公开(公告)号：US20250054825A1

公开(公告)日：2025-02-13

申请号：US18427051

申请日：2024-01-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehyun LIM ,  Youngjun Yoon ,  Yechung Chung ,  Inho Choi

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L23/64 ,  H01L25/18

Abstract: An embodiment provides a semiconductor package including: a substrate having a first surface and a second surface disposed in an opposite direction to the first surface; a semiconductor chip disposed on at least one surface of the substrate; an electronic device disposed on the second surface of the substrate; a first molding layer disposed on the first surface of the substrate; and a second molding layer disposed on the second surface of the substrate, wherein the second molding layer has an open hole that exposes at least a portion of the electronic device to the outside, and a material of the second molding layer is located on an inner surface of the open hole.