Abstract:
Materials bonded together are separated using electrical current, thermal stresses, mechanical force, any combination of the above methods, or any other application or removal of energy until the bonds disappear and the materials are separated. In one embodiment the original bonding was composed of two layers of material. In another embodiment, the sandwich was composed of three layers. In a further embodiment, the parts of the sandwich are firmly maintained in their respective positions during the application of current so as to be able to subsequently align the materials relative to one another.
Abstract:
In accordance with the invention, improved vacuum microtube devices are provided with arrangements for tunably spacing the gate and the cathode. Tuning can be effected by using an electrostatic or magnetic actuator to move the gate on a spring or a rail. Advantageously a feedback arrangement can be used to control the spacing. Magnetic reassembly components can be provided for facilitating release of tube components in fabrication.