公开(公告)号：US11508894B2

公开(公告)日：2022-11-22

申请号：US16959249

申请日：2019-01-17

Applicant: LG INNOTEK CO., LTD.

Inventor： Myoung Seok Sung

IPC: H01L35/32 ,  H01L35/16 ,  H01L35/34 ,  H01S5/02216 ,  H01S5/024

Abstract: One embodiment discloses a thermoelectric element comprising: a first substrate; a plurality of thermoelectric legs disposed on the first substrate; a second substrate disposed on the plurality of thermoelectric legs above the first substrate; electrodes including a plurality of first electrodes disposed between the first substrate and the plurality of thermoelectric legs and a plurality of second electrodes disposed between the second substrate and the plurality of thermoelectric legs; and a first reinforcing part disposed on the lower surface and a portion of the side surface of the first substrate.

公开(公告)号：US11502236B1

公开(公告)日：2022-11-15

申请号：US17214128

申请日：2021-03-26

Applicant: Apple Inc.

Inventor： Michael J. Bishop ,  Gregory L. Tice ,  Mario J. Costello ,  Reid A. Black ,  Vijay M. Iyer

IPC: H01L35/32 ,  H01L35/16 ,  G05D23/19 ,  H01L35/34 ,  H01L35/18

Abstract: This disclosure relates to an integrated thermoelectric cooler and methods for forming thereof. The integrated thermoelectric cooler can include a plurality of thermoelectric rods located between the detector substrate and a system interposer. The detector substrate and the system interposer can directly contact ends of the thermoelectric rods. The integrated thermoelectric cooler can be formed by forming the plurality of thermoelectric rods on reels, for example, and the plurality of thermoelectric rods can be thinned down to a certain height. The thermoelectric rods can be transferred and bonded to the system substrate. An overmold can be formed around the plurality of thermoelectric rods. The height of the overmold and thermoelectric rods can be thinned down to another height. The thermoelectric rods can be bonded to the detector substrate. In some examples, the overmold can be removed.

公开(公告)号：US11482655B2

公开(公告)日：2022-10-25

申请号：US17284492

申请日：2019-08-21

Applicant: Korea University Research and Business Foundation

Inventor： Hyo Jae Yoon ,  Sohyun Park

IPC: H01L35/32 ,  G01N25/18 ,  H01L35/20 ,  H01L35/34

Abstract: The present invention relates to a thermoelectric measurement system based on a liquid eutectic gallium-indium electrode, whereby thermoelectric performance can be measured with excellent efficiency and high reproducibility even without construction of expensive equipment, various organic molecules as well as large-area molecular layers can be measured, and various thermoelectric materials, such as inorganic materials and inorganic-organic composite materials, can be measured. In addition, non-toxic liquid metal EGaIn is used as an upper electrode, so the damage to even a substance of measurement in the form of a nano-level thin film can be minimized, and the measurement of thermoelectric performance can be performed on even nano- to micro-level organic thermoelectric elements. Therefore, the thermoelectric measurement system is widely utilized across the thermoelectric element industry.

公开(公告)号：US20220328746A1

公开(公告)日：2022-10-13

申请号：US17606858

申请日：2020-04-13

Applicant: GCE Institute Inc.

Inventor： Hiroshi GOTO ,  Minoru SAKATA

IPC: H01L35/10 ,  H01L35/34 ,  H01L37/00

Abstract: A power generation element includes: a substrate including mutually opposed first and second principal surfaces; an electrode portion provided on the first principal surface and the second principal surface, the electrode portion including a first electrode portion and a second electrode portion; and an intermediate portion including nanoparticles. The substrate includes a first substrate portion and a second substrate portion that are mutually overlapped viewed in a first direction. The first principal surface of the first substrate portion includes a first separated surface and a first joint surface. The second principal surface of the second substrate portion includes a second separated surface and a second joint surface.

公开(公告)号：US20220320408A1

公开(公告)日：2022-10-06

申请号：US17326136

申请日：2021-05-20

Applicant: Baker Hughes Oilfield Operations LLC

Inventor： Navin Sakthivel ,  Aaron Avagliano ,  Chad Yates

IPC: H01L35/32 ,  H01L35/16 ,  H01L35/22 ,  H01L35/34

Abstract: An enclosure for a thermoelectric generator may include bonded particles of an allotrope of carbon, such as diamond particles, graphene particles, and/or carbon nanotube particles. A thermoelectric generator system may include one or more thermoelectric generators positioned at least partially within the enclosure. The enclosure may be manufactured using an additive manufacturing process which may include providing particles of an allotrope of carbon, and selectively binding a portion of the particles with a binder material. The bound particles may then be sintered to form the enclosure.

