公开(公告)号：US20140146448A1

公开(公告)日：2014-05-29

申请号：US14038946

申请日：2013-09-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun-Seok YOO ,  Dong-Wook KIM ,  Jae-Chul JIN ,  Won-Young HUR

IPC: H05K13/00 ,  H05K7/14 ,  H05K5/02

CPC classification number: B29C45/14336 ,  B29C45/14311 ,  B29C45/14786 ,  B29C45/14811 ,  B29C2045/14237 ,  B29C2045/14319 ,  B29K2069/00 ,  B29K2105/0872 ,  B29K2669/00 ,  B29L2031/3437 ,  B29L2031/3481 ,  G06F1/1635 ,  G06F1/1658 ,  G06F1/181 ,  H04M1/0249 ,  H04M1/0252 ,  H05K5/0217 ,  H05K13/00

Abstract: Provided is a method of manufacturing a housing of an electronic device. The method includes manufacturing a housing body by successively stacking a composite material sheet with a plastic sheet applied to at least one surface of a top and a bottom surfaces of the composite material sheet and molding a plastic injection-molded product on the plastic sheet of the housing body through insert molding to connectively affix the composite material sheet with the housing body and the plastic sheet.

Abstract translation: 提供一种制造电子设备的外壳的方法。 该方法包括通过将复合材料片连续地堆叠在复合材料片的顶表面和底表面的至少一个表面上的塑料片上，并将塑料注塑产品模塑在塑料片的塑料片上 壳体通过插入成型连接地将复合材料片与壳体和塑料片粘合。