公开(公告)号：US20190133464A1

公开(公告)日：2019-05-09

申请号：US16146897

申请日：2018-09-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ram Fish ,  James Schuessler ,  Julien Penders ,  Lindsay Brown ,  Frank Settemo Nuovo ,  Sheldon George Phillips ,  Tom Torfs

IPC: A61B5/0205 ,  A61B5/00 ,  A61B5/1455

Abstract: Exemplary embodiments comprise a modular sensor platform, comprising: a base module comprising, a display, a processor, a memory and a communication interface; a band removably coupled to the base module such that the band is replaceable with different types of bands; and a sensor module that collects data from a user, the sensor module in communication with the base module and removably coupled to the band such that the sensor module is replaceable with different types of sensor modules, the sensor module further comprising a plurality of sensor units that are removably coupled to the sensor module such that individual sensor units are replaceable with different types of sensor units.

公开(公告)号：USD734682S1

公开(公告)日：2015-07-21

申请号：US29491664

申请日：2014-05-22

Applicant: Samsung Electronics Co., Ltd.

Designer： Sheldon George Phillips ,  Frank Nuovo ,  Tom Torfs

公开(公告)号：USD730220S1

公开(公告)日：2015-05-26

申请号：US29491649

申请日：2014-05-22

Applicant: Samsung Electronics Co., Ltd.

Designer： Sheldon George Phillips ,  Frank Nuovo ,  Joseph J Kopp, Jr. ,  Tom Torfs ,  Lindsay Brown ,  Seulki Lee

公开(公告)号：USD729669S1

公开(公告)日：2015-05-19

申请号：US29491667

申请日：2014-05-22

Applicant: Samsung Electronics Co., Ltd.

Designer： Sheldon George Phillips ,  Frank Nuovo ,  Tom Torfs