公开(公告)号：US20170346306A1

公开(公告)日：2017-11-30

申请号：US15494722

申请日：2017-04-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ku-Chul JUNG ,  Sanghyun RYU ,  Chulwoo PARK ,  Kwangsub LEE

IPC: H02J7/00 ,  H04W88/02

Abstract: An electronic device and a method thereof are provided. The electronic device includes a memory, a battery, a charging circuit for charging the battery using current supplied from a power supply device, a slew rate variable circuit electrically connected to the charging circuit, and a processor electrically connected to the memory, the battery, the charging circuit, and the slew rate variable circuit. The processor is configured to control the charging circuit to control the charging of the battery, to monitor a state of the electronic device during battery charging, and to control the slew rate variable circuit based on the state of the electronic device to change a slew rate related to the battery charging.

公开(公告)号：US20150264842A1

公开(公告)日：2015-09-17

申请号：US14640520

申请日：2015-03-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghoon SONG ,  Jungje BANG ,  Kwangsub LEE ,  Saebom LEE ,  Seyoung JANG ,  Younoh CHI

IPC: H05K9/00 ,  H05K13/04 ,  H05K5/02

CPC classification number: H05K7/20445 ,  H01L23/42 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/12044 ,  H05K9/0032 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

Abstract: A shield can for electromagnetic shielding is provided. The shield can includes a shield cover having a bump protruding laterally therefrom, and a shield frame having a connecting part for selectively fixing the bump at a first height or a second height such that the shield frame is fastened to the shield cover. An electronic device includes a substrate, an internal device mounted on the substrate, and the shield can. The shield cover is located over the internal device, and the shield frame is formed vertically on the substrate to surround the internal device.

Abstract translation: 提供屏蔽可用于电磁屏蔽。 屏蔽件可以包括具有从其侧向突出的凸块的屏蔽盖，以及具有用于在第一高度或第二高度选择性地固定凸块的连接部分的屏蔽框架，使得屏蔽框架被紧固到屏蔽盖。 电子设备包括基板，安装在基板上的内部装置和屏蔽罐。 屏蔽盖位于内部设备上方，屏蔽框架垂直形成在基板上，以围绕内部设备。