公开(公告)号：US20210272930A1

公开(公告)日：2021-09-02

申请号：US17021112

申请日：2020-09-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YUN SEOK CHOI

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/48 ,  H01L23/31 ,  H01L23/367

Abstract: A semiconductor package includes an upper substrate having a first surface and a second surface which are opposite to each other, a lower semiconductor chip disposed on the first surface of the upper substrate, a plurality of conductive pillars disposed on the first surface of the upper substrate at at least one side of the lower semiconductor chip, and an upper semiconductor chip disposed on the second surface of the upper substrate. The lower semiconductor chip and the plurality of conductive pillars are connected to the first surface of the upper substrate, and the upper semiconductor chip is connected to the second surface of the upper substrate.