公开(公告)号：US06828543B1

公开(公告)日：2004-12-07

申请号：US10662432

申请日：2003-09-16

Applicant: Wen-Ching Chen

Inventor： Wen-Ching Chen

IPC: H01L2700

CPC classification number: H01L27/14625 ,  H01L23/49805 ,  H01L27/14618 ,  H01L27/14634 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/361 ,  H01L2924/00

Abstract: An image sense module includes a semi-conductor image sense chip having a top face attached to a bottom face of a glass plate and multiple electric contacts formed on the semi-conductor image sense chip. A conductive interconnection circuit is formed on the bottom face of the glass plate. The conductive interconnection circuit has multiple first solder points each electrically connected to a corresponding one of the electric contacts of the semi-conductor image sense chip and multiple second solder points formed on one side of the glass plate. A lens set is secured on the glass plate. The lens set includes a holder perpendicularly attached to a top face of the glass plate and having a skirt downward extending from the holder. A channel is defined in one side of the skirt for allowing the conductive interconnection circuit extending through the holder.

Abstract translation: 图像感测模块包括半导体图像感测芯片，其具有附接到玻璃板的底面的顶面和形成在半导体图像感测芯片上的多个电触点。 导电互连电路形成在玻璃板的底面上。 导电互连电路具有多个第一焊接点，每个第一焊接点电连接到形成在玻璃板的一侧上的半导体图像感测芯片的电触点中的相应一个电触点和多个第二焊接点。 透镜组固定在玻璃板上。 透镜组包括垂直地附接到玻璃板的顶面并具有从保持器向下延伸的裙部的支架。 通道限定在裙部的一侧，以允许导电互连电路延伸穿过支架。