公开(公告)号：US20150228563A1

公开(公告)日：2015-08-13

申请号：US14691690

申请日：2015-04-21

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng@ Eugene Lee ,  Sueann Lim Wei Fen ,  Sarel Bin Ismail

IPC: H01L23/495

CPC classification number: H01L23/49541 ,  H01L21/4821 ,  H01L21/4842 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3157 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/5328 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/27312 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/83862 ,  H01L2224/85439 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/0665 ,  H01L2924/00

Abstract: A lead frame device may include an integral die pad member, two separate finger members, a central body portion, each of the finger members have a top and a bottom surface connected by a peripheral edge surface. The lead frame also has a first ear portion, and a second ear portion, each has an ear top surface and an ear bottom surface coplanar with the top surface and bottom surface of the central body portion. The lead frame also has a first longitudinally extending groove and second longitudinally extending groove separate the first ear portion and the second ear portion from the central portion. The first ear portion and the second ear portion each have an abutment surface.

Abstract translation: 引线框架装置可以包括整体的管芯焊盘部件，两个单独的指状部件，中心主体部分，每个指状部件具有通过周边边缘表面连接的顶部和底部表面。 引线框架还具有第一耳部和第二耳部，每个耳部具有与中心主体部分的顶表面和底表面共面的耳顶表面和耳底表面。 引线框架还具有第一纵向延伸的凹槽和第二纵向延伸凹槽，其将第一耳部和第二耳部从中心部分分开。 第一耳部和第二耳部各自具有邻接表面。

公开(公告)号：US20150108626A1

公开(公告)日：2015-04-23

申请号：US14581006

申请日：2014-12-23

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng@ Eugene Lee ,  You Chye How

IPC: H01L23/495 ,  H01L21/48

CPC classification number: H01L21/4828 ,  H01L21/4825 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/97 ,  H01L2924/181 ,  H01L2924/00

Abstract: A multilevel leadframe for an integrated circuit package is provided that has a plurality of lead lines formed in a first level and bond pads formed in a second level. A first set of bond pads is arranged in a first row and are separated from an adjacent bond pad by a bond pad clearance distance. A second set of bond pads is arranged in second row adjacent the first row of bond pads. Each bond pad in the second row may be connected to one of the plurality of lead lines on the first level that is routed between adjacent bond pads in the first row. Since the bond pads in the first row are on a different level then the lead lines, the bond pads may be spaced close together.

Abstract translation: 提供了一种用于集成电路封装的多级引线框架，其具有形成在第一级中的多条引线和形成在第二级中的接合焊盘。 第一组接合焊盘被布置在第一行中并且通过接合焊盘间隙距离与相邻接合焊盘分开。 第二组接合焊盘被布置在与第一排接合焊盘相邻的第二行中。 第二行中的每个接合焊盘可以连接到在第一级中的相邻接合焊盘之间路由的第一级上的多条引线之一。 由于第一行中的接合焊盘处于不同的电平，所以引线，接合焊盘可以彼此靠近地间隔开。

公开(公告)号：US20170053814A1

公开(公告)日：2017-02-23

申请号：US15340837

申请日：2016-11-01

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sueann Lim Wei Fen ,  Lee Han Meng@ Eugene Lee ,  Anis Fauzi Bin Abdul Aziz

IPC: H01L21/56 ,  H01L21/48

CPC classification number: H01L21/561 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/563 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49052 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/8346 ,  H01L2224/85439 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2224/85 ,  H01L2224/83

Abstract: A semiconductor device has a leadframe with a first (401a) and a parallel second surface, and an assembly pad (410) bordered by two opposing sides, which include a plurality of through-holes (420) from the first to the second pad surface. Another pad side includes one or more elongated windows (421) between the pad surfaces. The second pad surface includes a plurality of grooves. The leadframe further has a plurality of leads (430) with opposite elongated sides castellated by indents (431). Layers (440) of bondable metals are restricted to localized areas surrounding bond spots. A semiconductor chip (450) is attached to the pad and wire-bonded (460) to the bond spots. A package (470) encapsulates the chip, wires, pad, and lead portions, and secures the leadframe into the package by filling the through-holes, windows, grooves, and indents.

