通过使Co和P的化合物和Sn的固溶体均匀沉淀，再结晶温度升高。 因此，再结晶核的产生被延迟，从而提高高强度和高导热性铜合金管的耐热性和耐压性。