公开(公告)号：US20220293580A1

公开(公告)日：2022-09-15

申请号：US17505040

申请日：2021-10-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangcheon PARK ,  Youngmin LEE

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/48 ,  H01L23/544 ,  H01L23/522

Abstract: A semiconductor package includes: a first semiconductor chip including a plurality of front surface pads disposed on a first active surface of a first semiconductor substrate, at least one penetrating electrode penetrating at least a portion of the first semiconductor substrate and connected to the front surface pads, a first rear surface cover layer disposed on a first inactive surface of the first semiconductor substrate, a first rear surface dummy conductive layer penetrating a portion of the first rear surface cover layer; a second semiconductor chip including a second front surface cover layer disposed on a second active surface of a second semiconductor substrate, and a second front surface dummy conductive layer penetrating a portion of the second front surface cover layer; and at least one first bonded pad penetrating the first rear surface cover layer and the second front surface cover layer.