Abstract translation: 半导体器件具有带有第一（401a）和平行的第二表面的引线框和由两个相对的边界定的组装焊盘（410），其包括从第一焊盘表面到第二焊盘表面的多个通孔（420） 。 另一衬垫侧包括在垫表面之间的一个或多个细长窗（421）。 第二垫表面包括多个槽。 引线框还具有多个引线（430），其具有由凹口（431）铸造的相对的细长边。 可焊接金属层（440）限于粘结点附近的局部区域。 将半导体芯片（450）附接到焊盘并且引线键合（460）到接合点。 封装（470）封装芯片，电线，焊盘和引线部分，并且通过填充通孔，窗口，凹槽和凹口来将引线框固定到封装中。

公开(公告)号：US20170025332A1

公开(公告)日：2017-01-26

申请号：US15287561

申请日：2016-10-06

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng@ Eugene Lee ,  Anis Fauzi Bin Abdul Aziz ,  Sueann Lim Wei Fen

IPC: H01L23/495 ,  H01L23/31 ,  H01L51/56 ,  H01L21/48

CPC classification number: H01L23/49551 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49586 ,  H01L23/49589 ,  H01L51/56 ,  H01L2224/97

Abstract: A leadframe (100) for electronic systems comprising a first sub-leadframe (110) connected by links (150) to a second sub-leadframe (120), the first and second sub-leadframe connected by tiebars (111, 121) to a frame (130); and each link having a neck (151) suitable for bending the link, the necks arrayed in a line (170) operable as the axis for bending the second sub-leadframe towards the first sub-leadframe with the necks operable as rotation pivots.

Abstract translation: 一种用于电子系统的引线框架（100），包括通过链接（150）连接到第二子引线框架（120）的第一子引线框架（110），所述第一和第二子引线框架通过连杆（111,121）连接到 框架（130）; 并且每个连杆具有适于弯曲所述连杆的颈部（151），所述颈部排列成可操作为用于使所述颈部可操作为旋转枢轴的所述第二子引线框架朝向所述第一子引线框架弯曲的轴线的线（170）。

公开(公告)号：US09515009B2

公开(公告)日：2016-12-06

申请号：US14592011

申请日：2015-01-08

Applicant: Texas Instruments Incorporated

Inventor： Sueann Lim Wei Fen ,  Lee Han Meng@ Eugene Lee ,  Anis Fauzi Bin Abdul Aziz

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L21/561 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/563 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49052 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/8346 ,  H01L2224/85439 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2224/85 ,  H01L2224/83

Abstract: A semiconductor device has a leadframe with a first (401a) and a parallel second surface, and an assembly pad (410) bordered by two opposing sides, which include a plurality of through-holes (420) from the first to the second pad surface. Another pad side includes one or more elongated windows (421) between the pad surfaces. The second pad surface includes a plurality of grooves. The leadframe further has a plurality of leads (430) with opposite elongated sides castellated by indents (431). Layers (440) of bondable metals are restricted to localized areas surrounding bond spots. A semiconductor chip (450) is attached to the pad and wire-bonded (460) to the bond spots. A package (470) encapsulates the chip, wires, pad, and lead portions, and secures the leadframe into the package by filling the through-holes, windows, grooves, and indents.

Abstract translation: 半导体器件具有带有第一（401a）和平行的第二表面的引线框和由两个相对的边界定的组装焊盘（410），其包括从第一焊盘表面到第二焊盘表面的多个通孔（420） 。 另一衬垫侧包括在垫表面之间的一个或多个细长窗（421）。 第二垫表面包括多个槽。 引线框还具有多个引线（430），其具有由凹口（431）铸造的相对的细长边。 可焊接金属层（440）限于粘结点附近的局部区域。 将半导体芯片（450）附接到焊盘并且引线键合（460）到接合点。 封装（470）封装芯片，电线，焊盘和引线部分，并且通过填充通孔，窗口，凹槽和凹口来将引线框固定到封装中。

公开(公告)号：US09184119B2

公开(公告)日：2015-11-10

申请号：US14691690

申请日：2015-04-21

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng@ Eugene Lee ,  Sueann Lim Wei Fen ,  Sarel Bin Ismail

IPC: H01L23/495

CPC classification number: H01L23/49541 ,  H01L21/4821 ,  H01L21/4842 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3157 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/5328 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/27312 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/83862 ,  H01L2224/85439 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/0665 ,  H01L2924/00

Abstract: A lead frame device may include an integral die pad member, two separate finger members, a central body portion, each of the finger members have a top and a bottom surface connected by a peripheral edge surface. The lead frame also has a first ear portion, and a second ear portion, each has an ear top surface and an ear bottom surface coplanar with the top surface and bottom surface of the central body portion. The lead frame also has a first longitudinally extending groove and second longitudinally extending groove separate the first ear portion and the second ear portion from the central portion. The first ear portion and the second ear portion each have an abutment surface.

