公开(公告)号：US20160306491A1

公开(公告)日：2016-10-20

申请号：US15095413

申请日：2016-04-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Jun LEE ,  Min Jung KIM ,  Won HUH

IPC: G06F3/041 ,  G06K9/00 ,  G06F3/0484 ,  G06F3/0488 ,  G06F3/0346 ,  G06F3/02 ,  G06F3/0481 ,  G06F3/16 ,  G06F3/0482

CPC classification number: G06F3/0416 ,  G06F3/02 ,  G06F3/0346 ,  G06F3/0412 ,  G06F3/0418 ,  G06F3/04817 ,  G06F3/0482 ,  G06F3/04842 ,  G06F3/04845 ,  G06F3/04847 ,  G06F3/0488 ,  G06F3/04883 ,  G06F3/16 ,  G06F2203/0338 ,  G06K9/00006

Abstract: A method and electronic device are provided. The electronic device includes a first touch sensor and a processor. The processor implements the method, which includes detecting, via a first touch sensor of the electronic device, sensor information from a touch object, determining, via a processor of the electronic device, a state of the touch object based on analysis of the detected sensor information, and adjusting a touch sensitivity for the electronic device according to the determined state of the object.

Abstract translation: 提供了一种方法和电子设备。 电子设备包括第一触摸传感器和处理器。 处理器实现该方法，其包括经由电子设备的第一触摸传感器检测来自触摸对象的传感器信息，基于所检测到的传感器的分析，经由电子设备的处理器确定触摸对象的状态 信息，并且根据所确定的对象的状态来调整电子设备的触摸灵敏度。

公开(公告)号：US20140299906A1

公开(公告)日：2014-10-09

申请号：US14310664

申请日：2014-06-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hak Hwan KIM ,  Min Jung KIM ,  Kyung Mi MOON ,  Jong Sup SONG ,  Jae Sung YOU ,  Ill Heoung CHOI ,  Cheol Jun YOO

IPC: H01L33/62 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L21/568 ,  H01L33/505 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/15153 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2224/83

Abstract: A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.

Abstract translation: 提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片 的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。