公开(公告)号：US20220171284A1

公开(公告)日：2022-06-02

申请号：US17238355

申请日：2021-04-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunkyung LEE ,  Sumin KIM ,  Hyunwoo KIM ,  Juhyeon PARK ,  Giyoung SONG ,  Sukkoo HONG ,  Yoonhyun KWAK ,  Youngmin NAM ,  Byunghee SOHN ,  Sunyoung LEE ,  Aram JEON ,  Sungwon CHOI

IPC: G03F7/004 ,  G03F7/038 ,  G03F7/039 ,  C07C381/12 ,  C07C309/12 ,  C07D333/76

Abstract: Disclosed are a photoacid generator, a photoresist composition including the same, and a method of preparing the photoacid generator. The photoacid generator may include a compound represented by Formula 1: wherein, in Formula 1, CY, A1, A2, and B are respectively described in the specification.

公开(公告)号：US20210240078A1

公开(公告)日：2021-08-05

申请号：US17005636

申请日：2020-08-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sumin KIM ,  Hyunwoo KIM ,  Sukkoo HONG ,  Yechan KIM ,  Juyoung KIM ,  Jinjoo KIM ,  Juhyeon PARK ,  Hyunji SONG ,  Songse YI

IPC: G03F7/004 ,  C07C381/12 ,  C07C309/12 ,  G03F7/039

Abstract: A photo-decomposable compound includes an anion component including an adamantyl group and a cation component including a C5 to C40 cyclic hydrocarbon group and forming a complex with the anion component. At least one of the adamantyl group and the cyclic hydrocarbon group has a substituent, which decomposes by acid and generates an alkali soluble group. The substituent includes an acid-labile protecting group. A photoresist composition includes a chemically amplified polymer, the photo-decomposable compound, and a solvent. To manufacture an integrated circuit (IC) device, a photoresist film is formed using the photoresist composition on a feature layer, a first area of the photoresist film is exposed to generate a plurality of acids from the photo-decomposable compound in the first area, the chemically amplified polymer is deprotected due to the plurality of acids, and the first area is removed to form a photoresist pattern.