公开(公告)号：US09818699B2

公开(公告)日：2017-11-14

申请号：US15065850

申请日：2016-03-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Ja Kim ,  Bongchan Kim

IPC: H05K9/00 ,  H05K13/00 ,  H01L23/552 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3128 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2224/85

Abstract: Provided is a method of fabricating a semiconductor package. The method includes providing a substrate including a plurality of semiconductor chips; forming a mold layer covering the semiconductor chips; forming a first shielding layer on the mold layer; cutting the mold layer and the first shielding layer to form trenches between the semiconductor chips; and forming a second shielding layer to fill the trenches.