公开(公告)号：US20220181223A1

公开(公告)日：2022-06-09

申请号：US17116936

申请日：2020-12-09

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK

IPC: H01L23/16 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

Abstract: In some examples, a semiconductor package comprises a semiconductor die; an operational component on an active surface of the semiconductor die; and a cover coupled to the active surface of the semiconductor die and covering the operational component. The cover comprises a monolithic structure including a vertical portion and a horizontal portion. A hollow area is between the cover and the operational component. The package also includes a mold compound covering the semiconductor die and the cover.

公开(公告)号：US20220155109A1

公开(公告)日：2022-05-19

申请号：US16950981

申请日：2020-11-18

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Christopher Daniel MANACK ,  Leslie Edward STARK

IPC: G01D11/24 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56

Abstract: In examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a ring encircling the sensor. The sensor and an inner surface of the ring are exposed to an exterior environment of the sensor package. The sensor package includes a mold compound covering the semiconductor die and abutting an outer surface of the ring.