Abstract translation: 引线框架装置可以包括整体的管芯焊盘部件，两个单独的指状部件，中心主体部分，每个指状部件具有通过周边边缘表面连接的顶部和底部表面。 引线框架还具有第一耳部和第二耳部，每个耳部具有与中心主体部分的顶表面和底表面共面的耳顶表面和耳底表面。 引线框架还具有第一纵向延伸的凹槽和第二纵向延伸凹槽，其将第一耳部和第二耳部从中心部分分开。 第一耳部和第二耳部各自具有邻接表面。

公开(公告)号：US20150243641A1

公开(公告)日：2015-08-27

申请号：US14706052

申请日：2015-05-07

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng@ Eugene Lee ,  Anis Fauzi bin Abdul Aziz ,  Yien Sien Khoo

IPC: H01L25/00 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56 ,  H01L25/16 ,  H01L23/495

CPC classification number: H01L25/50 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/165 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16245 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/8121 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83815 ,  H01L2224/97 ,  H01L2924/12 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/81

Abstract: A method of making an integrated circuit (IC) package including electrically and physically attaching a die to an interposer, attaching the interposer to a bottom leadframe, attaching a discrete circuit component to the interposer and attaching a top leadframe to the bottom leadframe.

Abstract translation: 一种制造集成电路（IC）封装的方法，所述集成电路（IC）封装包括将裸片电连接和物理附接到插入器，将所述插入件附接到底部引线框架，将分立电路部件附接到所述插入器并将顶部引线框架附接到所述底部引线框架。

公开(公告)号：US20140346656A1

公开(公告)日：2014-11-27

申请号：US13902916

申请日：2013-05-27

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng@ Eugene Lee ,  You Chye How

IPC: H01L23/495

CPC classification number: H01L21/4828 ,  H01L21/4825 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/97 ,  H01L2924/181 ,  H01L2924/00

Abstract: A multilevel leadframe for an integrated circuit package is provided that has a plurality of lead lines formed in a first level and bond pads formed in a second level. A first set of bond pads is arranged in a first row and are separated from an adjacent bond pad by a bond pad clearance distance. A second set of bond pads is arranged in second row adjacent the first row of bond pads. Each bond pad in the second row may be connected to one of the plurality of lead lines on the first level that is routed between adjacent bond pads in the first row. Since the bond pads in the first row are on a different level then the lead lines, the bond pads may be spaced close together.

Abstract translation: 提供了一种用于集成电路封装的多级引线框架，其具有形成在第一级中的多条引线和形成在第二级中的接合焊盘。 第一组接合焊盘被布置在第一行中并且通过接合焊盘间隙距离与相邻接合焊盘分开。 第二组接合焊盘被布置在与第一排接合焊盘相邻的第二行中。 第二行中的每个接合焊盘可以连接到在第一级中的相邻接合焊盘之间路由的第一级上的多条引线之一。 由于第一行中的接合焊盘处于不同的电平，所以引线，接合焊盘可以彼此靠近地间隔开。

公开(公告)号：US20210074613A1

公开(公告)日：2021-03-11

申请号：US16953189

申请日：2020-11-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Lee Han Meng@ Eugene Lee ,  Anis Fauzi Bin Abdul Aziz ,  Wei Fen, Sueann Lim

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L51/56

Abstract: A leadframe for electronic systems comprising a first sub-leadframe connected by links to a second sub-leadframe, the first and second sub-leadframe connected by tiebars to a frame; and each link having a neck suitable for bending the link, the necks arrayed in a line operable as the axis for bending the second sub-leadframe towards the first sub-leadframe with the necks operable as rotation pivots.

公开(公告)号：US10804114B2

公开(公告)日：2020-10-13

申请号：US15138298

申请日：2016-04-26

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng@ Eugene Lee ,  You Chye How

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

Abstract: A method for forming a multilevel leadframe for an integrated circuit is provided. A conductive sheet is etched from one side to form a thinner region within a frame region for leads lines and bond pads. The conductive sheet is etched to form a plurality of bond pads in a first level of the thinner region arranged in at least a first row and a second row. Each bond pad has a pad width and is separated from an adjacent bond pad by a bond pad clearance distance. The conductive sheet is etched from an opposite side to form a plurality of lead lines in a second level of the thinner region having a line width and is separated from an adjacent lead line by at least a lead line clearance distance. Each bond pad of the second plurality of bond pads is connected to one of the plurality of lead lines on the second level that is routed between adjacent bond pads in the first row, so that the lead lines are routed on a different level from the bond pads.