公开(公告)号：US20150126128A1

公开(公告)日：2015-05-07

申请号：US14575391

申请日：2014-12-18

Applicant: Silicon Laboratories Inc.

Inventor： John B. Youngblood ,  Guner Arslan ,  J.A. Bolton ,  Trenton J. Grale ,  Vitor Pereira ,  Jeffrey A. Tindle ,  David S. Trager ,  Yan Zhou

IPC: H04B15/00

CPC classification number: H04B15/00

Abstract: Die-to-die communication links for receiver integrated circuit dies within multi-die systems and related methods are disclosed for radio frequency (RF) receivers. The disclosed embodiments provide die-to-die communication links that allow for direct communication of operating parameters between receiver integrated circuit dies and other integrated circuit dies within a multi-die system so that the operation of receive path circuitry can be adjusted without requiring intervention from an external host processor integrated circuit. A variety of operating parameter information can be communicated through the die-to-die communication links so that the integrated circuit dies can quickly adjust to changing signal conditions without requiring intervention by the external host processor integrated circuit.

Abstract translation: 针对射频（RF）接收机公开了用于多芯片系统内的接收机集成电路管芯的模 - 模通信链路和相关方法。 所公开的实施例提供了允许在多管芯系统内的接收器集成电路管芯与其他集成电路管芯之间的操作参数的直接通信的管芯到管芯通信链路，使得可以调整接收路径电路的操作，而无需干预 外部主机处理器集成电路。 可以通过管芯到管芯通信链路传送各种操作参数信息，使得集成电路管芯可以快速地适应不断变化的信号条件，而不需要外部主机处理器集成电路的干预。