公开(公告)号：US09123871B1

公开(公告)日：2015-09-01

申请号：US14516548

申请日：2014-10-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Nam Goo Cha ,  Yong Min Kwon ,  Kyoung Jun Kim

IPC: H01L33/48 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/16 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/94 ,  H01L2933/0033 ,  H01L2933/0066

Abstract: A method of manufacturing a light emitting diode (LED) package may include forming a light emitting structure having a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer on a growth substrate, forming first and second electrodes connected to the first and second conductivity-type semiconductor layers, respectively, bonding a first surface of a light transmissive substrate opposite to a second surface thereof to the light emitting structure, identifying positions of the first and second electrodes that are seen through the second surface of the light transmissive substrate, forming one or more through holes in the light transmissive substrate to correspond to the first and second electrodes, and forming first and second via electrodes by filling the through holes with a conductive material.

Abstract translation: 制造发光二极管（LED）封装的方法可以包括在生长衬底上形成具有第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构，形成连接的第一和第二电极 分别将第一和第二导电型半导体层与其第二表面相反的第一表面与发光结构接合，识别通过第二表面的第二表面的第一和第二电极的位置 所述透光基板在所述透光基板中形成一个或多个通孔，以对应于所述第一和第二电极，以及通过用导电材料填充所述通孔来形成第一和第二通孔电极。