公开(公告)号：US11462672B2

公开(公告)日：2022-10-04

申请号：US15725726

申请日：2017-10-05

Applicant: II-VI DELAWARE, INC.

Inventor： Joshua E. Moczygemba

IPC: H01L35/32 ,  H01L35/34

Abstract: A system comprises a thermoelectric device, and a baseplate coupled to a first side of the thermoelectric device. The system also comprises a band coupled to the baseplate and a container. The band may be adjustable in a circumference and configured to thermally couple the baseplate and the container.

公开(公告)号：US11444231B2

公开(公告)日：2022-09-13

申请号：US15435591

申请日：2017-02-17

Applicant: LAWRENCE LIVERMORE NATIONAL SECURITY, LLC

Inventor： Joseph C. Farmer ,  James Kaschmitter

IPC: H01L35/32 ,  H01L35/10 ,  H01L35/34

Abstract: An energy harvesting system for collecting energy from sources of thermal energy that exist in the environment and convert the energy to electricity. The system has N-P junctions mounted on the outer surface of a conduit, pipe or flue. A hot medium flows through the conduit, pipe or flue. The p-n junctions operate as thermoelectric power generators. Heat absorbed at the p-n junctions increases the kinetic energy of charge carriers causing migration of the charge carriers. This thermally-driven migration of charge carriers is used to drive an electrical current in an external circuit.

公开(公告)号：US11444230B2

公开(公告)日：2022-09-13

申请号：US17117187

申请日：2020-12-10

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hiromasa Tamaki ,  Tsutomu Kanno ,  Hiroki Sato

IPC: H01L31/18 ,  H01L35/18 ,  H01L35/28 ,  H01L35/30 ,  H01L35/34

Abstract: A thermoelectric conversion material has a composition represented by the chemical formula Li3-aBi1-bSib, in which the range of values a and b is: 0≤a≤0.0001, and −a+0.0003≤b≤0.023; 0.0001≤a

公开(公告)号：US20220278264A1

公开(公告)日：2022-09-01

申请号：US17675219

申请日：2022-02-18

Applicant: The Hong Kong University of Science and Technology

Inventor： Baoling HUANG ,  Cheng CHI ,  Gongze Liu

IPC: H01L35/32 ,  H01L35/34

Abstract: One or more devices, systems, apparatuses, methods of manufacture and/or methods of use to facilitate thermal sensing in a field related to thermal radiation are envisioned. In one embodiment, an ionic thermoelectric thermal radiation sensor, comprises a substrate, an ionic thermoelectric sensing unit arranged on the substrate and comprising ionically conductive and electrically insulating material, wherein the ionic thermoelectric sensing unit is a voltage-producing unit having first and second surfaces spaced apart from and disposed opposite to one other, wherein the ionic thermoelectric sensing unit produces voltage via thermal diffusion of ions or via the Soret effect under a temperature difference between the first and second surfaces, a thermal radiation absorber that generates heat when exposed to thermal radiation, and one or more electrical connectors that connect the first and second surface.

公开(公告)号：US20220256711A1

公开(公告)日：2022-08-11

申请号：US17668799

申请日：2022-02-10

Applicant: The Regents of the University of Colorado, a body corporate

Inventor： Jianliang Xiao ,  Yan Sun ,  Wei Ren

IPC: H05K1/18 ,  H01L25/04 ,  H05K1/02 ,  H01L35/34 ,  H01L35/32

Abstract: Soft motherboards having rigid plugin modules are described herein. In one aspect of the present disclosure, an electronic device can include a polymeric substrate having: a plurality of slots, each configured for receiving an electronic module; one or more electrical junctions including a stretchable conductive interconnect electronically coupling a slot to another slot of the plurality of slots; and at least one electronic module including: a film configured to: support other components of the electronic module; and be inserted, and be partially housed in, one of the plurality of slots of the polymeric substrate; and at least one electrode coupled to the film and positioned to be in contact with a corresponding electrical junction of the polymeric substrate when the film is partially housed in the polymeric substrate.