APPARATUS AND METHOD FOR PROVIDING SCREEN MIRRORING SERVICE
    11.
    发明申请
    APPARATUS AND METHOD FOR PROVIDING SCREEN MIRRORING SERVICE 审中-公开
    提供筛选服务的装置和方法

    公开(公告)号:US20160253142A1

    公开(公告)日:2016-09-01

    申请号:US15054817

    申请日:2016-02-26

    Abstract: An apparatus and method for providing a screen mirroring service. The apparatus includes a communication unit for connecting to an external device; and a control unit for generating a plurality of screen data, transmitting one of the plurality of screen data to the external device, and controlling the screen data being transmitted to the external device according to a control signal received from the external device.

    Abstract translation: 一种用于提供屏幕镜像服务的装置和方法。 该装置包括用于连接到外部设备的通信单元; 以及控制单元,用于生成多个屏幕数据,将多个屏幕数据中的一个发送到外部设备,并根据从外部设备接收的控制信号来控制正在发送到外部设备的屏幕数据。

    METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE
    13.
    发明申请
    METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE 有权
    制造发光装置的方法

    公开(公告)号:US20140227814A1

    公开(公告)日:2014-08-14

    申请号:US14253478

    申请日:2014-04-15

    Abstract: An LED includes a compound semiconductor structure having first and second compound layers and an active layer, first and second electrode layers atop the second compound semiconductor layer and connected to respective compound layers. An insulating layer is coated in regions other than where the first and second electrode layers are located. A conducting adhesive layer is formed atop the non-conductive substrate, connecting the same to the first electrode layer and insulating layer. Formed on one side surface of the non-conductive substrate and adhesive layer is a first electrode connection layer connected to the conducting adhesive layer. A second electrode connection layer formed on another side surface is connected to the second electrode layer. By forming connection layers on respective side surfaces of the light-emitting device, manufacturing costs can be reduced.

    Abstract translation: LED包括具有第一和第二化合物层和有源层的化合物半导体结构,位于第二化合物半导体层顶部并连接到各个化合物层的第一和第二电极层。 绝缘层涂覆在不同于第一和第二电极层所在的区域中。 导电性粘合剂层形成在非导电性基板的顶部,将其连接到第一电极层和绝缘层。 形成在非导电性基板的一个侧面上的粘合层是与导电性粘合剂层连接的第一电极连接层。 形成在另一个侧表面上的第二电极连接层连接到第二电极层。 通过在发光装置的相应侧表面上形成连接层,可以降低制造成本。

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